JP5917796B2 - LED package device - Google Patents
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- JP5917796B2 JP5917796B2 JP2010159650A JP2010159650A JP5917796B2 JP 5917796 B2 JP5917796 B2 JP 5917796B2 JP 2010159650 A JP2010159650 A JP 2010159650A JP 2010159650 A JP2010159650 A JP 2010159650A JP 5917796 B2 JP5917796 B2 JP 5917796B2
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- 229920005989 resin Polymers 0.000 claims description 101
- 239000011347 resin Substances 0.000 claims description 101
- 239000003795 chemical substances by application Substances 0.000 description 23
- 238000009826 distribution Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- CVEPFOUZABPRMK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;styrene Chemical class CC(=C)C(O)=O.C=CC1=CC=CC=C1 CVEPFOUZABPRMK-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000019000 fluorine Nutrition 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002848 norbornenes Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Description
本発明は、ＬＥＤチップが搭載されて例えば液晶表示装置の光源等に使用可能なＬＥＤパッケージ装置に関するものである。 The present invention relates to an LED package device that is mounted with an LED chip and can be used, for example, as a light source of a liquid crystal display device.
ＬＥＤは、長寿命かつ小型で発光効率にも優れていることから、ディスプレイ、バックライト、照明等の各種用途への適用が広がっている。これらのなかでも、３色のＬＥＤチップを１つのパッケージに搭載したＬＥＤパッケージ装置は、電流の配分によってフルカラーが出せるものとしてカラーディスプレイに使用することができる。このようなＬＥＤパッケージ装置としては、例えば、下記の特許文献１に係るものが開示されている。 Since LEDs have a long life, are small, and are excellent in luminous efficiency, they are widely applied to various uses such as displays, backlights, and lighting. Among these, an LED package device in which LED chips of three colors are mounted in one package can be used for a color display as a device capable of producing a full color by current distribution. As such an LED package device, for example, a device according to Patent Document 1 below is disclosed.
特許文献１には、緑色のＬＥＤチップ（１０１）、赤色のＬＥＤチップ（１０２）、青色のＬＥＤチップ（１０３）が並べて配置され、各ＬＥＤチップ（１０１、１０２、１０３）をモールド（２０９）で保護するようにした多色発光素子が記載されている（括弧内の符号は公報記載のものである）。 In Patent Document 1, a green LED chip (101), a red LED chip (102), and a blue LED chip (103) are arranged side by side, and each LED chip (101, 102, 103) is molded with a mold (209). A multicolor light-emitting element designed to be protected is described (the reference numerals in parentheses are those described in the publication).
上記特許文献１には、上記モールド（２０９）として、樹脂を使用すること、指向性を緩和して視野角を増やすために拡散剤を含有させること、レンズ効果をもたせるために各種の形状にし、それを複数組み合わせること、樹脂モールド自体に着色してフィルターの役目を持たせること等が開示されている。 In Patent Document 1, as the mold (209), a resin is used, a diffusing agent is added to reduce the directivity and the viewing angle is increased, and various shapes are used to provide a lens effect. Combining a plurality of them, coloring the resin mold itself to give a filter function, and the like are disclosed.
しかしながら、上記特許文献１には、ＬＥＤチップのモールドとして一般的に行われている特性付与について記述があるにすぎない。 However, the above-mentioned Patent Document 1 only describes a characteristic imparting generally performed as an LED chip mold.
一方、近年では、ＬＥＤチップがカラーディスプレイ等の表示装置への用途が拡大するにともない、各発光素子の光吸収特性の違い等により、印加電圧を等しくしても全体として出力される光に違いが生じることによるカラーシフトが起こってしまうことが問題視されるようになってきた。具体的には、例えば、青色ＬＥＤから発光された青色光や緑色ＬＥＤから発光された緑色光は、隣接する赤色ＬＥＤに吸収されてしまい、結果として全体の色彩が赤色にシフトしてしまうことが生じている。 On the other hand, in recent years, as the application of LED chips to display devices such as color displays has expanded, due to differences in the light absorption characteristics of each light emitting element, etc., the difference in the light output as a whole even if the applied voltage is equalized. It has been regarded as a problem that color shift occurs due to the occurrence of. Specifically, for example, blue light emitted from a blue LED and green light emitted from a green LED are absorbed by an adjacent red LED, and as a result, the overall color may shift to red. Has occurred.
このようなカラーシフトが発生すると、カラーディスプレイ等に使用した際の色再現性に影響が出てしまい、極めて不都合である。 When such a color shift occurs, the color reproducibility when used in a color display or the like is affected, which is extremely inconvenient.
そこで、各発光素子毎に印加する電圧を制御することによりカラーシフトを改善することも考えられるが、各発光素子の輝度が異なることから、カラーディスプレイ等において各パッケージにおいて出力する光を所定の輝度や色合いに調整するには、制御が極めて複雑となる。 Therefore, it may be possible to improve the color shift by controlling the voltage applied to each light emitting element. However, since the brightness of each light emitting element is different, the light output from each package in a color display or the like has a predetermined brightness. In order to adjust to the color or the hue, the control becomes extremely complicated.
一方、上記特許文献２や特許文献３には、フィルムや有機層で光学特性を担保する技術が開示されている。 On the other hand, Patent Document 2 and Patent Document 3 disclose techniques for ensuring optical characteristics with a film or an organic layer.
このように、上記特許文献１をはじめ特許文献２や特許文献３においても、樹脂モールドによってカラーシフトを改善することについては、現在までのところ検討されていない。このように、ＬＥＤチップを保護するためにほぼ必須のものとして設けられる樹脂モールドによってカラーシフトを改善することができれば、上述したような制御面での問題も発生しないし、ディスプレイにしたときにフィルムを被覆する必要も生じず、極めて好都合である。 As described above, in Patent Document 1, Patent Document 2, and Patent Document 3 as well, improvement of color shift by resin molding has not been studied so far. In this way, if the color shift can be improved by the resin mold provided as an almost essential component for protecting the LED chip, the above-mentioned problem in terms of control will not occur, and the film will be used when the display is made. This is very convenient.
本発明は、このような事情に鑑みなされたもので、樹脂モールドによってカラーシフトの防止を実現したＬＥＤパッケージ装置の提供を目的とする。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide an LED package device that realizes prevention of color shift by a resin mold.
上記目的を達成するため、本発明のＬＥＤパッケージ装置は、少なくとも３個以上の異なる波長のＬＥＤと、各ＬＥＤが搭載されるリードフレームとを有するＬＥＤパッケージ装置であって、
上記リードフレームは上記各ＬＥＤが搭載されるカップ部を備え、
上記各ＬＥＤが搭載されたカップ部内には、搭載された各ＬＥＤを覆うように光透過性の第１樹脂モールドが設けられ、
少なくとも上記カップ部の開口を覆うように、光透過性の第２樹脂モールドが形成され、
上記第１樹脂モールドと第２樹脂モールドは、相互に屈折率が異なっていることを要旨とする。
To achieve the above object, an LED package device of the present invention is an LED package device having at least three LEDs having different wavelengths and a lead frame on which each LED is mounted,
The lead frame includes a cup portion on which the LEDs are mounted.
In the cup portion where each LED is mounted, a light-transmitting first resin mold is provided so as to cover each mounted LED,
A light transmissive second resin mold is formed so as to cover at least the opening of the cup part,
The gist is that the first resin mold and the second resin mold have different refractive indexes.
本発明のＬＥＤパッケージ装置は、上記各ＬＥＤが搭載されたカップ部内には、搭載された各ＬＥＤを覆うように光透過性の第１樹脂モールドが設けられ、少なくとも上記カップ部の開口を覆うように、光透過性の第２樹脂モールドが形成されている。これにより、各ＬＥＤから発光した光は第１樹脂モールドと第２樹脂モールドを透過して照射される。そして、第１樹脂モールドと第２樹脂モールドを、相互に屈折率が異ならせたことから、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。しかも、樹脂モールドによってカラーシフトを防止することにより、ディスプレイにしたときにフィルム等を被覆する必要がない。 In the LED package device of the present invention, a light-transmitting first resin mold is provided so as to cover each mounted LED in the cup portion where each LED is mounted, and at least covers the opening of the cup portion. In addition, a light transmissive second resin mold is formed. Thereby, the light emitted from each LED is transmitted through the first resin mold and the second resin mold and irradiated. Since the first resin mold and the second resin mold have different refractive indexes, color shift is effectively prevented, and good color reproducibility is exhibited when used in a color display or the like. Moreover, by preventing the color shift by the resin mold, it is not necessary to cover a film or the like when the display is made.
本発明において、上記第１樹脂モールドは、その表面が、カップ部の開口縁と面一もしくはそれよりもやや盛り上がるように設けられている場合には、配光特性の悪化を防止し、良好な配光特性を得る上で好ましい。 In the present invention, when the surface of the first resin mold is provided so that the surface thereof is flush with the opening edge of the cup portion or slightly higher than that, the deterioration of the light distribution characteristics is prevented, and the first resin mold is good. It is preferable for obtaining light distribution characteristics.
本発明において、上記リードフレームは脚部と端子部の少なくともいずれかを備え、上記第２樹脂モールドは、脚部および／または端子部の一部を露出するように形成されている場合には、脚部および／または端子部が露出されて電気的接続や放熱の妨げにならない。 In the present invention, the lead frame includes at least one of a leg portion and a terminal portion, and the second resin mold is formed so as to expose a part of the leg portion and / or the terminal portion. Legs and / or terminals are exposed and do not interfere with electrical connection or heat dissipation.
本発明において、第２樹脂モールドの屈折率は、第１樹脂モールドの屈折率よりも大きい場合には、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。 In the present invention, when the refractive index of the second resin mold is larger than the refractive index of the first resin mold, it effectively prevents color shift and exhibits good color reproducibility when used in a color display or the like. To do.
本発明において、第１樹脂モールドには光拡散剤が含有されているが、第２樹脂モールドには光拡散剤が含有されていない場合には、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。
In the present invention, the first resin mold contains a light diffusing agent, but when the second resin mold does not contain a light diffusing agent, the color shift is effectively prevented and a color display or the like is obtained. Good color reproducibility when used.
つぎに、本発明を実施するための最良の形態を説明する。 Next, the best mode for carrying out the present invention will be described.
図１は、本発明の第１実施形態のＬＥＤパッケージ装置を示す図であり、図１（Ａ）は平面図、図１（Ｂ）は同縦断面図である。 1A and 1B are diagrams showing an LED package device according to a first embodiment of the present invention. FIG. 1A is a plan view and FIG. 1B is a longitudinal sectional view thereof.
この例では、上記ＬＥＤパッケージ装置は、少なくとも３個以上の異なる波長のＬＥＤ２Ｒ、２Ｂ、２Ｇと、各ＬＥＤ２Ｒ、２Ｂ、２Ｇが搭載されるリードフレーム１とを有するＬＥＤパッケージ装置である。 In this example, the LED package device is an LED package device including at least three LEDs 2R, 2B, and 2G having different wavelengths and a lead frame 1 on which the LEDs 2R, 2B, and 2G are mounted.
