JP5959444B2 - 印刷検査装置による不良原因の推定（分類）方法 - Google Patents

印刷検査装置による不良原因の推定（分類）方法 Download PDF

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Publication number
JP5959444B2
JP5959444B2 JP2013003590A JP2013003590A JP5959444B2 JP 5959444 B2 JP5959444 B2 JP 5959444B2 JP 2013003590 A JP2013003590 A JP 2013003590A JP 2013003590 A JP2013003590 A JP 2013003590A JP 5959444 B2 JP5959444 B2 JP 5959444B2
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JP
Japan
Prior art keywords
area
solder
circuit board
printed circuit
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013003590A
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English (en)
Japanese (ja)
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JP2014134496A (ja
JP2014134496A5 (enExample
Inventor
潤 嶋田
潤 嶋田
有以 三宅
有以 三宅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagoya Electric Works Co Ltd
Original Assignee
Nagoya Electric Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagoya Electric Works Co Ltd filed Critical Nagoya Electric Works Co Ltd
Priority to JP2013003590A priority Critical patent/JP5959444B2/ja
Priority to PCT/JP2014/050090 priority patent/WO2014109320A1/ja
Priority to CN201480014511.7A priority patent/CN105074439B/zh
Publication of JP2014134496A publication Critical patent/JP2014134496A/ja
Publication of JP2014134496A5 publication Critical patent/JP2014134496A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
    • G01N2021/95669—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature for solder coating, coverage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2013003590A 2013-01-11 2013-01-11 印刷検査装置による不良原因の推定（分類）方法 Expired - Fee Related JP5959444B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013003590A JP5959444B2 (ja) 2013-01-11 2013-01-11 印刷検査装置による不良原因の推定（分類）方法
PCT/JP2014/050090 WO2014109320A1 (ja) 2013-01-11 2014-01-07 印刷検査装置による不良原因の推定（分類）方法
CN201480014511.7A CN105074439B (zh) 2013-01-11 2014-01-07 印刷电路板的印刷检查方法和印刷检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013003590A JP5959444B2 (ja) 2013-01-11 2013-01-11 印刷検査装置による不良原因の推定（分類）方法

Publications (3)

Publication Number Publication Date
JP2014134496A JP2014134496A (ja) 2014-07-24
JP2014134496A5 JP2014134496A5 (enExample) 2015-10-15
JP5959444B2 true JP5959444B2 (ja) 2016-08-02

Family

ID=51166968

Family Applications (1)

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JP2013003590A Expired - Fee Related JP5959444B2 (ja) 2013-01-11 2013-01-11 印刷検査装置による不良原因の推定（分類）方法

Country Status (3)

Country Link
JP (1) JP5959444B2 (enExample)
CN (1) CN105074439B (enExample)
WO (1) WO2014109320A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016189359A (ja) * 2015-03-28 2016-11-04 名古屋電機工業株式会社 クリームはんだ印刷工程検査方法及びクリームはんだ印刷工程検査システム
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US10997714B2 (en) * 2017-02-13 2021-05-04 Koh Young Technology Inc. Apparatus for inspecting components mounted on printed circuit board, operating method thereof, and computer-readable recording medium
JP2019185730A (ja) * 2018-03-30 2019-10-24 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
TWI651541B (zh) * 2018-05-07 2019-02-21 技嘉科技股份有限公司 板件元件檢核裝置、檢核裝置執行方法與檢核系統執行方法
JP7092563B2 (ja) * 2018-06-08 2022-06-28 マクセルフロンティア株式会社 印字検査機
JP7131127B2 (ja) * 2018-06-27 2022-09-06 オムロン株式会社 外観検査システム、外観検査結果の表示方法、および、外観検査結果の表示プログラム
WO2020005001A1 (ko) * 2018-06-28 2020-01-02 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
CN109936923B (zh) * 2019-03-25 2020-10-13 北京百度网讯科技有限公司 用于确定芯片贴装数据的方法和装置
WO2020217510A1 (ja) * 2019-04-26 2020-10-29 株式会社Ｆｕｊｉ 印刷パラメータ取得装置および印刷パラメータ取得方法
JP6870031B2 (ja) * 2019-06-19 2021-05-12 名古屋電機工業株式会社 クリームはんだ印刷工程検査システム
JP2024155609A (ja) * 2023-04-21 2024-10-31 富士フイルムビジネスイノベーション株式会社 情報処理システム及びプログラム
CN118973132B (zh) * 2024-09-04 2025-03-18 深圳市塔联科技有限公司 基于pcb板的整平控制方法以及系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564183A (en) * 1992-09-30 1996-10-15 Matsushita Electric Industrial Co., Ltd. Producing system of printed circuit board and method therefor
JP3344739B2 (ja) * 1992-09-30 2002-11-18 松下電器産業株式会社 実装基板生産システムおよび実装基板生産方法
JP4796232B2 (ja) * 2001-03-02 2011-10-19 名古屋電機工業株式会社 半田高さ計測方法およびその装置
JP3733094B2 (ja) * 2002-08-22 2006-01-11 トヨタ自動車株式会社 良否判定装置、良否判定プログラムおよび良否判定方法
JP4274868B2 (ja) * 2003-08-07 2009-06-10 オリンパス株式会社 高さ測定方法
JP2007081318A (ja) * 2005-09-16 2007-03-29 Omron Corp 検査結果出力方法、検査結果出力装置、検査結果出力用プログラム、および検査結果出力用プログラムを記録した記録媒体
JP4971882B2 (ja) * 2007-06-22 2012-07-11 アンリツ株式会社 形状測定装置及び形状測定方法
JP4490468B2 (ja) * 2007-10-10 2010-06-23 シーケーディ株式会社 半田印刷検査装置
JP4744610B2 (ja) * 2009-01-20 2011-08-10 シーケーディ株式会社 三次元計測装置

Also Published As

Publication number Publication date
WO2014109320A1 (ja) 2014-07-17
JP2014134496A (ja) 2014-07-24
CN105074439A (zh) 2015-11-18
CN105074439B (zh) 2016-10-26

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