JP5925052B2 - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法 Download PDF

Info

Publication number
JP5925052B2
JP5925052B2 JP2012117153A JP2012117153A JP5925052B2 JP 5925052 B2 JP5925052 B2 JP 5925052B2 JP 2012117153 A JP2012117153 A JP 2012117153A JP 2012117153 A JP2012117153 A JP 2012117153A JP 5925052 B2 JP5925052 B2 JP 5925052B2
Authority
JP
Japan
Prior art keywords
cooler
semiconductor
heat sink
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012117153A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013243323A (ja
JP2013243323A5 (https=
Inventor
貴夫 三井
貴夫 三井
中島　泰
泰 中島
範之 別芝
範之 別芝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2012117153A priority Critical patent/JP5925052B2/ja
Publication of JP2013243323A publication Critical patent/JP2013243323A/ja
Publication of JP2013243323A5 publication Critical patent/JP2013243323A5/ja
Application granted granted Critical
Publication of JP5925052B2 publication Critical patent/JP5925052B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012117153A 2012-05-23 2012-05-23 半導体装置および半導体装置の製造方法 Expired - Fee Related JP5925052B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012117153A JP5925052B2 (ja) 2012-05-23 2012-05-23 半導体装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012117153A JP5925052B2 (ja) 2012-05-23 2012-05-23 半導体装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013243323A JP2013243323A (ja) 2013-12-05
JP2013243323A5 JP2013243323A5 (https=) 2014-12-11
JP5925052B2 true JP5925052B2 (ja) 2016-05-25

Family

ID=49843910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012117153A Expired - Fee Related JP5925052B2 (ja) 2012-05-23 2012-05-23 半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5925052B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7027021B2 (ja) * 2017-12-01 2022-03-01 三菱電機株式会社 半導体装置およびその製造方法
JP7613023B2 (ja) * 2020-08-21 2025-01-15 株式会社レゾナック 冷却装置、冷却装置の製造方法
CN115249672B (zh) * 2021-04-28 2025-01-14 比亚迪股份有限公司 Igbt模组、电机控制器和车辆
JP2024163691A (ja) * 2023-05-12 2024-11-22 矢崎総業株式会社 放熱構造
KR102935457B1 (ko) 2024-05-29 2026-03-06 주식회사 에이프로세미콘 질화물계 반도체 소자 패키지
WO2026053967A1 (ja) * 2024-09-09 2026-03-12 ローム株式会社 半導体モジュール

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967944U (ja) * 1982-10-27 1984-05-08 日本電気ホームエレクトロニクス株式会社 樹脂封止型半導体装置
JP3740116B2 (ja) * 2002-11-11 2006-02-01 三菱電機株式会社 モールド樹脂封止型パワー半導体装置及びその製造方法
JP3978424B2 (ja) * 2003-12-10 2007-09-19 トヨタ自動車株式会社 半導体モジュール、半導体装置および負荷駆動装置
JP2006294921A (ja) * 2005-04-12 2006-10-26 Denso Corp 電力変換装置
JPWO2007026944A1 (ja) * 2005-08-31 2009-03-12 三洋電機株式会社 回路装置およびその製造方法
JP2009088335A (ja) * 2007-10-01 2009-04-23 Sumitomo Electric Fine Polymer Inc 金属−樹脂複合体、並びに素子搭載用パッケージ及び電子装置
JP2010073965A (ja) * 2008-09-19 2010-04-02 Denso Corp 半導体冷却ユニット
JP5267238B2 (ja) * 2009-03-13 2013-08-21 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
JP2010219441A (ja) * 2009-03-18 2010-09-30 Sumitomo Metal Electronics Devices Inc 電子部品収納用パッケージ
JP5511515B2 (ja) * 2010-05-31 2014-06-04 株式会社日立製作所 電力変換装置
JP5533350B2 (ja) * 2010-06-30 2014-06-25 株式会社デンソー 半導体装置及びその製造方法
JP5392196B2 (ja) * 2010-06-30 2014-01-22 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JP2013243323A (ja) 2013-12-05

Similar Documents

Publication Publication Date Title
KR102048478B1 (ko) 양면냉각형 파워 모듈 및 그의 제조 방법
JP6862896B2 (ja) 半導体装置及び半導体装置の製造方法
JP5046378B2 (ja) パワー半導体モジュール、および該モジュールを搭載したパワー半導体デバイス
JP5472498B2 (ja) パワーモジュールの製造方法
JP5925052B2 (ja) 半導体装置および半導体装置の製造方法
US12469761B2 (en) Power module including highly-heat-dissipating insulation adhesive sheet
JP6337957B2 (ja) 半導体モジュールユニットおよび半導体モジュール
JP2016066700A (ja) パワー半導体モジュール
WO2007145303A1 (ja) 半導体モジュールおよびその製造方法
JP2015170786A (ja) 半導体装置およびその製造方法
JP2011216564A (ja) パワーモジュール及びその製造方法
CN110364497A (zh) 用于功率控制的电子器件模块和其制造的方法
JP5895220B2 (ja) 半導体装置の製造方法
JP2013123014A (ja) 半導体装置
CN102487053A (zh) 半导体装置及其制造方法
JP6337954B2 (ja) 絶縁基板及び半導体装置
JP2010192591A (ja) 電力用半導体装置とその製造方法
JP2012138475A (ja) 半導体モジュールおよび半導体モジュールの製造方法
JP5899680B2 (ja) パワー半導体モジュール
KR20210120355A (ko) 양면 냉각형 파워 모듈
JP2013026296A (ja) パワーモジュール
JP2003289124A (ja) 半導体モジュール
JP2017017229A (ja) 半導体装置
KR101897304B1 (ko) 파워 모듈
JP2023127609A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141023

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141023

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151222

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160229

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160322

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160419

R151 Written notification of patent or utility model registration

Ref document number: 5925052

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees