JP5936619B2 - 電気コネクタを形成する方法 - Google Patents
電気コネクタを形成する方法 Download PDFInfo
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- JP5936619B2 JP5936619B2 JP2013542164A JP2013542164A JP5936619B2 JP 5936619 B2 JP5936619 B2 JP 5936619B2 JP 2013542164 A JP2013542164 A JP 2013542164A JP 2013542164 A JP2013542164 A JP 2013542164A JP 5936619 B2 JP5936619 B2 JP 5936619B2
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- 238000000034 method Methods 0.000 title claims description 30
- 239000011257 shell material Substances 0.000 claims description 144
- 239000000523 sample Substances 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 127
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000003486 chemical etching Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- ZLGYJAIAVPVCNF-UHFFFAOYSA-N 1,2,4-trichloro-5-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 ZLGYJAIAVPVCNF-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
- H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2471—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point pin shaped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connecting Device With Holders (AREA)
Description
631 ソケットキャビティ
641,644 シェル層
643 プランジャ
644 付勢デバイス
800,1600 コア
1000,1001,1800,1801 層
Claims (10)
- 電気コネクタを形成する方法であって、
少なくとも一つの層がコアの外側表面の少なくとも一部と同形を成すように前記コアに前記少なくとも一つの層を貼着させるステップと、
前記少なくとも一つの層を有している前記コアをソケットシェルのソケット本体のソケットキャビティへ挿入するステップであって、前記ソケットキャビティが内側ソケット表面を含む、ステップと、
前記少なくとも一つの層が前記ソケットキャビティの前記内側ソケット表面に貼着された少なくとも一つのシェル層を形成するように、前記少なくとも一つの層の少なくとも一部を残しながら前記ソケットキャビティから前記コアを除去し、前記少なくとも一つのシェル層は、前記内側ソケット表面の少なくとも一部と同形でありながら前記内側ソケット表面の前記少なくとも一部に層として貼着され外側シェル表面を有するシェルキャビティを含み、前記少なくとも一つのシェル層は第1のシェル材料を備えるステップと、
前記少なくとも一つのプランジャが前記シェルキャビティ内に摺動可能に受容されると共に前記シェルキャビティの第1の端部の第1の開口を介して突出し、付勢デバイスが前記少なくとも一つのプランジャに付勢力を印加し、かつ前記少なくも一つのプランジャの尾部が前記少なくとも一つのシェル層に摺動可能に受容されると共に接触するように、少なくとも一つのプランジャと前記付勢デバイスを前記シェルキャビティ内へ挿入し、前記少なくとも一つのプランジャと前記付勢デバイスがコンタクトプローブを構成するステップと
を含む、方法。 - 前記シェルキャビティにおける前記少なくとも一つのプランジャと前記付勢デバイスの少なくとも一つの摺動動作を制限するために、保持具を用いて前記シェルキャビティの開口端を少なくとも部分的に閉成し、前記保持具は前記ソケットシェルと接触し、前記少なくも一つのプランジャの摺動動作を制限し、前記付勢デバイスは、前記少なくとも一つのプランジャを一つのプランジャの前記尾部が前記保持具と前記少なくとも一つのシェル層に接触する位置に位置するように、前記少なくとも一つのプランジャに付勢力を印加するように構成されている、ステップを更に含む、請求項1に記載の方法。
- 前記少なくとも1つのプランジャの摺動を制限するために前記少なくとも1つのプランジャが保持具キャビティを介して延出するように、前記保持具キャビティを有する保持具を前記ソケットシェルに貼着することを更に含む、請求項1に記載の方法。
- 前記少なくとも1つのプランジャと前記付勢デバイスを挿入することには、尾部が前記保持具と前記少なくとも1つのシェル層に接触し、前記付勢デバイスが前記少なくとも1つのプランジャに付勢力を印加するように、前記少なくとも1つのプランジャの前記尾部を前記シェルキャビティ内へ挿入することを含む、請求項3に記載の方法。
- 前記内側ソケット表面は、本体部と、前記内側ソケット表面の前記本体部の断面寸法よりも小さな断面寸法を有する首部と、前記内側ソケット表面の前記本体部を前記内側ソケット表面の前記首部に接続する肩部とを含み、
前記外側シェル表面は、前記内側ソケット表面の前記本体部と同形の本体部と、前記内側ソケット表面の前記首部と同形の首部と、前記内側ソケット表面の前記肩部と同形で前記外側シェル表面の前記本体部を前記外側シェル表面の前記首部に接続する肩部とを含む、請求項1に記載の方法。 - 前記少なくとも1つのプランジャと前記付勢デバイスを挿入することには、前記付勢デバイスにより第1のプランジャを第2のプランジャから離すように、前記シェルキャビティの前記第1の端部の前記第1の開口を介して前記第1のプランジャを挿入することと、前記シェルキャビティの第2の端部の第2の開口を介して前記第2のプランジャを挿入することを含む、請求項1に記載の方法。
