JP5918254B2 - 透過性領域を含む研磨パッド - Google Patents
透過性領域を含む研磨パッド Download PDFInfo
- Publication number
- JP5918254B2 JP5918254B2 JP2013540037A JP2013540037A JP5918254B2 JP 5918254 B2 JP5918254 B2 JP 5918254B2 JP 2013540037 A JP2013540037 A JP 2013540037A JP 2013540037 A JP2013540037 A JP 2013540037A JP 5918254 B2 JP5918254 B2 JP 5918254B2
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- JP
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- Prior art keywords
- polishing pad
- translucent insert
- translucent
- region
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41501510P | 2010-11-18 | 2010-11-18 | |
US61/415,015 | 2010-11-18 | ||
PCT/US2011/061312 WO2012068428A2 (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013542863A JP2013542863A (ja) | 2013-11-28 |
JP2013542863A5 JP2013542863A5 (ko) | 2014-06-26 |
JP5918254B2 true JP5918254B2 (ja) | 2016-05-18 |
Family
ID=46084662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013540037A Expired - Fee Related JP5918254B2 (ja) | 2010-11-18 | 2011-11-18 | 透過性領域を含む研磨パッド |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130237136A1 (ko) |
EP (1) | EP2641268A4 (ko) |
JP (1) | JP5918254B2 (ko) |
KR (1) | KR101602544B1 (ko) |
CN (1) | CN103222034B (ko) |
MY (1) | MY166716A (ko) |
SG (1) | SG190249A1 (ko) |
WO (1) | WO2012068428A2 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013123105A2 (en) * | 2012-02-14 | 2013-08-22 | Innopad, Inc. | Method of manufacturing a chemical mechanical planarization pad |
US20140370788A1 (en) * | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
CN106853610B (zh) | 2015-12-08 | 2019-11-01 | 中芯国际集成电路制造(北京)有限公司 | 抛光垫及其监测方法和监测系统 |
KR101829542B1 (ko) * | 2016-07-27 | 2018-02-23 | 신우유니온(주) | 손톱용 버퍼의 제조방법 |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
US11260495B2 (en) * | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
JP7317440B2 (ja) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | ドレッシング工具 |
JP7220130B2 (ja) * | 2019-07-11 | 2023-02-09 | 株式会社クラレ | 研磨パッド及び研磨パッドの製造方法 |
KR102593117B1 (ko) * | 2021-07-02 | 2023-10-24 | 에스케이엔펄스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
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US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5888120A (en) * | 1997-09-29 | 1999-03-30 | Lsi Logic Corporation | Method and apparatus for chemical mechanical polishing |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
US6280289B1 (en) * | 1998-11-02 | 2001-08-28 | Applied Materials, Inc. | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
US6716085B2 (en) * | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6247998B1 (en) * | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
US6071177A (en) * | 1999-03-30 | 2000-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for determining end point in a polishing process |
US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
EP1224060B1 (en) * | 1999-09-29 | 2004-06-23 | Rodel Holdings, Inc. | Polishing pad |
JP2001110762A (ja) * | 1999-10-04 | 2001-04-20 | Asahi Kasei Corp | 研磨パッド |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
JP2003133270A (ja) * | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
KR100541545B1 (ko) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | 화학기계적 연마 장비의 연마 테이블 |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US7261625B2 (en) * | 2005-02-07 | 2007-08-28 | Inoac Corporation | Polishing pad |
JP5534672B2 (ja) * | 2005-08-22 | 2014-07-02 | アプライド マテリアルズ インコーポレイテッド | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
US7764377B2 (en) * | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
US7210980B2 (en) * | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
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JP5110677B2 (ja) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
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JP2008226911A (ja) * | 2007-03-08 | 2008-09-25 | Jsr Corp | 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法 |
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-
2011
- 2011-11-18 JP JP2013540037A patent/JP5918254B2/ja not_active Expired - Fee Related
- 2011-11-18 MY MYPI2013001771A patent/MY166716A/en unknown
- 2011-11-18 US US13/988,144 patent/US20130237136A1/en not_active Abandoned
- 2011-11-18 KR KR1020137015580A patent/KR101602544B1/ko active IP Right Grant
- 2011-11-18 WO PCT/US2011/061312 patent/WO2012068428A2/en active Application Filing
- 2011-11-18 SG SG2013036363A patent/SG190249A1/en unknown
- 2011-11-18 CN CN201180055788.0A patent/CN103222034B/zh not_active Expired - Fee Related
- 2011-11-18 EP EP11841143.8A patent/EP2641268A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2013542863A (ja) | 2013-11-28 |
EP2641268A4 (en) | 2017-01-25 |
MY166716A (en) | 2018-07-18 |
US20130237136A1 (en) | 2013-09-12 |
WO2012068428A3 (en) | 2012-08-16 |
CN103222034A (zh) | 2013-07-24 |
SG190249A1 (en) | 2013-06-28 |
KR20130116892A (ko) | 2013-10-24 |
EP2641268A2 (en) | 2013-09-25 |
WO2012068428A2 (en) | 2012-05-24 |
CN103222034B (zh) | 2016-03-09 |
KR101602544B1 (ko) | 2016-03-10 |
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