JP5931672B2 - ポリイミド積層体及びその製造方法 - Google Patents

ポリイミド積層体及びその製造方法 Download PDF

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Publication number
JP5931672B2
JP5931672B2 JP2012209667A JP2012209667A JP5931672B2 JP 5931672 B2 JP5931672 B2 JP 5931672B2 JP 2012209667 A JP2012209667 A JP 2012209667A JP 2012209667 A JP2012209667 A JP 2012209667A JP 5931672 B2 JP5931672 B2 JP 5931672B2
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Japan
Prior art keywords
polyimide
layer
support substrate
substrate
laminate
Prior art date
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Active
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JP2012209667A
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English (en)
Japanese (ja)
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JP2014061685A (ja
Inventor
芳樹 須藤
芳樹 須藤
若菜 ▲高▼吉
若菜 ▲高▼吉
平石　克文
克文 平石
奈津子 岡▲崎▼
奈津子 岡▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
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Nippon Steel and Sumikin Chemical Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50299815&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5931672(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2012209667A priority Critical patent/JP5931672B2/ja
Priority to TW106115607A priority patent/TWI656026B/zh
Priority to TW102133456A priority patent/TWI656025B/zh
Priority to CN201710367693.1A priority patent/CN107253376A/zh
Priority to CN201310435394.9A priority patent/CN103660458A/zh
Priority to CN201910106754.8A priority patent/CN110077065A/zh
Priority to KR1020130113308A priority patent/KR20140040048A/ko
Publication of JP2014061685A publication Critical patent/JP2014061685A/ja
Publication of JP5931672B2 publication Critical patent/JP5931672B2/ja
Application granted granted Critical
Priority to KR1020200079105A priority patent/KR102246488B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2012209667A 2012-09-24 2012-09-24 ポリイミド積層体及びその製造方法 Active JP5931672B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2012209667A JP5931672B2 (ja) 2012-09-24 2012-09-24 ポリイミド積層体及びその製造方法
TW106115607A TWI656026B (zh) 2012-09-24 2013-09-16 聚亞醯胺積層體及其製造方法
TW102133456A TWI656025B (zh) 2012-09-24 2013-09-16 聚亞醯胺積層體及其製造方法
CN201310435394.9A CN103660458A (zh) 2012-09-24 2013-09-23 聚酰亚胺层叠体及其制造方法
CN201710367693.1A CN107253376A (zh) 2012-09-24 2013-09-23 聚酰亚胺层叠体及其制造方法
CN201910106754.8A CN110077065A (zh) 2012-09-24 2013-09-23 聚酰亚胺层叠体及其制造方法
KR1020130113308A KR20140040048A (ko) 2012-09-24 2013-09-24 폴리이미드 적층체 및 그 제조방법
KR1020200079105A KR102246488B1 (ko) 2012-09-24 2020-06-29 폴리이미드 적층체 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012209667A JP5931672B2 (ja) 2012-09-24 2012-09-24 ポリイミド積層体及びその製造方法

Publications (2)

Publication Number Publication Date
JP2014061685A JP2014061685A (ja) 2014-04-10
JP5931672B2 true JP5931672B2 (ja) 2016-06-08

Family

ID=50299815

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JP2012209667A Active JP5931672B2 (ja) 2012-09-24 2012-09-24 ポリイミド積層体及びその製造方法

Country Status (4)

Country Link
JP (1) JP5931672B2 (zh)
KR (2) KR20140040048A (zh)
CN (3) CN107253376A (zh)
TW (2) TWI656026B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9737086B2 (en) 2011-06-01 2017-08-22 J-Oil Mills, Inc. Oil—or fat-processed starch and method for producing same

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CN105392821B (zh) * 2013-07-26 2018-10-23 日产化学工业株式会社 显示器基板用树脂组合物、显示器基板用树脂薄膜及显示器基板用树脂薄膜的制造方法
JP6610534B2 (ja) * 2014-03-31 2019-11-27 日産化学株式会社 剥離層形成用組成物
CN108690495B (zh) * 2014-03-31 2021-05-25 日产化学工业株式会社 剥离层形成用组合物
TW201605646A (zh) * 2014-08-04 2016-02-16 友達光電股份有限公司 可撓性顯示面板的製造方法
CN104211963B (zh) * 2014-09-18 2016-09-28 吉林奥来德光电材料股份有限公司 聚酰亚胺树脂的制造方法及利用其所制造的聚酰亚胺薄膜
JP6561474B2 (ja) * 2015-01-20 2019-08-21 大日本印刷株式会社 フレキシブルな表示装置の製造方法
JP6808401B2 (ja) 2015-08-31 2021-01-06 日鉄ケミカル＆マテリアル株式会社 機能層付きポリイミド基板フィルムの製造方法
JP6656861B2 (ja) * 2015-09-25 2020-03-04 日鉄ケミカル＆マテリアル株式会社 フレキシブルデバイス用積層体及びフレキシブルデバイスの製造方法
KR20170038175A (ko) * 2015-09-29 2017-04-06 신닛테츠 수미킨 가가쿠 가부시키가이샤 폴리이미드 필름의 제조 방법
JP6706475B2 (ja) * 2015-09-30 2020-06-10 日鉄ケミカル＆マテリアル株式会社 長尺ポリイミド積層体フィルム及びその製造方法、並びに機能層付きポリイミドフィルムの製造方法
JP6937557B2 (ja) * 2015-09-30 2021-09-22 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法
JP6963504B2 (ja) * 2015-10-15 2021-11-10 日鉄ケミカル＆マテリアル株式会社 ポリイミド積層体及びその製造方法
JP6611325B2 (ja) * 2015-12-03 2019-11-27 東京応化工業株式会社 積層体の製造方法、及び、その利用
CN107263984B (zh) * 2016-03-31 2021-01-12 日铁化学材料株式会社 聚酰亚胺树脂层叠体与其制造方法以及带有功能层的聚酰亚胺膜
JP6891564B2 (ja) * 2017-03-16 2021-06-18 コニカミノルタ株式会社 透明耐熱性積層フィルム、透明フレキシブルプリント基板、透明電極基板、照明装置及び有機エレクトロルミネッセンス表示装置
KR102018455B1 (ko) * 2017-05-24 2019-09-04 주식회사 엘지화학 폴리이미드 적층필름 롤체 및 그 제조 방법
JP7248394B2 (ja) * 2017-09-29 2023-03-29 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び金属張積層体
CN111212868B (zh) * 2017-10-11 2022-09-16 株式会社钟化 聚酰亚胺树脂及其制造方法、聚酰亚胺溶液、以及聚酰亚胺薄膜及其制造方法
WO2019078290A1 (ja) * 2017-10-19 2019-04-25 デンカ株式会社 単層フィルム及びそれを用いた耐熱粘着テープ
WO2019142790A1 (ja) 2018-01-18 2019-07-25 Ａｇｃ株式会社 長尺積層体、その製造方法及びプリント配線板
JP7195530B2 (ja) * 2019-01-11 2022-12-26 エルジー・ケム・リミテッド フィルム、金属張積層板、フレキシブル基板、フィルムの製造方法、金属張積層板の製造方法、及びフレキシブル基板の製造方法
CN115175816B (zh) * 2020-03-23 2024-03-08 东洋纺株式会社 层叠体
KR102306950B1 (ko) * 2021-02-05 2021-09-29 최유경 폴리이미드 필름, 이의 제조방법 및 이를 포함하는 연성인쇄회로기판

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CN1245653C (zh) * 2001-05-29 2006-03-15 日立化成工业株式会社 电极结构
JP4816850B2 (ja) 2001-07-06 2011-11-16 凸版印刷株式会社 高分子光学フィルムの製造方法
JP4260530B2 (ja) 2003-04-24 2009-04-30 新日鐵化学株式会社 ポリイミドフィルムの製造方法
JP2005064107A (ja) * 2003-08-08 2005-03-10 Teijin Ltd 積層体の製造方法および回収方法
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US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
JP2008231327A (ja) 2007-03-22 2008-10-02 Ihara Chem Ind Co Ltd 高透明性を有するポリイミドおよびその製造方法
JP5326253B2 (ja) * 2007-10-09 2013-10-30 宇部興産株式会社 ポリイミド膜の製造方法、及び芳香族ポリイミド
JP5252986B2 (ja) * 2008-05-07 2013-07-31 国立大学法人東京工業大学 珪素含有ポリイミドおよびその製造方法
EP3117993B1 (en) * 2008-12-19 2019-01-30 Toyobo Co., Ltd. Laminated body, manufacturing method thereof, and laminated circuit board
JP5410895B2 (ja) * 2009-09-11 2014-02-05 新日鉄住金化学株式会社 ポリイミドフィルムの製造方法
JP5443311B2 (ja) * 2010-09-14 2014-03-19 株式会社カネカ ポリイミド前駆体、ポリイミド樹脂およびその利用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9737086B2 (en) 2011-06-01 2017-08-22 J-Oil Mills, Inc. Oil—or fat-processed starch and method for producing same

Also Published As

Publication number Publication date
TW201730011A (zh) 2017-09-01
TW201420342A (zh) 2014-06-01
CN110077065A (zh) 2019-08-02
KR20200083410A (ko) 2020-07-08
TWI656025B (zh) 2019-04-11
JP2014061685A (ja) 2014-04-10
KR102246488B1 (ko) 2021-04-30
CN107253376A (zh) 2017-10-17
KR20140040048A (ko) 2014-04-02
TWI656026B (zh) 2019-04-11
CN103660458A (zh) 2014-03-26

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