JP5931067B2 - 基板シート - Google Patents

基板シート Download PDF

Info

Publication number
JP5931067B2
JP5931067B2 JP2013526590A JP2013526590A JP5931067B2 JP 5931067 B2 JP5931067 B2 JP 5931067B2 JP 2013526590 A JP2013526590 A JP 2013526590A JP 2013526590 A JP2013526590 A JP 2013526590A JP 5931067 B2 JP5931067 B2 JP 5931067B2
Authority
JP
Japan
Prior art keywords
layer
metal
metal layer
polymer support
support layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013526590A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013539216A (ja
JP2013539216A5 (https=
Inventor
リフカ，ヘルベルト
ヘンドリキュス マリア サンデルス，レナテュス
ヘンドリキュス マリア サンデルス，レナテュス
マシュー，デニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips NV
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO, Koninklijke Philips NV filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of JP2013539216A publication Critical patent/JP2013539216A/ja
Publication of JP2013539216A5 publication Critical patent/JP2013539216A5/ja
Application granted granted Critical
Publication of JP5931067B2 publication Critical patent/JP5931067B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
JP2013526590A 2010-09-06 2011-09-02 基板シート Expired - Fee Related JP5931067B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10175346.5 2010-09-06
EP10175346 2010-09-06
PCT/IB2011/053852 WO2012032446A1 (en) 2010-09-06 2011-09-02 Substrate sheet

Publications (3)

Publication Number Publication Date
JP2013539216A JP2013539216A (ja) 2013-10-17
JP2013539216A5 JP2013539216A5 (https=) 2015-07-16
JP5931067B2 true JP5931067B2 (ja) 2016-06-08

Family

ID=44720070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013526590A Expired - Fee Related JP5931067B2 (ja) 2010-09-06 2011-09-02 基板シート

Country Status (7)

Country Link
US (1) US8664096B2 (https=)
EP (1) EP2614544B1 (https=)
JP (1) JP5931067B2 (https=)
KR (1) KR101872676B1 (https=)
CN (1) CN103098255B (https=)
TW (1) TWI536517B (https=)
WO (1) WO2012032446A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991463B2 (en) * 2012-06-14 2018-06-05 Universal Display Corporation Electronic devices with improved shelf lives
CN103236504A (zh) 2013-05-10 2013-08-07 合肥京东方光电科技有限公司 柔性基板及制造方法、oled显示装置
KR101461437B1 (ko) * 2013-05-27 2014-11-18 에이피시스템 주식회사 포토마스크 세정 장치 및 이를 이용한 포토마스크 세정 방법
US9577196B2 (en) * 2014-02-28 2017-02-21 International Business Machines Corporation Optoelectronics integration by transfer process
KR20160025152A (ko) * 2014-08-26 2016-03-08 삼성디스플레이 주식회사 보호 구조물 및 보호 구조물을 포함하는 유기 발광 표시 장치
KR102325514B1 (ko) * 2015-02-26 2021-11-15 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN112968144B (zh) * 2021-03-09 2022-05-20 华中科技大学 基于丝网状衬底层的pi柔性基板剥离方法、柔性基板和oled

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
WO1995022881A1 (en) 1994-02-22 1995-08-24 Philips Electronics N.V. Laser etching method
DE19512157C1 (de) 1995-03-31 1996-05-23 Klaus Kall Verfahren zum Beschichten einer transparenten Trägerplatte sowie danach hergestellte beschichtete Trägerplatte
JPH0964514A (ja) 1995-08-29 1997-03-07 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2000216394A (ja) 1999-01-27 2000-08-04 Sony Corp 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法
JP4493933B2 (ja) 2002-05-17 2010-06-30 株式会社半導体エネルギー研究所 表示装置
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US20070210420A1 (en) 2006-03-11 2007-09-13 Nelson Curt L Laser delamination of thin metal film using sacrificial polymer layer
JP5136039B2 (ja) * 2007-12-12 2013-02-06 コニカミノルタホールディングス株式会社 導電性材料の製造方法、透明導電膜、有機エレクトロルミネッセンス素子
US20090202857A1 (en) 2008-02-08 2009-08-13 Roger Stanley Kerr Method for forming an electronic device on a flexible metallic substrate and resultant device
EP2284922A1 (en) 2009-08-06 2011-02-16 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method of manufacturing an opto-electric device

Also Published As

Publication number Publication date
EP2614544A1 (en) 2013-07-17
CN103098255A (zh) 2013-05-08
US8664096B2 (en) 2014-03-04
US20130157446A1 (en) 2013-06-20
EP2614544B1 (en) 2015-04-22
WO2012032446A1 (en) 2012-03-15
KR101872676B1 (ko) 2018-07-02
JP2013539216A (ja) 2013-10-17
TW201220448A (en) 2012-05-16
CN103098255B (zh) 2016-04-13
TWI536517B (zh) 2016-06-01
KR20130106836A (ko) 2013-09-30

Similar Documents

Publication Publication Date Title
JP5931067B2 (ja) 基板シート
JP2013539216A5 (https=)
JP6627863B2 (ja) 透明導電層積層用フィルム、その製造方法、及び透明導電性フィルム
JP6517678B2 (ja) 電子デバイスの製造方法
US20160304352A1 (en) Graphene tape
CN104903045A (zh) 用于在透明衬底相对两侧上的涂层内形成图案的方法和装置
JP2008208458A (ja) 無応力の軟性回路基板の製造装置及び方法
CN107464893A (zh) 柔性显示器件的制备方法、柔性显示器件及显示器
JP2014135010A (ja) 透明電極基板の製造方法、デバイスの製造方法およびタッチパネルセンサの製造方法
JP4612066B2 (ja) チップヒューズ及びその製造方法
JP6069749B2 (ja) 離型フィルム付銅箔
JP6059575B2 (ja) 透明電極付き基板の製造方法、および積層体
JP2008193067A (ja) 金属膜パターン形成方法
KR101463227B1 (ko) 금속배선이 함입된 유연기판 제조 장치
KR101804819B1 (ko) 박리 조력층의 전사 과정을 포함하는 플렉시블 정보 표시 소자의 제조 방법
JP5377389B2 (ja) 積層フィルム及びその製造方法並びに電子デバイス及びその製造方法
US20100129612A1 (en) Electrically conducting layer structure and process for the production thereof
JP2016215458A (ja) ロール状積層基板の製造方法及び積層基板
JP2010219063A (ja) チップヒューズ
US10411142B2 (en) Method for production of components comprising a schottky diode by means of printing technology
WO2017061380A1 (ja) 有機電子素子の製造方法、及び、有機電子素子
WO2015159887A1 (ja) 有機エレクトロルミネッセンス素子の製造方法
KR20250085060A (ko) 플렉서블 기판 분리 방법
US20180222153A1 (en) Metalization of flexible polymer sheets
JP2007301884A (ja) 金属調化粧シートの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140829

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150526

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20150612

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150818

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150831

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151029

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160328

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160426

R150 Certificate of patent or registration of utility model

Ref document number: 5931067

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees