SG11201407257TA - Polishing pad and method for manufacturing same - Google Patents

Polishing pad and method for manufacturing same

Info

Publication number
SG11201407257TA
SG11201407257TA SG11201407257TA SG11201407257TA SG11201407257TA SG 11201407257T A SG11201407257T A SG 11201407257TA SG 11201407257T A SG11201407257T A SG 11201407257TA SG 11201407257T A SG11201407257T A SG 11201407257TA SG 11201407257T A SG11201407257T A SG 11201407257TA
Authority
SG
Singapore
Prior art keywords
lllll
seoul
polishing
llll
ulsan
Prior art date
Application number
SG11201407257TA
Inventor
Bong-Su Ahn
Young-Jun Jang
Jin-Su Jeong
Sang-Mok Lee
Kee-Cheon Song
Seung-Geun Kim
Jang-Won Seo
Jeong-Seon Choo
Hak-Su Kang
Gyoung-Pyo Kong
Original Assignee
Kpx Chemical Co Ltd
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kpx Chemical Co Ltd, Samsung Electronics Co Ltd filed Critical Kpx Chemical Co Ltd
Publication of SG11201407257TA publication Critical patent/SG11201407257TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B24D3/16—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for close-grained structure, i.e. of high density
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

(43) ^1^711 \"Q 2013 Vil 11 -?! 28 (28.11.2013) Wl PO I P CT (10) WO 2013/176378 A1 (51) ^1^^: B24D 11/00 (2006.01) B24D 3/16 (2006.01) (21) PCT/KR2013/001085 (22) 2013 ^2 € 12 H (12.02.2013) (25) #€SH: (26) iMISH: (30) 10-2012-0054523 2012 ^ 5 € 23 (23.05.2012) H KR (71) #€\"?!: (KPX CHEMIC­ AL CO., LTD.) [KR/KR]; 121-805 *i-ir*l ^ ^ 473 KPX \'1 Sj 15 % , Seoul (KR). (SAMSUNG ELECTRONICS CO., LTD.) [KR/KR]; 443-742 ^7]£ =r€ l A #^3. 129, Gyeong- gi-do (KR). (72) SHf- ^ 4 (AHN, Bong-Su); 143-190 ^1^1 T 1 5] ^ 2 A 803 S., Seoul (KR). ^ir (JANG, Young-Jun); 443-706 7] £ -?-[ '-] \"fj n J-I¥ 3*1 1 109-207, Gyeonggi-do (KR). (JEONG, Jin-Su); 121-040 7-1^1 £S)-¥ 1 104-406, Seoul (KR). (LEE, Sang-Mok); 121-775 43 ^1 108-1802, Seoul (KR). ^71^ (SONG, Kee-Cheon); 680-042 VYr °>-§- 2 789-6 302-1101, Ulsan (KR). (KIM, Seung-Geun); 680-842 o]:-g- 2 ^ 789-6 102-1305, Ulsan (KR). (SEO, Jang-Won); 612-712 §11^ T 1 l^lf 1200 3 4a 1 102-2602, Busan (KR). -S (CHOO, Jeong-Seon); 607-122 Jf^l -4 3 2 ^ ^ 5f 7}^ 102 J:, Busan (KR). (KANG, Hak-Su); 641-809 #€ A 1 £ Til -o\" 327-6, Gyeongsangnam-do (KR). (KONG, Gyoung-Pyo); 681-764 1-302, Ulsan (KR). (74) tfle)\"?]: (KIM, Ham-Kon); 135-080 ^ vH 7J-U- ^ ^ ^ 668-2 2 f% Seoul (KR). (81) *13^ (l^ iA] 7} &ir ?V,7}^-?!: 5L& ^S\ ^-14] e] S\ iL J:# ^ t} ): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, [CFS ^ *l*f] (54) Title: POLISHING PAD AND METHOD FOR MANUFACTURING SAME (54) ^31 ^ : °4n|-iiHH Sj Z L DISS'S [Fig 1] 100 141' 142' 160 142 00 l> m i> i-H cn i-H o CJ o & (57) Abstract: According to the present invention, the method for manufacturing polishing a pad by mixing polishing a layer form­ ing material and solidifying the material through a chemical reaction includes: step of forming a micro organic particles by pulveriz - ing an organic material using a physical method; step of a mixing the micro organic particles formed in the above step with the pol - ishing layer forming material; a step of forming gaseous pores by mixing the mixture obtained in the above step with pore a size- controllable inert gas, a capsule-type foaming agent, or a chemical foaming agent; a step of producing a polishing layer by gelating and curing the mixture obtained in the above step; and step a of distributing the pores through the opening of the gaseous pores on a surface by processing the polishing layer. (57) [cFS ^ *l*f] WO 2013/176378 Al I lllll llllllll II llllll III lllll lllll III III III lllll llll llll lllll lllll lllll lllll lllllll llll llll SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *1^ Of iAl7} $.4 4, 7}44 JSL-s- W3 « 4 e] iL J:# 4 43 ): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), -rr 4 4 3 (AM, AZ, BY, KG, KZ, RU, TJ, TM), -i rv! (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). — 4 44 (2:51= ^ 2 \ 3i(3)) SL 4^ 44=t S J4 #11-1: ^433^- 443 443 34 JZ.4433 44 ^Ht 4^44 4^4,43# •ir #33 4443 44 43 343. «J4334 444; 43 4434 S J43 44 43 43 3 4# 4 4=t S J4 #43 ^4334 444; 43 443 ^4#3 S3 43^ 4H*3 7}44 44-4 34,4^sj 4S 4, 443 US31 =f 33£ 3— 44# ^443, 714 S3# S J444 444; 471 44# ^4 ^43 ^4#-§r 44 4 3433 34=f-i: 4^44 444; 471 34=t-S: 7}443 X43 714 S33 71143 34 7141-S: 4S 334 44# S444 44 4444.
SG11201407257TA 2012-05-23 2013-02-12 Polishing pad and method for manufacturing same SG11201407257TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120054523A KR101417274B1 (en) 2012-05-23 2012-05-23 Polishing pad and manufacturing method thereof
PCT/KR2013/001085 WO2013176378A1 (en) 2012-05-23 2013-02-12 Polishing pad and method for manufacturing same