上記異なる波長のＬＥＤ２Ｒ、２Ｂ、２Ｇは、具体的には赤色ＬＥＤ２Ｒ、青色ＬＥＤ２Ｂおよび緑色ＬＥＤ２Ｇである。上記赤色ＬＥＤ２Ｒ、青色ＬＥＤ２Ｂおよび緑色ＬＥＤ２Ｇは、いずれもリードフレーム１においてＬＥＤ２Ｒ、２Ｂ、２Ｇの光照射方向に向かう実装面３に実装されている。 The LEDs 2R, 2B, 2G having different wavelengths are specifically a red LED 2R, a blue LED 2B, and a green LED 2G. The red LED 2R, the blue LED 2B, and the green LED 2G are all mounted on the mounting surface 3 in the lead frame 1 in the light irradiation direction of the LEDs 2R, 2B, and 2G.
上記リードフレーム１は、金属薄板に対して深絞りや曲げ成形等の塑性加工を行うことにより形成されている。上記リードフレーム１は、この例では平面視においてトラック形状で上面に開放するカップ部５を備えている。そして、上記リードフレーム１のカップ部５の底面は、開放部側を向いて上記ＬＥＤ２Ｒ、２Ｂ、２Ｇがそれぞれ実装される実装面３として機能している。上記実装面３に上記各ＬＥＤ２Ｒ、２Ｂ、２Ｇが実装されて光を照射する。このとき、上記カップ部５の上広がり状の側壁内面は、各ＬＥＤ２Ｒ、２Ｂ、２Ｇから照射された光を反射する反射面４として機能する。 The lead frame 1 is formed by performing plastic working such as deep drawing or bending on a thin metal plate. In this example, the lead frame 1 includes a cup portion 5 that opens in a track shape in a plan view. The bottom surface of the cup portion 5 of the lead frame 1 functions as a mounting surface 3 on which the LEDs 2R, 2B, and 2G are respectively mounted facing the open side. The LEDs 2R, 2B, and 2G are mounted on the mounting surface 3 to irradiate light. At this time, the inner surface of the cup portion 5 that is spread upward functions as a reflective surface 4 that reflects the light emitted from the LEDs 2R, 2B, and 2G.
ここで、本実施形態において、上記リードフレーム１においてカップ部５の開放部側（この例では上面側）が光照射側であり、その方向が光照射方向、少なくともカップの上部開放部が光照射領域となる。 Here, in the present embodiment, in the lead frame 1, the open portion side (the upper surface side in this example) of the cup portion 5 is the light irradiation side, the direction is the light irradiation direction, and at least the upper open portion of the cup is light irradiated. It becomes an area.
上記リードフレーム１には、カップ部５の長手方向を軸とした片側の上端縁に、４つの脚部６が延設されている。また、上記リードフレーム１には、カップ部５の長手方向を軸とした反対側の上端縁において、端部よりの部分に、１つの脚部６が延設されている。上記脚部６は、カップ部５の上端縁の高さで横方向に延びてカップ部５を吊る部分と、その先端から下方に延びてカップ部５等を支える部分と、その下端から再び横方向に延びて取り付け面に接する部分とから構成されている。 In the lead frame 1, four leg portions 6 are extended at the upper end edge on one side with the longitudinal direction of the cup portion 5 as an axis. The lead frame 1 has one leg portion 6 extending from the end portion on the opposite upper end edge with the longitudinal direction of the cup portion 5 as an axis. The leg portion 6 extends laterally at the height of the upper edge of the cup portion 5 to suspend the cup portion 5, extends downward from the tip thereof to support the cup portion 5, etc. And a portion extending in the direction and in contact with the mounting surface.
上記リードフレーム１には、カップ部５の長手方向を軸とした反対側の上端縁における、上記１つの脚部６と並ぶように、３つの端子部材（本発明の端子部である）７が設けられている。上記各端子部材７は、上記カップ部５および脚部６とは別体として設けられている。上記端子部材７は、上記カップ部５の上端縁の高さよりも一段高い高さで横方向に延びて接続導線８を介してそれぞれＬＥＤ２Ｒ、２Ｂ、２Ｇと電気的に接続される部分と、その先端から下方に延びる部分と、その下端から再び横方向に延びて取り付け面に接する部分とから構成されている。 The lead frame 1 has three terminal members (the terminal portions of the present invention) 7 so as to be aligned with the one leg portion 6 at the upper end edge on the opposite side with the longitudinal direction of the cup portion 5 as an axis. Is provided. Each terminal member 7 is provided separately from the cup portion 5 and the leg portion 6. The terminal member 7 extends in the lateral direction at a height higher than the height of the upper end edge of the cup portion 5 and is electrically connected to the LEDs 2R, 2B, and 2G via the connection conductors 8, respectively. It is comprised from the part extended below from a front-end | tip, and the part extended again in the horizontal direction from the lower end, and contact | connects an attachment surface.
すなわち、上記リードフレーム１は、カップ部５と４つの脚部６が一体で形成され、３つの端子部材７が上記カップ部５および脚部６とは別体として形成され、これらカップ部５および４つの脚部６からなる第１のパーツおよび３つの端子部材７として機能する第２のパーツによって構成されている。 That is, the lead frame 1 has a cup portion 5 and four leg portions 6 formed integrally, and three terminal members 7 are formed separately from the cup portion 5 and the leg portions 6. The first part includes four legs 6 and the second part functions as three terminal members 7.
