JP5959724B2 - 研磨パッドの製造方法 - Google Patents
研磨パッドの製造方法 Download PDFInfo
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- JP5959724B2 JP5959724B2 JP2015508847A JP2015508847A JP5959724B2 JP 5959724 B2 JP5959724 B2 JP 5959724B2 JP 2015508847 A JP2015508847 A JP 2015508847A JP 2015508847 A JP2015508847 A JP 2015508847A JP 5959724 B2 JP5959724 B2 JP 5959724B2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/16—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for close-grained structure, i.e. of high density
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
第二、ポリウレタンマトリックスの組成を変更しなくてはフォアサイズと密度を変えることがとても難しく、
第三、純粋ポリウレタンマトリックスの場合ダイヤモンドディスクでコンディショニング時に摩耗がよくできない問題点によってフォアグレイジング(pore glazing)のような現象(フォアが塞がる現象)が発生するという問題点がある。
5lの4口フラスコにポリテトラメチレングリコール(分子量1000)1600gを投入し、100〜130℃の温度でスチレン単量体400gと開始剤(AIBN)微量を徐徐に投入し、化学的な反応(重合)を誘導してポリテトラメチレングリコール内に均一な微細粒子生成及び分散されるようにする。均一な微細有機粒子が分散されたポリテトラメチレングリコールの粘度は1,700cPs(25℃)であった。
実験例1の均一な微細有機粒子が分散されたポリテドラメチレングリコール(分子量1000)120g、トルエンジイソシアネート52gを投入して70〜80℃の温度で4〜5時間反応させて最終製品のNCO含量を9.0%とした。
キャスティングマシーンを利用して実験例2のイソシアネート予備重合体とMOCA(ウレタン硬化剤の一種である)(混合割合10:3)の反応を誘導し、これと同時に混合物にガスの注入を実施する。ガスが注入された混合物は、80℃四角の鋳型に投入されて略30分間ゲル化させた後100℃オーブンで20時間の間に硬化させた。製造された硬化物を鋳型から取り出して表面を裁断して研磨パッド100の研磨層120を製造した。
110 支持層
120 研磨層
141、142 多孔性フォア
160 研磨層表面
Claims (4)
- 研磨層形成物質を混合させて化学的反応によって固相化させて研磨パッドを製造する方法において、
(a)前記研磨層形成物質に微細有機粒子生成用単量体を含ませて撹拌過程を経て前記単量体らの重合反応によって微細有機粒子を形成及び分散させる段階と、
(b)前記(a)段階の混合物にフォアサイズコントロールが可能な不活性気体、カプセル型発泡剤、化学的発泡剤のうちで少なくとも何れか一つを混合して、気相フォアを形成する段階と、
(c)前記(b)段階を通じて生成された混合物をゲル化及び硬化させて研磨層を製造する段階と、
(d)前記研磨層を加工して表面に気相フォアの開放による気孔らを分布させる段階と、を含むことを特徴とする研磨パッドの製造方法。 - 前記微細有機粒子は、ポリエチレン樹脂、ポリプロピレン樹脂、ポリスチレン樹脂、ポリビニルクロライド樹脂、ポリアミド樹脂、アクリル樹脂、ポリウレタン樹脂、ポリカーボネート樹脂、フェノール樹脂、アミノ樹脂、エポキシ樹脂、尿素樹脂、ポリエステル樹脂、ゴム(Rubber)ABS(acrylonitrile butadiene styrene copolymer)、SAN(Styrene Acrylonitrile Copolymers)のうちで選択される少なくとも何れか一つで構成されることを特徴とする請求項1に記載の研磨パッドの製造方法。
- 前記不活性気体は、周期律表8族元素と、前記研磨層形成物質と反応しない気体のうちで選択されることを特徴とする請求項1に記載の研磨パッドの製造方法。
- 前記研磨層に液状微細要素が形成されるようにする液状物質を前記研磨層形成物質に含ませる段階をさらに含むことを特徴とする請求項1に記載の研磨パッドの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0054523 | 2012-05-23 | ||
KR1020120054523A KR101417274B1 (ko) | 2012-05-23 | 2012-05-23 | 연마패드 및 그 제조방법 |
PCT/KR2013/001085 WO2013176378A1 (ko) | 2012-05-23 | 2013-02-12 | 연마패드 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2015514598A JP2015514598A (ja) | 2015-05-21 |
JP5959724B2 true JP5959724B2 (ja) | 2016-08-02 |
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JP2015508847A Active JP5959724B2 (ja) | 2012-05-23 | 2013-02-12 | 研磨パッドの製造方法 |
Country Status (7)
Country | Link |
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US (1) | US20150133039A1 (ja) |
EP (1) | EP2853350A4 (ja) |
JP (1) | JP5959724B2 (ja) |
KR (1) | KR101417274B1 (ja) |
CN (1) | CN104507641B (ja) |
SG (1) | SG11201407257TA (ja) |
WO (1) | WO2013176378A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112014003158B4 (de) | 2013-07-05 | 2022-12-15 | Asahi Kasei Chemicals Corporation | Elektrisches Bauteil, umfassend ein Isolierharz-Formteil, sowie Verfahren zur Stabilisierung der Flammhemmung |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104802099B (zh) * | 2015-05-04 | 2017-07-21 | 华侨大学 | 一种具有大容屑腔的磨块、其制备方法及应用 |
JP6444507B2 (ja) * | 2016-04-06 | 2018-12-26 | ケーピーエックス ケミカル カンパニー リミテッド | 研磨パッドの製造方法 |
KR101894071B1 (ko) | 2016-11-03 | 2018-08-31 | 에스케이씨 주식회사 | 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법 |
KR102608960B1 (ko) * | 2016-12-05 | 2023-12-01 | 삼성전자주식회사 | 집적회로 소자 제조용 연마 패드의 제조 방법 |
KR102088919B1 (ko) * | 2017-09-11 | 2020-03-13 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
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- 2013-02-12 US US14/397,542 patent/US20150133039A1/en not_active Abandoned
- 2013-02-12 EP EP13793745.4A patent/EP2853350A4/en not_active Withdrawn
- 2013-02-12 CN CN201380025329.7A patent/CN104507641B/zh active Active
- 2013-02-12 WO PCT/KR2013/001085 patent/WO2013176378A1/ko active Application Filing
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DE112014003158B4 (de) | 2013-07-05 | 2022-12-15 | Asahi Kasei Chemicals Corporation | Elektrisches Bauteil, umfassend ein Isolierharz-Formteil, sowie Verfahren zur Stabilisierung der Flammhemmung |
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CN104507641B (zh) | 2018-01-05 |
CN104507641A (zh) | 2015-04-08 |
EP2853350A1 (en) | 2015-04-01 |
KR20130130893A (ko) | 2013-12-03 |
KR101417274B1 (ko) | 2014-07-09 |
EP2853350A4 (en) | 2016-01-13 |
JP2015514598A (ja) | 2015-05-21 |
WO2013176378A1 (ko) | 2013-11-28 |
SG11201407257TA (en) | 2014-12-30 |
US20150133039A1 (en) | 2015-05-14 |
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