KR102224077B1 - Light emitting device - Google Patents

Abstract

The light emitting device according to the embodiment includes a body; A light emitting chip on the body; An adhesive material disposed on a side surface of the light emitting chip to support the light emitting chip on the body; First and second lead frames coupled to the body and electrically connected to the light emitting chip; And a molding member including a phosphor on the light emitting chip.

Description

Light emitting device{LIGHT EMITTING DEVICE}

The embodiment relates to a light emitting device. The light emitting device may be included in a lighting system.

A light emitting device is a device having a characteristic of converting electrical energy into light energy, and LEDs can implement various colors by adjusting the composition ratio of a compound semiconductor.

For example, nitride semiconductors are attracting great interest in the development of optical devices and high-power electronic devices due to their high thermal stability and wide bandgap energy. In particular, a blue light emitting device, a green light emitting device, and an ultraviolet (UV) light emitting device using a nitride semiconductor have been commercialized and widely used.

LED emitting white light is a method of using a secondary light source that emits light from a phosphor by applying a phosphor, and a method of obtaining white light by applying a yellow YAG:Ce phosphor to a blue LED is common.

However, the method has a disadvantage in that it is accompanied by a reduction in efficiency due to quantum deficits and re-emission efficiency generated while using secondary light, and color rendering is not easy.

Accordingly, recently, LEDs using various phosphors have been used, and research is being conducted to improve light efficiency.

The embodiment provides a light emitting device with improved light efficiency.

The embodiment provides a light emitting device having improved adhesion of a light emitting chip.

The light emitting device according to the embodiment includes a body; A light emitting chip on the body; An adhesive material disposed on a side surface of the light emitting chip to support the light emitting chip on the body; A first lead frame and a second lead frame coupled to the body and electrically connected to the light emitting chip; And a molding member including a phosphor on the light emitting chip, wherein the light emitting chip includes a transparent substrate and a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer on the transparent substrate, and the adhesion The refractive index of the material is less than or equal to the refractive index of the transparent substrate, and may include a material that is greater than or equal to the refractive index of the molding member.

According to the embodiment, a light emitting device having improved light efficiency can be provided.

According to the embodiment, it is possible to provide a light emitting device having improved adhesion of a light emitting chip.

1 is a cross-sectional view of a light emitting device according to a first embodiment.
2 is a cross-sectional view of a light emitting device according to a second embodiment.
3 is a diagram illustrating a light emitting chip that can be used in embodiments.
4 is a perspective view illustrating a display device having light emitting devices according to exemplary embodiments.
5 is a perspective view illustrating a display device having light emitting devices according to exemplary embodiments.
6 is an exploded perspective view showing a lighting device having a light emitting device according to embodiments.

In the description of the embodiment, each layer (film), region, pattern or structure is "on/over" or "under" of the substrate, each layer (film), region, pad, or patterns. In the case of being described as being formed in, "on/over" and "under" include both "directly" or "indirectly" formed do. In addition, the criteria for the top/top or bottom of each layer will be described based on the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not fully reflect the actual size.

1 is a cross-sectional view showing a light emitting device according to a first embodiment.

Referring to FIG. 1, the light emitting device 10 includes a body 11, first and second lead frames 21 and 23, a light emitting chip 300 including a transparent substrate 311, an adhesive material 28, and And a first molding member 41 having phosphors 31, 32, and 33.

The body 11 may be formed of a material having a reflectance higher than transmittance, for example, a material having a reflectance of 70% or more for light having a wavelength emitted by the light emitting chip 300. When the body 11 has a reflectance of 70% or more, it may be defined as a non-transmissive material. The body 11 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA). The body 11 may be formed by adding a metal oxide to a resin material such as epoxy or silicon, and the metal oxide includes _{at least one of TiO 2} , SiO ₂ , Al ₂ O ₃ , and the body 11 It may be added in an amount of 3wt% or more. The body 11 may effectively reflect incident light. Here, when the content of the metal oxide added in the body 11 is 3wt% or less, the reflection efficiency may decrease, and when the reflection efficiency decreases, the light directivity distribution may change.

The body 11 includes a silicone-based, epoxy-based, or plastic material, and may be formed of a thermosetting resin, or a high heat resistance, high light resistance material. In addition, at least one of an acid anhydride, an antioxidant, a release material, a light reflecting material, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added to the body 11. The body 11 may be molded by at least one selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and an acid composed of hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride 4-methylhexahydro phthalic anhydride, etc. Anhydride was added DBU (1,8-Diazabicyclo(5,4,0)undecene-7) as a curing accelerator to the epoxy resin, ethylene glycol, titanium oxide pigment, and glass fiber as a cocatalyst, and partially by heating. A solid epoxy resin composition obtained by curing reaction and forming a B stage may be used, but the present invention is not limited thereto.