本実施形態では、上記各ＬＥＤ２Ｒ、２Ｂ、２Ｇを覆うように光透過性の樹脂モールド１０（保護部材として機能する）が設けられている。 In the present embodiment, a light transmissive resin mold 10 (functioning as a protective member) is provided so as to cover the LEDs 2R, 2B, and 2G.
上記樹脂モールド１０は、相互に屈折率の異なる第１樹脂モールド１１と第２樹脂モールド１２が、各ＬＥＤ２Ｒ、２Ｂ、２Ｇからの光照射領域の全域において積層されて存在している。 In the resin mold 10, a first resin mold 11 and a second resin mold 12 having different refractive indexes are laminated in the entire region irradiated with light from the LEDs 2R, 2B, and 2G.
上記第１樹脂モールド１１は、リードフレーム１のカップ部５内に光透過性の樹脂が充填されて搭載された各ＬＥＤ２Ｒ、２Ｂ、２Ｇを覆うように形成されている。また、上記第２樹脂モールド１２は、少なくとも上記カップ部５の開口を覆うように光透過性の樹脂が成形されることにより形成されている。この例では、第１樹脂モールド１１が充填されたリードフレーム１の周囲を覆うように成形されて配置されている。すなわち、各ＬＥＤ２Ｒ、２Ｂ、２Ｇの光照射方向において、内側に第１樹脂モールド１１が存在し、外側に第２樹脂モールド１２が存在している。 The first resin mold 11 is formed so as to cover the LEDs 2R, 2B, and 2G that are mounted by filling the cup portion 5 of the lead frame 1 with a light-transmitting resin. The second resin mold 12 is formed by molding a light transmissive resin so as to cover at least the opening of the cup portion 5. In this example, it is molded and arranged so as to cover the periphery of the lead frame 1 filled with the first resin mold 11. That is, the first resin mold 11 exists on the inner side and the second resin mold 12 exists on the outer side in the light irradiation direction of each LED 2R, 2B, 2G.
外側に配置された第２樹脂モールド１２の屈折率は、内側に配置された第１樹脂モールド１１の屈折率よりも大きくなるよう、第１樹脂モールド１１および第２樹脂モールド１２をそれぞれ構成する材質を選定している。 Materials constituting the first resin mold 11 and the second resin mold 12 so that the refractive index of the second resin mold 12 arranged on the outer side is larger than the refractive index of the first resin mold 11 arranged on the inner side. Is selected.
上記第１樹脂モールド１１を構成する材質としては、屈折率１．３５〜１．４５の範囲にあるシリコーン樹脂もしくはシリコーンゴムを用いることができる。上記シリコーン樹脂もしくはシリコーンゴムは、耐熱特性が優れ、かつ長期的に変色が無い信頼性に優れているという観点から、上記第１樹脂モールド１１を構成する材料として好適である。 As a material constituting the first resin mold 11, a silicone resin or a silicone rubber having a refractive index of 1.35 to 1.45 can be used. The silicone resin or silicone rubber is suitable as a material constituting the first resin mold 11 from the viewpoints of excellent heat resistance and excellent reliability without long-term discoloration.
また、上記第２樹脂モールド１２を構成する材質としては、屈折率１．４５〜１．６５の範囲にあるエポキシ樹脂を用いることができる。 Moreover, as a material which comprises the said 2nd resin mold 12, the epoxy resin which exists in the range of refractive index 1.45-1.65 can be used.
このようなカラーシフトを改善できる理由としては、以下のような理由が推測される。まず、第１樹脂モールド１１に含まれる拡散剤によりＲ（赤色）、Ｇ（緑色）、Ｂ（青色）３色が広い視野角に亘り完全拡散に近い状態で混合されるため、光の指向性が改善されることが考えられる。また、第１樹脂モールド１１と第２樹脂モールド１２との界面によるレンズ効果と、カップ部５内面との反射とが相まって光度を高めることによることが考えられる。さらに、第２樹脂モールド１２は耐湿度性に優れ、第１樹脂モールド１１を保護する効果も有って、屋外などの厳しい環境下でも優れた特性を持つ。
なお、ここでの屈折率は、真空を１．０としたときの絶対屈折率をいう。
The reason why the color shift can be improved is as follows. First, since the R (red), G (green), and B (blue) three colors are mixed in a state close to complete diffusion over a wide viewing angle by the diffusing agent contained in the first resin mold 11, the directivity of light Can be improved. Further, it is conceivable that the lens effect due to the interface between the first resin mold 11 and the second resin mold 12 and the reflection from the inner surface of the cup portion 5 combine to increase the luminous intensity. Further, the second resin mold 12 is excellent in moisture resistance, has an effect of protecting the first resin mold 11, and has excellent characteristics even in harsh environments such as outdoors.
In addition, the refractive index here means an absolute refractive index when the vacuum is 1.0.
上記第１樹脂モールド１１は、各ＬＥＤ２Ｒ、２Ｂ、２Ｇが実装されて接続導線８が溶接された状態のリードフレーム１のカップ部５内に樹脂材料が充填されて形成されている。このとき、第１樹脂モールド１１内に空気が気泡となって残留させると光学的な特性が低下するので好ましくない。 The first resin mold 11 is formed by filling a resin material in the cup portion 5 of the lead frame 1 in a state where the LEDs 2R, 2B, and 2G are mounted and the connection conductors 8 are welded. At this time, if air remains in the first resin mold 11 as bubbles, the optical characteristics deteriorate, which is not preferable.