- 前記電気コネクタは、集積回路チップをプリント回路基板に電気的に接続するためのインターコネクタであり、前記第1のプランジャは前記集積回路チップに電気的に接続するように構成されており、前記第2のプランジャは前記プリント回路基板に電気的に接続するように構成されている、請求項6に記載の方法。
- 前記少なくとも1つの層を前記コアに貼着することには、前記少なくとも1つのシェル層が第1のめっき合金を有する第1の層と第2のめっき合金を有する第2の層とを含むように、前記第1のめっき合金を前記コアに貼着することと、次いで前記コアに前記第1のめっき合金とは異なる前記第2のめっき合金を貼着することとを含む、請求項1に記載の方法。
- 複数のソケットキャビティの一つにそれぞれ配置された複数のコンタクトプルーブを形成するために何度も前記方法を繰り返すことを更に含む、請求項1に記載の方法。
- 前記複数のコンタクトプローブのそれぞれは、複数のコンタクトプローブのうちの他の前記コンタクトプローブによる集積回路チップとプリント回路基板との間の電気的接続から離れた、前記集積回路チップと前記プリント回路基板との間の電気的接続を設ける、請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/959,038 | 2010-12-02 | ||
US12/959,038 US8506307B2 (en) | 2010-12-02 | 2010-12-02 | Electrical connector with embedded shell layer |
PCT/US2011/062815 WO2012075240A1 (en) | 2010-12-02 | 2011-12-01 | Electrical connector with embedded shell layer |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013546141A JP2013546141A (ja) | 2013-12-26 |
JP2013546141A5 JP2013546141A5 (ja) | 2014-04-24 |
JP5936619B2 true JP5936619B2 (ja) | 2016-06-22 |
Family
ID=45217730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013542164A Active JP5936619B2 (ja) | 2010-12-02 | 2011-12-01 | 電気コネクタを形成する方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8506307B2 (ja) |
EP (1) | EP2647088B1 (ja) |
JP (1) | JP5936619B2 (ja) |
KR (1) | KR101701938B1 (ja) |
CN (1) | CN103392272B (ja) |
CA (1) | CA2818856C (ja) |
MY (1) | MY184579A (ja) |
SG (1) | SG190297A1 (ja) |
WO (1) | WO2012075240A1 (ja) |
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JP6553472B2 (ja) * | 2015-09-30 | 2019-07-31 | 株式会社ヨコオ | コンタクタ |
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JP6717687B2 (ja) * | 2016-06-28 | 2020-07-01 | 株式会社エンプラス | コンタクトピンおよび電気部品用ソケット |
WO2018212277A1 (ja) * | 2017-05-18 | 2018-11-22 | 信越ポリマー株式会社 | 電気コネクターおよびその製造方法 |
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-
2010
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2011
- 2011-12-01 EP EP11793640.1A patent/EP2647088B1/en active Active
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- 2011-12-01 WO PCT/US2011/062815 patent/WO2012075240A1/en active Application Filing
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- 2011-12-01 JP JP2013542164A patent/JP5936619B2/ja active Active
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EP2647088A1 (en) | 2013-10-09 |
KR101701938B1 (ko) | 2017-02-02 |
EP2647088B1 (en) | 2018-02-28 |
CN103392272B (zh) | 2016-06-29 |
JP2013546141A (ja) | 2013-12-26 |
SG190297A1 (en) | 2013-06-28 |
WO2012075240A1 (en) | 2012-06-07 |
CA2818856C (en) | 2018-09-11 |
CA2818856A1 (en) | 2012-06-07 |
KR20140034120A (ko) | 2014-03-19 |
CN103392272A (zh) | 2013-11-13 |
US8506307B2 (en) | 2013-08-13 |
MY184579A (en) | 2021-04-06 |
US20120142229A1 (en) | 2012-06-07 |
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