In addition, a light-shielding material or a diffusing agent may be mixed in the body 11 to reduce transmitted light. In addition, in order for the body 11 to have a predetermined function, at least one selected from the group consisting of a diffusing agent, a pigment, a fluorescent material, a reflective material, a light-shielding material, a light stabilizer, and a lubricant is properly mixed with a thermosetting resin. You may do it.

The body 11 includes a cavity 15 recessed or opened to a predetermined depth from the upper surface of the body 11. The cavity 15 may be formed in a shape such as a concave cup structure, an open structure, or a recess structure, but is not limited thereto.

First and second lead frames 21 and 23 are coupled to the body 11, and the first and second lead frames 21 and 23 may be disposed on the bottom of the cavity 15, thereby It is not limited to. The lower portions of the first and second lead frames 21 and 23 may be exposed to the lower portion of the body 11, or portions of the first and second lead frames 21 and 23 may be bent. have. The first lead frame 21 and the second lead frame 23 are made of metal, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum. It may contain at least one of nium (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P), and may be formed as a single layer or multiple layers. The first and second lead frames 21 and 23 may have a thickness of 0.15 mm or more, for example, 0.18 mm or more.

As another example of the first and second lead frames 21 and 23, at least one of the first and second lead frames 21 and 23 is formed in a concave cup-shaped structure, or has a bent structure, , It may include a recessed groove or hole for coupling with the body 11, but is not limited thereto.

A light emitting chip 300 is disposed on the first lead frame 21, and the light emitting chip 300 is adhered to the first lead frame 21 by an adhesive material 28. The light emitting chip 300 is disposed on the body 11, and the light emitting chip 300 may be adhered to the body 11 by the adhesive material 28. That is, the light emitting chip 300 is disposed and supported on the body 11 and is fixed to the body 11 by the adhesive material 28. Since the adhesive material 28 is formed while surrounding the circumference of the light emitting chip 300, the adhesion area is large, so that the adhesion of the light emitting chip 300 may be improved.

The light emitting chip 300 includes a transparent substrate 311, and the transparent substrate 311 may be formed of a material having a refractive index of 1.75 to 1.8 in a visible light region. For example, the transparent substrate 311 may be formed of a sapphire substrate, and the light emitting chip 300 may be grown on the transparent substrate 311 or attached to the transparent substrate 311.

The adhesive material 28 is disposed on the side surface of the transparent substrate 311 to allow the light emitting chip 300 to be adhered to the first lead frame 21 or the body 11. The adhesive material 28 may also be disposed on a side surface of the first conductive type semiconductor layer of the light emitting chip 300. In addition, the adhesive material 28 may also be disposed between the lower portion of the transparent substrate 311 and the first lead frame 21.

The adhesive material 28 functions to fix the light emitting chip 300 to the first lead frame 21 or the body 11, and at the same time, the light generated from the light emitting chip 300 is effectively Let it be extracted.

The refractive index of the adhesive material 28 may be less than or equal to the refractive index of the transparent substrate 311 and may be formed of a material that is greater than or equal to the refractive index of the first molding member 41.

For example, the refractive index of the first molding member 41 may be 1.4 to 1.55, the refractive index of the adhesive material 28 may be 1.4 to 1.8, and the refractive index of the transparent substrate 311 may be 1.75 to 1.8.

The light transmittance of the adhesive material 28 is 80% or more, and may be, for example, 90% or more.

Accordingly, light traveling in a downward direction, that is, in the direction in which the first lead frame 21 is disposed, among the light generated from the light emitting chip 300 is transmitted through the transparent substrate 311 and the adhesive material 28. Since it can be effectively discharged to the molding member 41, light efficiency can be increased.

The light emitting chip 300 may be connected to at least one of the first and second lead frames 21 and 23, but is not limited thereto. The connection member 27 includes a wire made of a conductive material, for example, a metal material.

The light emitting chip 300 emits a peak wavelength in the range of 400 nm to 600 nm in the wavelength range of visible light. For example, the light emitting chip 300 may emit a blue peak wavelength.

The cavity 15 is filled with the first molding member 41, and the first molding member 41 includes phosphors 31, 32, and 33. The phosphors 31, 32, and 33 may be formed of only one type, or may be formed of various types. However, in the embodiment, three types of phosphors 31, 32, and 33 are illustrated.

The phosphors 31, 32, and 33 may be added in an amount of 5 wt% or more, for example, 9 wt% or more, in the first molding member 41. The phosphors 31, 32, and 33 may be added in the range of 8wt% to 25wt% in the first molding member 41.

The phosphors (31, 32, 33) include a first phosphor (31) emitting a first peak wavelength, a second phosphor (32) emitting a second peak wavelength, and a third phosphor (33) emitting a third peak wavelength. ) Can be included. For example, the first phosphor 31 is a green phosphor, the second phosphor 32 is a yellow phosphor, and the third phosphor 33 includes a red phosphor. The first to third phosphors 31, 32, and 33 include phosphors emitting different peak wavelengths, for example, nitride phosphors.

The first phosphor 31 is a green phosphor, contains N, and contains at least two elements from the group consisting of La, Si, Ba, Al, Ca, and Sr. For example, when Eu ^{2 +} ions are added as the center of light emission, the phosphor composition becomes a phosphor that excites with ultraviolet, near ultraviolet, purple, and blue light, and emits green light. The first phosphor 31 is, for example, La ₃ Si ₆ N _11: Ce ^{3 +} may include, as another example _{^{BaSiN 2: Eu 2 +, Sr}} 1 .5 Al 3 Si 9 N 16: Eu 2 + _{, Ca 1 .5 A1 3 Si 9} N 16: Eu 2 +, CaSiA1 2 O 3 N 2: Eu 2 +, SrSiA1 2 O 3 N 2: Eu 2+, CaSi 2 O 2 N 2: Eu 2 +, SrSi ₂ O ₂ N ₂ :Eu ^{2 +} , BaSi ₂ O ₂ N ₂ :Eu ^{2 +} , Sr ₂ Si ₅ N ₈ :Ce ^{3 +} , Ca _1.5 Al ₃ Si ₉ N ₁₆ :Ce ³⁺ It may contain at least one have.

The second phosphor 32 is a yellow phosphor, includes N, and includes at least two elements selected from the group consisting of Mg, Ca, Sr, Ba, and Zn, and using such a composition as a phosphor matrix, For example, when Eu ^{2 +} ions are added as the center of light emission, the phosphor composition becomes a phosphor that excites with ultraviolet, near ultraviolet, purple, and blue light, and emits light in a warm yellow color system. As an example of the second phosphor, (Sr,Ba) ₁ Si ₂ O ₂ N _{2 :} Eu ^{2 +} may be included, and as another example, (Sr _X Ca _{1 -X} ) ₂ Si ₅ N ₈ :Eu ^{2 +} , Sr ₂ Si ₅ N ₈ :Eu ^{2 +} , Ca ₂ Si ₅ N ₈ :Eu ^{2 +} , Sr _X Ca _{1 - X} Si ₇ N ₁₀ :Eu ^{2 +} , SrSi ₇ N ₁₀ :Eu ^{2 +} , CaSi _{7 ^{N 10: Eu 2+, Ca 1}} .5 a 13 Si 9 N 16: Eu 2 +, CaSiA 12 O 3 N 2: may comprise at least one of a phosphor represented by Eu ^{+ 2.}

The third phosphor 33 is a red phosphor, including N, and at least one element selected from Be, Mg, Ca, Sr, Ba, and Zn, C, Si, Ge, Sn, Ti, Zr, And at least one element selected from Hf, and a nitride-based phosphor activated with at least one element selected from rare earth elements, particularly SrAlSiN ₃ or CaAlSiN ₃ It is preferably represented by a composition formula or a chemical formula. For example, (Sr, Ca) AlSiN ₃ , (Sr, Mg) AlSiN ₃ , (Ca, Mg) AlSiN ₃ , (Sr, Ca, Ba) AlSiN _{3 It} may be a composition having a plurality of alkaline earth metal elements. In addition, O (oxygen) in the above compositional formula is an impurity element that enters during manufacture of the phosphor composition. The third phosphor may include, for example, (Sr,Ca)AlSiN ₃ : Eu ^{2 +} , and as another example, Sr ₂ Si ₅ N ₈ :EU ^{2 +} , SrSiN ₂ :EU ^{2 +} , SrAlSiN ₃ :Eu ^{2 +} , CaAlSiN ₃ :EU ^{2 +} , Sr ₂ Si ₄ AlON ₇ :Eu ^{2 +} It may include at least one of.