また、第１樹脂モールド１１の表面は、カップ部５の上端縁と面一もしくは少し盛り上がる程度に樹脂材料を充填するのが、良好な配光特性を得る上で好ましい。すなわち、第１樹脂モールド１１の表面がカップ部５の上端縁に対して凹んでいると、配光特性が悪化し、カップ部５に充填する樹脂量が多すぎて、第１樹脂モールド１１の表面がカップ部５の周縁から部分的にはみ出すと、乱反射を生じて配光特性が極端に悪化するからである。 In addition, it is preferable that the surface of the first resin mold 11 is filled with a resin material so that the surface of the first resin mold 11 is flush with or slightly raised from the upper end edge of the cup portion 5 in order to obtain good light distribution characteristics. That is, if the surface of the first resin mold 11 is recessed with respect to the upper end edge of the cup portion 5, the light distribution characteristic is deteriorated, and the amount of resin filled in the cup portion 5 is too large. This is because if the surface partially protrudes from the peripheral edge of the cup portion 5, irregular reflection occurs and the light distribution characteristics are extremely deteriorated.
上記第２樹脂モールド１２は、上記リードフレーム１の脚部６および／または端子部材７の一部を露出するように形成するのが好ましい。この例では、第１樹脂モールド１１が充填されたカップ部５を完全に覆い、脚部６と端子部材７も取り付け面に接する面以外の部分が第２樹脂モールド１２で覆われている。このようにすることにより、カップ部５の変形、脚部６や端子部材７の脱落や変形等を防止するとともに、電気的接続や放熱にとっても妨げとならない。 The second resin mold 12 is preferably formed so as to expose a part of the leg portion 6 and / or the terminal member 7 of the lead frame 1. In this example, the cup part 5 filled with the first resin mold 11 is completely covered, and the leg part 6 and the terminal member 7 are also covered with the second resin mold 12 except for the surface in contact with the mounting surface. By doing in this way, while preventing the deformation | transformation of the cup part 5, the drop | offset | removal, a deformation | transformation, etc. of the leg part 6 or the terminal member 7, it does not become a hindrance to electrical connection or heat dissipation.
内側に配置された第１樹脂モールド１１には光拡散剤が含有されているが、外側に配置された第２樹脂モールド１２には光拡散剤が含有されていないことが好ましい。このようにすることにより、反射率および輝度が向上する。 The first resin mold 11 arranged on the inner side contains a light diffusing agent, but the second resin mold 12 arranged on the outer side preferably contains no light diffusing agent. By doing so, the reflectance and the luminance are improved.
上記光拡散剤としては、高分子系および無機系等各種のものを用いることができるが、第１樹脂モールド１１を構成する材料（例えばシリコーン樹脂もしくはシリコーンゴム）中において、マトリックス相と相溶しないかあるいは相溶しにくく粒子として分散して存在することが必要である。 As the light diffusing agent, various types such as a polymer type and an inorganic type can be used. However, in the material constituting the first resin mold 11 (for example, silicone resin or silicone rubber), the light diffusing agent is not compatible with the matrix phase. Alternatively, it is necessary that the particles are not compatible with each other and dispersed as particles.
上記光拡散剤の具体例としては、酸化アルミニウム、炭酸カルシウム、シリカ、シリコーン、硫化亜鉛、酸化亜鉛、酸化チタン、リン酸チタン、チタン酸マグネシウム、マイカ、ガラスフィラー、硫酸バリウム、クレー、タルク、シリコーンゴム状弾性体、ポリメチルシルセスオキサンなどの無機系拡散剤、アクリル系、スチレン系、ポリエステル系、ポリオレフィン系、ウレタン系、ナイロン系、メタクリレート−スチレン系、フッ素系、ノルボルネン系などの有機系拡散剤などがあげられる。 Specific examples of the light diffusing agent include aluminum oxide, calcium carbonate, silica, silicone, zinc sulfide, zinc oxide, titanium oxide, titanium phosphate, magnesium titanate, mica, glass filler, barium sulfate, clay, talc, and silicone. Rubber-like elastic materials, inorganic diffusing agents such as polymethylsilsesoxane, acrylics, styrenes, polyesters, polyolefins, urethanes, nylons, methacrylate-styrenes, fluorines, norbornenes, etc. Examples include diffusing agents.
さらに、光拡散剤の粒子径としては、拡散剤を添加することにより所望の光拡散性が得られるものであれば特に制限はないが、平均粒子径として１〜５０μｍ程度のものが好適に使用できる。１μｍ未満であると、光が透過されるのみで光拡散効果が得られにくくなる場合があるからである。一方、５０μｍを超えると、十分な光拡散効果が得られず視認性に劣る場合があるからである。 Further, the particle size of the light diffusing agent is not particularly limited as long as desired light diffusibility can be obtained by adding the diffusing agent, but those having an average particle size of about 1 to 50 μm are preferably used. it can. This is because if it is less than 1 μm, it may be difficult to obtain a light diffusion effect only by transmitting light. On the other hand, if it exceeds 50 μm, a sufficient light diffusion effect cannot be obtained and the visibility may be inferior.
