JP5940799B2 - 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法 - Google Patents

電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法 Download PDF

Info

Publication number
JP5940799B2
JP5940799B2 JP2011254899A JP2011254899A JP5940799B2 JP 5940799 B2 JP5940799 B2 JP 5940799B2 JP 2011254899 A JP2011254899 A JP 2011254899A JP 2011254899 A JP2011254899 A JP 2011254899A JP 5940799 B2 JP5940799 B2 JP 5940799B2
Authority
JP
Japan
Prior art keywords
electronic component
component mounting
elongated
resin
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011254899A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013110298A (ja
JP2013110298A5 (enExample
Inventor
直 荒井
直 荒井
木村　康之
康之 木村
小林　敏男
敏男 小林
小林　和貴
和貴 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011254899A priority Critical patent/JP5940799B2/ja
Priority to US13/682,107 priority patent/US8901580B2/en
Priority to EP12193921.9A priority patent/EP2597678A3/en
Priority to CN2012104792392A priority patent/CN103137575A/zh
Publication of JP2013110298A publication Critical patent/JP2013110298A/ja
Publication of JP2013110298A5 publication Critical patent/JP2013110298A5/ja
Application granted granted Critical
Publication of JP5940799B2 publication Critical patent/JP5940799B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12035—Zener diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2011254899A 2011-11-22 2011-11-22 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法 Expired - Fee Related JP5940799B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011254899A JP5940799B2 (ja) 2011-11-22 2011-11-22 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法
US13/682,107 US8901580B2 (en) 2011-11-22 2012-11-20 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package
EP12193921.9A EP2597678A3 (en) 2011-11-22 2012-11-22 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package
CN2012104792392A CN103137575A (zh) 2011-11-22 2012-11-22 安装电子组件的封装件、电子设备及制造封装件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011254899A JP5940799B2 (ja) 2011-11-22 2011-11-22 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2013110298A JP2013110298A (ja) 2013-06-06
JP2013110298A5 JP2013110298A5 (enExample) 2014-09-18
JP5940799B2 true JP5940799B2 (ja) 2016-06-29

Family

ID=47257550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011254899A Expired - Fee Related JP5940799B2 (ja) 2011-11-22 2011-11-22 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法

Country Status (4)

Country Link
US (1) US8901580B2 (enExample)
EP (1) EP2597678A3 (enExample)
JP (1) JP5940799B2 (enExample)
CN (1) CN103137575A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6008582B2 (ja) * 2012-05-28 2016-10-19 新光電気工業株式会社 半導体パッケージ、放熱板及びその製造方法
JP6335619B2 (ja) * 2014-01-14 2018-05-30 新光電気工業株式会社 配線基板及び半導体パッケージ
US9142528B2 (en) 2014-02-12 2015-09-22 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device with an interlocking structure
JP6225812B2 (ja) 2014-04-18 2017-11-08 日亜化学工業株式会社 発光装置
JP6661890B2 (ja) * 2014-05-21 2020-03-11 日亜化学工業株式会社 発光装置
US10381293B2 (en) * 2016-01-21 2019-08-13 Texas Instruments Incorporated Integrated circuit package having an IC die between top and bottom leadframes
KR102505443B1 (ko) * 2017-11-16 2023-03-03 삼성전기주식회사 인쇄회로기판
DE102018123031A1 (de) * 2018-09-19 2020-03-19 Osram Opto Semiconductors Gmbh Bauelement und herstellungsverfahren für ein bauelement
CN112466858B (zh) * 2019-09-09 2025-05-30 中国科学院苏州纳米技术与纳米仿生研究所 大面积led光源封装结构及封装方法
JP7367418B2 (ja) * 2019-09-13 2023-10-24 富士電機株式会社 半導体モジュールおよび車両
JP7306294B2 (ja) * 2020-02-19 2023-07-11 株式会社デンソー 半導体モジュール

