JP5950618B2 - 光透過部材の形成方法および撮像装置の製造方法 - Google Patents

光透過部材の形成方法および撮像装置の製造方法 Download PDF

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JP5950618B2
JP5950618B2 JP2012038881A JP2012038881A JP5950618B2 JP 5950618 B2 JP5950618 B2 JP 5950618B2 JP 2012038881 A JP2012038881 A JP 2012038881A JP 2012038881 A JP2012038881 A JP 2012038881A JP 5950618 B2 JP5950618 B2 JP 5950618B2
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area
zone
light
light transmission
forming
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JP2013174713A5 (https=
JP2013174713A (ja
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真男 石岡
真男 石岡
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Canon Inc
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Canon Inc
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Priority to JP2012038881A priority Critical patent/JP5950618B2/ja
Priority to US13/773,281 priority patent/US8748213B2/en
Priority to CN201310056470.5A priority patent/CN103296041B/zh
Publication of JP2013174713A publication Critical patent/JP2013174713A/ja
Publication of JP2013174713A5 publication Critical patent/JP2013174713A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

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  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Optical Communication System (AREA)
JP2012038881A 2012-02-24 2012-02-24 光透過部材の形成方法および撮像装置の製造方法 Active JP5950618B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012038881A JP5950618B2 (ja) 2012-02-24 2012-02-24 光透過部材の形成方法および撮像装置の製造方法
US13/773,281 US8748213B2 (en) 2012-02-24 2013-02-21 Light transmission member, image pickup device, and method of manufacturing same
CN201310056470.5A CN103296041B (zh) 2012-02-24 2013-02-22 光透射构件、图像拾取装置和及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012038881A JP5950618B2 (ja) 2012-02-24 2012-02-24 光透過部材の形成方法および撮像装置の製造方法

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JP2013174713A JP2013174713A (ja) 2013-09-05
JP2013174713A5 JP2013174713A5 (https=) 2015-04-09
JP5950618B2 true JP5950618B2 (ja) 2016-07-13

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US (1) US8748213B2 (https=)
JP (1) JP5950618B2 (https=)
CN (1) CN103296041B (https=)

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JP2015195235A (ja) 2014-03-31 2015-11-05 ソニー株式会社 固体撮像素子、電子機器、および撮像方法
JP6633850B2 (ja) * 2015-07-08 2020-01-22 キヤノン株式会社 積層型固体撮像素子
WO2017111171A1 (ja) 2015-12-25 2017-06-29 株式会社ニコン 撮像素子および撮像装置
JP7066316B2 (ja) * 2016-12-13 2022-05-13 ソニーセミコンダクタソリューションズ株式会社 撮像素子及び電子機器
CN107040724B (zh) * 2017-04-28 2020-05-15 Oppo广东移动通信有限公司 双核对焦图像传感器及其对焦控制方法和成像装置
JP6927098B2 (ja) * 2018-03-13 2021-08-25 日本電信電話株式会社 レンズ集積受光素子及びその検査方法
KR20210052724A (ko) * 2019-10-30 2021-05-11 삼성디스플레이 주식회사 디스플레이 패널 및 이를 포함하는 디스플레이 장치
WO2021085367A1 (ja) 2019-10-30 2021-05-06 富士フイルム株式会社 光学素子、光学装置、及び撮像装置
JP2021179492A (ja) * 2020-05-12 2021-11-18 セイコーエプソン株式会社 電気光学装置および電子機器
KR20230027001A (ko) 2020-06-29 2023-02-27 도판 인사츠 가부시키가이샤 컬러 필터 및 표시 장치

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JP4867160B2 (ja) * 2004-11-26 2012-02-01 ソニー株式会社 光電変換素子及び光電変換装置
JP4598680B2 (ja) * 2005-01-18 2010-12-15 パナソニック株式会社 固体撮像装置及びカメラ
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JP4747154B2 (ja) 2007-11-22 2011-08-17 富士フイルム株式会社 固体撮像素子の駆動方法、固体撮像素子、及び撮像装置
JP5241355B2 (ja) 2008-07-10 2013-07-17 キヤノン株式会社 撮像装置とその制御方法
JP5109982B2 (ja) * 2008-10-09 2012-12-26 日立電線株式会社 ミラー付き光伝送体の製造方法
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US9022584B2 (en) * 2010-11-24 2015-05-05 Raytheon Company Protecting an optical surface
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US9036059B2 (en) * 2011-11-01 2015-05-19 Sony Corporation Imaging apparatus for efficiently generating multiple forms of image data output by an imaging sensor
JP5621058B2 (ja) * 2011-12-27 2014-11-05 富士フイルム株式会社 カラー撮像素子

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Publication number Publication date
CN103296041A (zh) 2013-09-11
US20130224897A1 (en) 2013-08-29
US8748213B2 (en) 2014-06-10
JP2013174713A (ja) 2013-09-05
CN103296041B (zh) 2015-10-21

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