光拡散剤の配合量としては、基材樹脂に対して０．１〜１０重量％が好適である。配合量が０．１重量％未満であると十分な光拡散効果が得られにくくなる場合があり、反対に、１０重量％を超えると光の透過性が損なわれ、かえって十分な光拡散性能が得られなくなる場合があるからである。より好ましくは、０．５〜５重量％の範囲である。 As a compounding quantity of a light-diffusion agent, 0.1 to 10 weight% is suitable with respect to base-material resin. If the blending amount is less than 0.1% by weight, it may be difficult to obtain a sufficient light diffusion effect. On the other hand, if it exceeds 10% by weight, the light transmittance is impaired, and on the contrary, sufficient light diffusion performance is obtained. This is because it may not be obtained. More preferably, it is in the range of 0.5 to 5% by weight.
さらに、平均粒子径、粒径分布および種類の異なる２種類以上の光拡散剤を併用してもよく、粒径分布が一様ではなく、２つ以上の粒径分布を有するものなどを単独または併用して使用することもできる。 Further, two or more kinds of light diffusing agents having different average particle sizes, particle size distributions, and types may be used in combination, and the particle size distribution is not uniform, and those having two or more particle size distributions are used alone or It can also be used in combination.
特に、無機系光拡散剤と有機系光拡散剤を併用することが効果的である。この場合の無機系光拡散剤としては、親水性フュームドシリカ、疎水性フュームドシリカ、親水性フュームド金属酸化物である酸化アルミニウムや酸化チタン等を好適に用いることができる。また、有機系光拡散剤としは、シリコーン・アクリル共重合体樹脂、架橋ポリメタクリル酸メチル、架橋ポリメタクリル酸ブチル、架橋ポリスチレン、架橋ポリアクリル酸エステル等を好適に用いることができる。 In particular, it is effective to use an inorganic light diffusing agent and an organic light diffusing agent in combination. As the inorganic light diffusing agent in this case, hydrophilic fumed silica, hydrophobic fumed silica, aluminum oxide or titanium oxide which is a hydrophilic fumed metal oxide can be suitably used. As the organic light diffusing agent, silicone / acrylic copolymer resin, crosslinked polymethyl methacrylate, crosslinked polybutyl methacrylate, crosslinked polystyrene, crosslinked polyacrylate, and the like can be suitably used.
上記第１樹脂モールド１１を構成する材料は、充填がしやすく作業が行いやすいうえ、高精度の計量を行ってモールド表面形状の安定性を得る必要性から、光拡散剤を分散配合した状態で、６Ｐａ・ｓ以下の粘度であることが好ましく、充填後に化学反応や溶剤の揮発除去により硬化させる。 The material constituting the first resin mold 11 is easy to fill and easy to work, and from the necessity of obtaining high-precision weighing to obtain the stability of the mold surface shape, in a state where a light diffusing agent is dispersed and blended The viscosity is preferably 6 Pa · s or less, and is cured by chemical reaction or solvent volatilization after filling.
つぎに、実施例について説明する。 Next, examples will be described.
図１に示すように、リードフレーム１に各ＬＥＤ２Ｒ、２Ｂ、２Ｇを実装し、屈折率１．４１のシリコーンゴムからなる第１樹脂モールド１１、屈折率１．５４のエポキシ樹脂からなる第２樹脂モールド１２を用いて実施例を作製した。なお、第１樹脂モールド１１には、拡散剤を０．５重量％添加した。 As shown in FIG. 1, each LED 2R, 2B, 2G is mounted on a lead frame 1, a first resin mold 11 made of silicone rubber having a refractive index of 1.41, and a second resin made of epoxy resin having a refractive index of 1.54. Examples were prepared using the mold 12. Note that 0.5 wt% of a diffusing agent was added to the first resin mold 11.
比較例として、第１樹脂モールド１１がなく、エポキシ樹脂による第２樹脂モールド１２だけを形成したものを作製した。 As a comparative example, the first resin mold 11 was not provided, and only the second resin mold 12 made of epoxy resin was formed.
図２は、上記実施例の配光特性の測定結果、図３は比較例の配光特性の測定結果（横置き）である。これらの結果に見られるように、比較例が、Ｒ（赤色）、Ｇ（緑色）、Ｂ（青色）各色の特性曲線がいびつであるのに対し、実施例は、Ｒ（赤色）、Ｇ（緑色）、Ｂ（青色）各色の特性曲線がいずれも円形に近いことが明らかである。この結果から、比較例では、角度によっていずれかの色彩が強く出てしまう指向特性があるのに対し、実施例では、いずれかの色彩が極端に強く出るような傾向がみられず、カラーシフト面で問題ないレベルであることがわかる。 FIG. 2 is a measurement result of the light distribution characteristics of the above-described embodiment, and FIG. As can be seen from these results, the comparative example has an irregular characteristic curve for each color of R (red), G (green), and B (blue), whereas the example shows that R (red), G ( It is clear that the characteristic curves of the respective colors (green) and B (blue) are almost circular. From this result, in the comparative example, there is a directivity characteristic in which any color appears strongly depending on the angle, whereas in the example, there is no tendency for any color to appear extremely strong, and the color shift It turns out that it is a level without a problem.
以上のように、本実施形態のＬＥＤパッケージ装置によれば、上記各ＬＥＤ２Ｒ、２Ｂ、２Ｇが搭載されたカップ部５内には、搭載された各ＬＥＤ２Ｒ、２Ｂ、２Ｇを覆うように光透過性の第１樹脂モールド１１が設けられ、少なくとも上記カップ部５の開口を覆うように、光透過性の第２樹脂モールド１２が形成されている。これにより、各ＬＥＤ２Ｒ、２Ｂ、２Ｇから発光した光は第１樹脂モールド１１と第２樹脂モールド１２を透過して照射される。そして、第１樹脂モールド１１と第２樹脂モールド１２を、相互に屈折率が異ならせたことから、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。しかも、樹脂モールド１０によってカラーシフトを防止することにより、ディスプレイにしたときにフィルム等を被覆する必要がない。 As described above, according to the LED package device of the present embodiment, the cup portion 5 in which the LEDs 2R, 2B, and 2G are mounted covers the LEDs 2R, 2B, and 2G that are mounted. The first resin mold 11 is provided, and a light transmissive second resin mold 12 is formed so as to cover at least the opening of the cup portion 5. Thereby, the light emitted from each LED 2R, 2B, 2G is transmitted through the first resin mold 11 and the second resin mold 12 and irradiated. Since the first resin mold 11 and the second resin mold 12 have different refractive indexes, color shift is effectively prevented, and good color reproducibility is exhibited when used for a color display or the like. . Moreover, by preventing the color shift by the resin mold 10, it is not necessary to cover a film or the like when the display is made.
また、上記第１樹脂モールド１１は、その表面が、カップ部５の開口縁と面一もしくはそれよりもやや盛り上がるように設けられている場合には、配光特性の悪化を防止し、良好な配光特性を得る上で好ましい。
ここで、良好な配光特性を得る理由としては、以下のことが推察される。まず、１種類の樹脂モールドでは赤色ＬＥＤ２Ｒの配光の特性を修正できなかったのに対し、２種類の樹脂モールドにより光の境界を設けることでレンズ効果が生じる。このレンズ効果により赤色ＬＥＤ２Ｒの配光特性が改善され、結果として全体としての配光特性が改善される。また、シリコーンがカップ部５よりもやや盛り上がることにより、凸レンズ効果が生まれ、その形状を変化させることにより、配光を制御することが出来る。
In addition, when the first resin mold 11 is provided so that the surface thereof is flush with the opening edge of the cup portion 5 or slightly higher than that, the light distribution characteristics are prevented from deteriorating and good. It is preferable for obtaining light distribution characteristics.
Here, the reason for obtaining good light distribution characteristics is presumed as follows. First, the light distribution characteristics of the red LED 2R could not be corrected with one type of resin mold, whereas a lens effect is produced by providing a light boundary with two types of resin mold. This lens effect improves the light distribution characteristic of the red LED 2R, and as a result, the light distribution characteristic as a whole is improved. Moreover, the convex lens effect is born when silicone rises slightly from the cup portion 5, and the light distribution can be controlled by changing its shape.
また、上記リードフレーム１は脚部６と端子部材７の少なくともいずれかを備え、上記第２樹脂モールド１２は、脚部６および／または端子部材７の一部を露出するように形成されている場合には、脚部６および／または端子部材７が露出されて電気的接続や放熱の妨げにならない。 The lead frame 1 includes at least one of a leg portion 6 and a terminal member 7, and the second resin mold 12 is formed so as to expose a part of the leg portion 6 and / or the terminal member 7. In this case, the leg portion 6 and / or the terminal member 7 are exposed and do not hinder electrical connection or heat dissipation.
また、第２樹脂モールド１２の屈折率は、第１樹脂モールド１１の屈折率よりも大きい場合には、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。 Further, when the refractive index of the second resin mold 12 is larger than the refractive index of the first resin mold 11, it effectively prevents color shift and exhibits good color reproducibility when used in a color display or the like. To do.
また、第１樹脂モールド１１には光拡散剤が含有されているが、第２樹脂モールド１２には光拡散剤が含有されていない場合には、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。
In addition, when the first resin mold 11 contains a light diffusing agent, but the second resin mold 12 does not contain a light diffusing agent, color shift is effectively prevented, and a color display or the like is achieved. Good color reproducibility when used.
１ リードフレーム
２Ｒ 赤色ＬＥＤ
２Ｂ 青色ＬＥＤ
２Ｇ 緑色ＬＥＤ
３ 実装面
４ 反射面
５ カップ部
６ 脚部
７ 端子部材
８ 接続導線
１０ 樹脂モールド
１１ 第１樹脂モールド
１２ 第２樹脂モールド
1 Lead frame 2R Red LED
2B Blue LED
2G green LED
DESCRIPTION OF SYMBOLS 3 Mounting surface 4 Reflecting surface 5 Cup part 6 Leg part 7 Terminal member 8 Connection conducting wire 10 Resin mold 11 1st resin mold 12 2nd resin mold
Claims (2)
上記リードフレームは上記各ＬＥＤが搭載されるカップ部を備え、
上記各ＬＥＤが搭載されたカップ部内には、搭載された各ＬＥＤを覆うように光透過性の第１樹脂モールドが設けられ、
少なくとも上記カップ部の開口を覆うように、上記第１樹脂モールドと接触するように、光透過性の第２樹脂モールドが形成され、
上記第１樹脂モールドと第２樹脂モールドは、相互に屈折率が異なっていて、第２樹脂モールドの屈折率は、第１樹脂モールドの屈折率よりも大きく、
上記第１樹脂モールドは、その表面が、上記カップ部の開口縁と面一になるように設けられ、
上記第２樹脂モールドは、上記第１樹脂モールドの表面と接触する面と、上記接触する面の反対側を向く平坦な上面と、平坦な下面と、を有し、
上記リードフレームは、上記カップ部の長手方向を軸とした片側の第１上端縁、及び上記カップ部の長手方向を軸とした反対側の第２上端縁のそれぞれに延設された脚部と、上記第２上端縁の脚部と並ぶように設けられた端子部と、を含み、
上記脚部は、
上記第１上端縁及び第２上端縁のそれぞれに設けられ、上記カップ部の上端縁の高さで横方向に延びて上記カップ部を吊る第１部分と、
上記第１上端縁に設けられた第１部分の先端から下方に延びてカップ部を支える第２部分と、
上記第２部分の下端から再び横方向に延びて取り付け面に接する第１接触面を有する第３部分と、を有し、
上記端子部は、
上記第２上端縁に設けられた第１部分と対向し、上記カップ部の上端縁の高さよりも一段高い高さで横方向に延びて接続導線を介してＬＥＤと電気的に接続される第４部分と、
上記第４部分の先端から下方に延びる第５部分と、
上記第５部分の下端から再び横方向に延びて取り付け面に接する第２接触面を有する第６部分と、を有し、
上記第２樹脂モールドは、上記第３部分の第１接触面以外の上記脚部の部分、及び上記第６部分の第２接触面以外の上記端子部の部分を覆って、上記第１接触面及び第２接触面のみが上記第２樹脂モールドから露出するように形成され、
上記第１接触面及び第２接触面は、上記第２樹脂モールドの下面の周縁に配置され、上記下面と面一である、
ことを特徴とするＬＥＤパッケージ装置。 An LED package device having at least three LEDs having different wavelengths and a lead frame on which each LED is mounted,
The lead frame includes a cup portion on which the LEDs are mounted.
In the cup portion where each LED is mounted, a light-transmitting first resin mold is provided so as to cover each mounted LED,
A light transmissive second resin mold is formed so as to be in contact with the first resin mold so as to cover at least the opening of the cup portion.
The first resin mold and the second resin mold have different refractive indexes, and the refractive index of the second resin mold is larger than the refractive index of the first resin mold,
The first resin mold is provided so that the surface thereof is flush with the opening edge of the cup part,
The second resin mold, possess the the surface in contact with the first resin mold surface, and a flat upper surface facing the opposite surface of the contact, and a flat lower surface, the,
The lead frame includes a leg portion extending on each of a first upper end edge on one side about the longitudinal direction of the cup portion and a second upper end edge on the opposite side about the longitudinal direction of the cup portion; A terminal portion provided so as to be aligned with the leg portion of the second upper end edge,
The legs are
A first portion that is provided on each of the first upper edge and the second upper edge, extends in the horizontal direction at the height of the upper edge of the cup portion, and suspends the cup portion;
A second portion that extends downward from the tip of the first portion provided at the first upper edge to support the cup portion;
A third portion having a first contact surface extending laterally again from the lower end of the second portion and contacting the mounting surface;
The terminal part is
The second portion is opposed to the first portion provided at the second upper end edge, extends in a lateral direction at a height higher than the height of the upper end edge of the cup portion, and is electrically connected to the LED through a connecting lead. 4 parts,
A fifth portion extending downward from the tip of the fourth portion;
A sixth portion having a second contact surface extending laterally again from the lower end of the fifth portion and contacting the mounting surface;
The second resin mold covers the portion of the leg portion other than the first contact surface of the third portion and the portion of the terminal portion other than the second contact surface of the sixth portion, and the first contact surface. And only the second contact surface is exposed from the second resin mold,
The first contact surface and the second contact surface are disposed on the periphery of the lower surface of the second resin mold, and are flush with the lower surface.
An LED package device.
Priority Applications (7)
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| JP2010159650A JP5917796B2 (en) | 2010-07-14 | 2010-07-14 | LED package device |
| CN201180034440.3A CN102986045B (en) | 2010-07-14 | 2011-07-12 | LED packaging system |
| KR1020137000797A KR101572466B1 (en) | 2010-07-14 | 2011-07-12 | Led package device |
| PCT/JP2011/066294 WO2012008600A1 (en) | 2010-07-14 | 2011-07-12 | Led package device |
| DE112011102336T DE112011102336T5 (en) | 2010-07-14 | 2011-07-12 | LED package arrangement |
| TW100124971A TWI527270B (en) | 2010-07-14 | 2011-07-14 | Led package device |
| HK13107338.1A HK1180453A1 (en) | 2010-07-14 | 2013-06-24 | Led package device led |
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| JP6188408B2 (en) * | 2013-05-07 | 2017-08-30 | 三菱電機株式会社 | LED display element and video display device |
| KR101483010B1 (en) * | 2013-07-29 | 2015-01-19 | 주식회사 굿엘이디 | Light Emitting Diode package |
| JP6544076B2 (en) | 2014-12-26 | 2019-07-17 | 日亜化学工業株式会社 | Light emitting device |
| TWI570965B (en) * | 2015-02-26 | 2017-02-11 | 友達光電股份有限公司 | Illumination device and display having the illumination device |
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| JPH0563068U (en) * | 1992-01-31 | 1993-08-20 | シャープ株式会社 | Resin-sealed light emitter |
| JP3235470B2 (en) * | 1996-06-18 | 2001-12-04 | 日亜化学工業株式会社 | Optical semiconductor device and light emitting device using the same |
| JP3967459B2 (en) * | 1998-05-29 | 2007-08-29 | ローム株式会社 | Semiconductor device |
| JP2002198570A (en) * | 2000-12-26 | 2002-07-12 | Toyoda Gosei Co Ltd | Solid state optical element |
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| JP2012023189A (en) | 2012-02-02 |
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| HK1180453A1 (en) | 2013-10-18 |
| DE112011102336T5 (en) | 2013-04-18 |
| TWI527270B (en) | 2016-03-21 |
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| TW201232839A (en) | 2012-08-01 |
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