JP5948783B2 - 固体撮像装置、および電子機器 - Google Patents

固体撮像装置、および電子機器 Download PDF

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Publication number
JP5948783B2
JP5948783B2 JP2011223613A JP2011223613A JP5948783B2 JP 5948783 B2 JP5948783 B2 JP 5948783B2 JP 2011223613 A JP2011223613 A JP 2011223613A JP 2011223613 A JP2011223613 A JP 2011223613A JP 5948783 B2 JP5948783 B2 JP 5948783B2
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JP
Japan
Prior art keywords
film
sensor substrate
wiring
light
insulating film
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JP2011223613A
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English (en)
Japanese (ja)
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JP2013084763A5 (enExample
JP2013084763A (ja
Inventor
健太郎 秋山
健太郎 秋山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011223613A priority Critical patent/JP5948783B2/ja
Priority to TW101133370A priority patent/TWI577001B/zh
Priority to CN201280045395.6A priority patent/CN103797579B/zh
Priority to US14/346,607 priority patent/US9184205B2/en
Priority to CN201610686559.3A priority patent/CN106169493B/zh
Priority to PCT/JP2012/074945 priority patent/WO2013051462A1/ja
Priority to EP19177082.5A priority patent/EP3561873B1/en
Priority to KR1020147006318A priority patent/KR102051155B1/ko
Priority to DE202012013576.7U priority patent/DE202012013576U1/de
Priority to EP12838953.3A priority patent/EP2747139B1/en
Publication of JP2013084763A publication Critical patent/JP2013084763A/ja
Publication of JP2013084763A5 publication Critical patent/JP2013084763A5/ja
Priority to US14/871,345 priority patent/US9374511B2/en
Priority to US15/087,729 priority patent/US9576998B2/en
Application granted granted Critical
Publication of JP5948783B2 publication Critical patent/JP5948783B2/ja
Priority to US15/411,470 priority patent/US10312281B2/en
Priority to US16/413,045 priority patent/US11329091B2/en
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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2011223613A 2011-10-04 2011-10-11 固体撮像装置、および電子機器 Active JP5948783B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2011223613A JP5948783B2 (ja) 2011-10-11 2011-10-11 固体撮像装置、および電子機器
TW101133370A TWI577001B (zh) 2011-10-04 2012-09-12 固體攝像裝置、固體攝像裝置之製造方法及電子機器
EP12838953.3A EP2747139B1 (en) 2011-10-04 2012-09-27 Semiconductor image pickup device, method for making semiconductor image pickup device, and electronic device
CN201610686559.3A CN106169493B (zh) 2011-10-04 2012-09-27 固态图像拾取单元和电子设备
PCT/JP2012/074945 WO2013051462A1 (ja) 2011-10-04 2012-09-27 固体撮像装置、固体撮像装置の製造方法、および電子機器
EP19177082.5A EP3561873B1 (en) 2011-10-04 2012-09-27 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
KR1020147006318A KR102051155B1 (ko) 2011-10-04 2012-09-27 고체 촬상 장치, 고체 촬상 장치의 제조 방법 및 전자 기기
DE202012013576.7U DE202012013576U1 (de) 2011-10-04 2012-09-27 Festkörper-Bildaufnahmeeinheit und elektronische Vorrichtung
CN201280045395.6A CN103797579B (zh) 2011-10-04 2012-09-27 固态图像拾取单元、制造固态图像拾取单元的方法和电子设备
US14/346,607 US9184205B2 (en) 2011-10-04 2012-09-27 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US14/871,345 US9374511B2 (en) 2011-10-04 2015-09-30 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US15/087,729 US9576998B2 (en) 2011-10-04 2016-03-31 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US15/411,470 US10312281B2 (en) 2011-10-04 2017-01-20 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US16/413,045 US11329091B2 (en) 2011-10-04 2019-05-15 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011223613A JP5948783B2 (ja) 2011-10-11 2011-10-11 固体撮像装置、および電子機器

Publications (3)

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JP2013084763A JP2013084763A (ja) 2013-05-09
JP2013084763A5 JP2013084763A5 (enExample) 2014-11-20
JP5948783B2 true JP5948783B2 (ja) 2016-07-06

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JP2011223613A Active JP5948783B2 (ja) 2011-10-04 2011-10-11 固体撮像装置、および電子機器

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JP (1) JP5948783B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015076569A (ja) * 2013-10-11 2015-04-20 ソニー株式会社 撮像装置およびその製造方法ならびに電子機器
US10121812B2 (en) * 2015-12-29 2018-11-06 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked substrate structure with inter-tier interconnection
JP2018006443A (ja) * 2016-06-29 2018-01-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP7038494B2 (ja) * 2017-06-15 2022-03-18 ルネサスエレクトロニクス株式会社 固体撮像素子
CN115315809A (zh) * 2020-03-31 2022-11-08 索尼半导体解决方案公司 光接收元件和电子设备
JP7494728B2 (ja) * 2020-12-23 2024-06-04 Ｔｏｐｐａｎホールディングス株式会社 固体撮像素子および製造方法
JP2022187526A (ja) * 2021-06-08 2022-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像素子パッケージおよび電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168074A (ja) * 1997-08-13 1999-03-09 Sony Corp 固体撮像素子
JP2003209235A (ja) * 2002-01-16 2003-07-25 Sony Corp 固体撮像素子及びその製造方法
JP2007201266A (ja) * 2006-01-27 2007-08-09 Fujifilm Corp マイクロレンズ、その製造方法、これを用いた固体撮像素子およびその製造方法
JP4900876B2 (ja) * 2007-09-14 2012-03-21 カシオ計算機株式会社 表示装置の製造方法
JP2009071182A (ja) * 2007-09-14 2009-04-02 Sony Corp 固体撮像装置及びその製造方法、並びにカメラ
KR101648200B1 (ko) * 2009-10-22 2016-08-12 삼성전자주식회사 이미지 센서 및 그 제조 방법
JP5442394B2 (ja) * 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器

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