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247748A (ja) * 1997-03-03 1998-09-14 Omron Corp 発光素子及び当該発光素子を用いた面光源装置
JP4261713B2 (ja) * 1999-12-20 2009-04-30 パナソニック株式会社 熱伝導基板とその製造方法
JP2001210764A (ja) 2000-01-26 2001-08-03 Matsushita Electric Works Ltd 熱伝導基板及びその製造方法
JP4286465B2 (ja) 2001-02-09 2009-07-01 三菱電機株式会社 半導体装置とその製造方法
KR200373718Y1 (ko) * 2004-09-20 2005-01-21 주식회사 티씨오 정전기 방전 충격에 대한 보호 기능이 내장된 고휘도발광다이오드
JP4757477B2 (ja) 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
CN101213663B (zh) * 2005-06-30 2010-05-19 费查尔德半导体有限公司 半导体管芯封装及其制作方法
CN101273453B (zh) 2005-09-27 2012-09-26 松下电器产业株式会社 散热布线板及其制造方法以及使用有散热布线板的电气设备
JP2008041975A (ja) * 2006-08-08 2008-02-21 Matsushita Electric Ind Co Ltd 放熱性配線基板およびその製造方法
JP2008085109A (ja) * 2006-09-28 2008-04-10 Matsushita Electric Ind Co Ltd 発光ダイオード実装用基板
JP2008098488A (ja) * 2006-10-13 2008-04-24 Matsushita Electric Ind Co Ltd 熱伝導基板とその製造方法
JP2008140954A (ja) * 2006-12-01 2008-06-19 Matsushita Electric Ind Co Ltd 放熱配線基板とその製造方法並びにこれを用いた発光モジュール
JP2008147203A (ja) * 2006-12-05 2008-06-26 Sanken Electric Co Ltd 半導体発光装置
JP5233170B2 (ja) 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
TWI389295B (zh) 2009-02-18 2013-03-11 奇力光電科技股份有限公司 發光二極體光源模組
JP5010716B2 (ja) * 2010-01-29 2012-08-29 株式会社東芝 Ｌｅｄパッケージ
KR101543333B1 (ko) * 2010-04-23 2015-08-11 삼성전자주식회사 발광소자 패키지용 리드 프레임, 발광소자 패키지, 및 발광소자 패키지를 채용한 조명장치
JP2012142426A (ja) * 2010-12-28 2012-07-26 Toshiba Corp Ｌｅｄパッケージ及びその製造方法

Also Published As

Publication number Publication date
EP2597678A3 (en) 2014-03-05
JP2013110298A (ja) 2013-06-06
CN103137575A (zh) 2013-06-05
EP2597678A2 (en) 2013-05-29
US8901580B2 (en) 2014-12-02
US20130126916A1 (en) 2013-05-23

Similar Documents

Publication Publication Date Title
JP5940799B2 (ja) 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法
JP4754850B2 (ja) Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
CN102893418B (zh) 发光单元、照明装置
JP4122784B2 (ja) 発光装置
US9130140B2 (en) Light-emitting device including a heat dissipation hole
CN102610599B (zh) 发光器件封装件及其制造方法
TWI713437B (zh) 發光組件及其製造方法
JP2013033910A (ja) 発光素子搭載用基板、ｌｅｄパッケージ、及びｌｅｄパッケージの製造方法
JP2012033855A (ja) Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法
JP4910220B1 (ja) Ｌｅｄモジュール装置及びその製造方法
EP2188849B1 (en) Light emitting device
WO2013168802A1 (ja) Ｌｅｄモジュール
JP6280710B2 (ja) 配線基板、発光装置及び配線基板の製造方法
CN103325932A (zh) 发光元件安装封装、其制造方法以及发光元件封装
WO2010050067A1 (ja) 発光素子パッケージ用基板及び発光素子パッケージ
JP2004207367A (ja) 発光ダイオード及び発光ダイオード配列板
EP2624320B1 (en) Led module
KR101051488B1 (ko) 발광 다이오드 유닛의 제조 방법과, 이 방법에 의하여 제조된 발광 다이오드 유닛
US8461614B2 (en) Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device
JP2008042158A (ja) Ｓｍｌ型発光ダイオードランプ用素子およびその製造方法
JP2006100753A (ja) 半導体モジュールおよびその製造方法
JP2010171217A (ja) 発光素子パッケージ、発光装置、および表示装置
JP2008300542A (ja) 発光素子パッケージ用基板及び発光素子パッケージ
JP5912471B2 (ja) 半導体デバイス
JP2004241729A (ja) 発光光源、照明装置、表示装置及び発光光源の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140801

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140801

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150430

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150526

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150716

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151027

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160510

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160519

R150 Certificate of patent or registration of utility model

Ref document number: 5940799

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees