JP5963450B2 - 撮像装置および撮像システム - Google Patents

撮像装置および撮像システム Download PDF

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Publication number
JP5963450B2
JP5963450B2 JP2012008202A JP2012008202A JP5963450B2 JP 5963450 B2 JP5963450 B2 JP 5963450B2 JP 2012008202 A JP2012008202 A JP 2012008202A JP 2012008202 A JP2012008202 A JP 2012008202A JP 5963450 B2 JP5963450 B2 JP 5963450B2
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Japan
Prior art keywords
photoelectric conversion
conversion unit
transistor
power supply
conductive member
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JP2012008202A
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English (en)
Japanese (ja)
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JP2013149742A5 (enExample
JP2013149742A (ja
Inventor
和田 洋一
洋一 和田
小林 昌弘
昌弘 小林
道子 ジョンソン
道子 ジョンソン
宏政 坪井
宏政 坪井
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012008202A priority Critical patent/JP5963450B2/ja
Priority to US13/742,142 priority patent/US8780244B2/en
Priority to CN201310017553.3A priority patent/CN103219345B/zh
Publication of JP2013149742A publication Critical patent/JP2013149742A/ja
Publication of JP2013149742A5 publication Critical patent/JP2013149742A5/ja
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2012008202A 2012-01-18 2012-01-18 撮像装置および撮像システム Active JP5963450B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012008202A JP5963450B2 (ja) 2012-01-18 2012-01-18 撮像装置および撮像システム
US13/742,142 US8780244B2 (en) 2012-01-18 2013-01-15 Image pickup apparatus and image pickup system
CN201310017553.3A CN103219345B (zh) 2012-01-18 2013-01-17 图像拾取装置和图像拾取系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012008202A JP5963450B2 (ja) 2012-01-18 2012-01-18 撮像装置および撮像システム

Publications (3)

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JP2013149742A JP2013149742A (ja) 2013-08-01
JP2013149742A5 JP2013149742A5 (enExample) 2015-03-05
JP5963450B2 true JP5963450B2 (ja) 2016-08-03

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Family Applications (1)

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JP2012008202A Active JP5963450B2 (ja) 2012-01-18 2012-01-18 撮像装置および撮像システム

Country Status (3)

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US (1) US8780244B2 (enExample)
JP (1) JP5963450B2 (enExample)
CN (1) CN103219345B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6121837B2 (ja) * 2013-08-02 2017-04-26 ソニーセミコンダクタソリューションズ株式会社 撮像素子
JP6537838B2 (ja) 2015-01-30 2019-07-03 ルネサスエレクトロニクス株式会社 撮像素子
CN104767944B (zh) * 2015-04-14 2017-12-22 中国电子科技集团公司第四十四研究所 能提高输出一致性的多抽头emccd放大电路
JP2017045873A (ja) * 2015-08-27 2017-03-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2017059563A (ja) * 2015-09-14 2017-03-23 ルネサスエレクトロニクス株式会社 撮像素子
JP2017120975A (ja) * 2015-12-28 2017-07-06 ルネサスエレクトロニクス株式会社 撮像素子
JP6776079B2 (ja) * 2016-09-27 2020-10-28 東芝情報システム株式会社 固体撮像素子及びその製造方法
JP2018113521A (ja) * 2017-01-10 2018-07-19 キヤノン株式会社 固体撮像装置及び撮像システム
WO2018207345A1 (ja) * 2017-05-12 2018-11-15 オリンパス株式会社 固体撮像装置
US11955494B2 (en) 2019-05-21 2024-04-09 Sony Semiconductor Solutions Corporation Power supply contact sharing for imaging devices
KR20250026251A (ko) * 2022-06-24 2025-02-25 소니 세미컨덕터 솔루션즈 가부시키가이샤 촬상 소자 및 촬상 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9505305D0 (en) * 1995-03-16 1995-05-03 Philips Electronics Uk Ltd Electronic devices comprising an array
US6160281A (en) * 1997-02-28 2000-12-12 Eastman Kodak Company Active pixel sensor with inter-pixel function sharing
US6977684B1 (en) * 1998-04-30 2005-12-20 Canon Kabushiki Kaisha Arrangement of circuits in pixels, each circuit shared by a plurality of pixels, in image sensing apparatus
JP2001250931A (ja) 2000-03-07 2001-09-14 Canon Inc 固体撮像装置およびこれを用いた撮像システム
JP4500434B2 (ja) * 2000-11-28 2010-07-14 キヤノン株式会社 撮像装置及び撮像システム、並びに撮像方法
JP2004241498A (ja) * 2003-02-04 2004-08-26 Mitsubishi Electric Corp 固体撮像素子とその動作方法
JP3794637B2 (ja) * 2003-03-07 2006-07-05 松下電器産業株式会社 固体撮像装置
US7755116B2 (en) * 2004-12-30 2010-07-13 Ess Technology, Inc. Method and apparatus for controlling charge transfer in CMOS sensors with an implant by the transfer gate
JP4752447B2 (ja) * 2005-10-21 2011-08-17 ソニー株式会社 固体撮像装置およびカメラ
JP3996618B1 (ja) * 2006-05-11 2007-10-24 総吉 廣津 半導体撮像素子
JP4759590B2 (ja) * 2008-05-09 2011-08-31 キヤノン株式会社 光電変換装置及びそれを用いた撮像システム
JP5408954B2 (ja) * 2008-10-17 2014-02-05 キヤノン株式会社 撮像装置、及び撮像システム
JP2010273095A (ja) * 2009-05-21 2010-12-02 Renesas Electronics Corp 撮像装置

Also Published As

Publication number Publication date
JP2013149742A (ja) 2013-08-01
CN103219345B (zh) 2015-12-02
US8780244B2 (en) 2014-07-15
CN103219345A (zh) 2013-07-24
US20130182159A1 (en) 2013-07-18

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