Publications (1)

Publication Number Publication Date
SG11201407257TA true SG11201407257TA (en) 2014-12-30

Family

ID=49624027

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407257TA SG11201407257TA (en) 2012-05-23 2013-02-12 Polishing pad and method for manufacturing same

Country Status (7)

Country Link
US (1) US20150133039A1 (en)
EP (1) EP2853350A4 (en)
JP (1) JP5959724B2 (en)
KR (1) KR101417274B1 (en)
CN (1) CN104507641B (en)
SG (1) SG11201407257TA (en)
WO (1) WO2013176378A1 (en)

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Publication number Priority date Publication date Assignee Title
US9991622B2 (en) 2013-07-05 2018-06-05 Asahi Kasei Chemicals Corporation Electrical component comprising insulating resin molded article, and method for stabilizing flame retardance
CN104802099B (en) * 2015-05-04 2017-07-21 华侨大学 A kind of abrading block, its preparation method and application with big filings-containing cavity
CN107646138B (en) * 2016-04-06 2020-11-06 Kpx化工有限公司 Method for manufacturing polishing pad
KR101894071B1 (en) 2016-11-03 2018-08-31 에스케이씨 주식회사 Uv-curable resin composition, polishing pad and preparation method thereof
KR102608960B1 (en) * 2016-12-05 2023-12-01 삼성전자주식회사 Method of manufacturing polishing pad for manufacturing integrated circuit device
KR101949911B1 (en) * 2017-09-11 2019-02-19 에스케이씨 주식회사 Porous polyurethane polishing pad and preparation method thereof
KR102088919B1 (en) * 2017-09-11 2020-03-13 에스케이씨 주식회사 Porous polyurethane polishing pad and preparation method thereof
EP3683019A4 (en) 2017-09-11 2021-06-16 SKC solmics Co., Ltd. Porous polyurethane polishing pad and method for manufacturing same
CN109080061B (en) * 2018-07-25 2021-06-11 南通德亿新材料有限公司 Thermoplastic elastomer foaming particle casting molding process
CN109093538A (en) * 2018-08-24 2018-12-28 成都时代立夫科技有限公司 A kind of CMP pad treatment process
KR102502516B1 (en) * 2021-03-12 2023-02-23 에스케이엔펄스 주식회사 Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same
CN113414705B (en) * 2021-07-12 2022-07-29 苏州赛尔特新材料有限公司 Large-size double-layer flexible polishing pad and preparation method and application thereof

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US2216728A (en) * 1935-12-31 1940-10-08 Carborundum Co Abrasive article and method of making the same
US2901337A (en) * 1956-07-31 1959-08-25 Union Carbide Corp Abrasive articles and method of making the same
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
KR20010055971A (en) * 1999-12-13 2001-07-04 김진우 Polymeric polising pad
WO2001096434A1 (en) * 2000-06-13 2001-12-20 Toyo Tire & Rubber Co., Ltd. Process for producing polyurethane foam, polyurethane foam, and abrasive sheet
JP2003011066A (en) * 2000-07-25 2003-01-15 Ebara Corp Polishing tool and manufacturing method therefor
US7632434B2 (en) * 2000-11-17 2009-12-15 Wayne O. Duescher Abrasive agglomerate coated raised island articles
JP2003313542A (en) * 2002-04-22 2003-11-06 Jsr Corp Aqueous dispersion for chemomechanical polishing use
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US7066801B2 (en) * 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
US7074115B2 (en) * 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
TW200734379A (en) * 2005-10-31 2007-09-16 Kure Norton Co Ltd Method of manufacturing resin bonding grinding wheel
WO2010053729A1 (en) * 2008-11-04 2010-05-14 Guiselin Olivier L Coated abrasive article for polishing or lapping applications and system and method for producing the same
JP4873667B2 (en) * 2009-09-18 2012-02-08 東洋ゴム工業株式会社 Polishing pad
KR101080572B1 (en) 2009-09-29 2011-11-04 삼성전자주식회사 Polishing pad and manufacturing method thereof
US20110105000A1 (en) * 2009-09-30 2011-05-05 Yongqi Hu Chemical Mechanical Planarization Pad With Surface Characteristics
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Also Published As

Publication number Publication date
JP2015514598A (en) 2015-05-21
WO2013176378A1 (en) 2013-11-28
US20150133039A1 (en) 2015-05-14
KR101417274B1 (en) 2014-07-09
CN104507641A (en) 2015-04-08
KR20130130893A (en) 2013-12-03
JP5959724B2 (en) 2016-08-02
CN104507641B (en) 2018-01-05
EP2853350A4 (en) 2016-01-13
EP2853350A1 (en) 2015-04-01

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