Active agent in the first to third fluorescent material (31,32,33) is or Eu2 +, and can be appropriately selected according to the needs of various rare-earth ions or transition metal ion is selected from metal ions, for example, Ce ^{+ 3,} Trivalent rare earth metal ions such as ^{Pr 3 +} , Nd ³⁺ , Sm ^{3 +} , EU ^{3 +} , Gd ^{3 +} , Tb ^{3 +} , Dy ^{3 +} , Ho ^{3 +} , Er ^{3 +} , Tm ^{3 +} and Yb ^{3 +} , Sm ^{2 +} , Eu ^{2 +} , and divalent rare earth metal ions such as ^{Yb 2 + , divalent transition metal ions such as Mn 2+} , trivalent transition metal ions such as Cr ^{3 +} or Fe ^{3 +} , Mn ^{4 +,} etc. And tetravalent transition metal ions of.

2 is a view showing a light emitting device according to a second embodiment. In describing FIG. 2, the same portions as in FIG. 1 will be referred to the description of FIG. 1.

2, a first molding member 41 and a second molding member 40 are filled in the cavity 15, and the second molding member 40 is similar to the first molding member 41. It may be formed of a resin material such as silicone or epoxy. The refractive index of the second molding member 40 may be greater than or equal to the refractive index of the first molding member 41. In this case, light may be effectively extracted from the second molding member 40 to the first molding member 41.

2 illustrates that phosphors 31, 32, and 33 are formed only in the first molding member 40, but the phosphors 31, 32, and 33 may also be distributed in the second molding member 40. .

3 is a diagram illustrating a light emitting chip 300 that can be used in the light emitting device 10 according to embodiments.

The light emitting chip 300 according to the embodiment includes a transparent substrate 311, a buffer layer 312, a light emitting structure 310, a first electrode 316 and a second electrode 317. The transparent substrate 311 includes an insulating substrate made of a translucent material.

The buffer layer 312 reduces a difference in lattice constant between the transparent substrate 311 and the material of the light emitting structure 310, and may be formed of a nitride semiconductor. A nitride semiconductor layer not doped with a dopant may be further formed between the buffer layer 312 and the light emitting structure 310 to improve crystal quality.

The light emitting structure 310 includes a first conductive type semiconductor layer 313, an active layer 314, and a second conductive type semiconductor layer 315.

The first conductive type semiconductor layer 313 is implemented as a group III-V compound semiconductor doped with a first conductive type dopant, and the first conductive type semiconductor layer 313 is In _x Al _y Ga _{1 -x- and a composition formula of y} N (0≦x≦1, 0≦y≦1, 0≦x+y≦1). The first conductive semiconductor layer 313 is a stacked structure of layers including at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. It may include. The first conductive semiconductor layer 313 is an n-type semiconductor layer, and the first conductive dopant is an n-type dopant and includes Si, Ge, Sn, Se, and Te.

A first cladding layer may be formed between the first conductive semiconductor layer 313 and the active layer 314. The first cladding layer may be formed of a GaN-based semiconductor, and a band gap thereof may be formed to be greater than or equal to the band gap of the active layer 314. This first cladding layer is formed in a first conductive type and serves to confine a carrier.

The active layer 314 is disposed on the first conductive semiconductor layer 313 and selectively includes a single quantum well, a multiple quantum well (MQW), a quantum wire structure, or a quantum dot structure. do. The active layer 314 includes a cycle of a well layer and a barrier layer. The well layer includes _{a composition formula of In x} Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and the barrier layer is In _x Al _y A composition formula of Ga _1-xy N (0≦x≦1, 0≦y≦1, 0≦x+y≦1) may be included. The cycle of the well layer/barrier layer may be formed in one or more cycles using a stacked structure of, for example, InGaN/GaN, GaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, InAlGaN/InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than that of the well layer.

A second conductive semiconductor layer 315 is formed on the active layer 314. The second conductivity type semiconductor layer 315 is a semiconductor doped with a second conductivity type dopant, for example, In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+) The composition formula of y≤1) is included. The second conductive semiconductor layer 315 may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. The second conductive type semiconductor layer 315 is a p-type semiconductor layer, and the second conductive type dopant is a p-type dopant, and may include Mg, Zn, Ca, Sr, and Ba.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN/GaN superlattice structure or an AlGaN/GaN superlattice structure. The superlattice structure of the second conductive type semiconductor layer 315 may irregularly diffuse a current included in a voltage to protect the active layer 314.

In addition, the conductive type of the light emitting structure 310 may be reversely disposed. For example, the first conductive type semiconductor layer 313 is a P type semiconductor layer, and the second conductive type semiconductor layer 315 is disposed as an n type semiconductor layer. can do. A first conductive type semiconductor layer having a polarity opposite to that of the second conductive type may be further disposed on the second conductive type semiconductor layer 315.

The light emitting structure 310 may be implemented in any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Here, p is a p-type semiconductor layer, n is an n-type semiconductor layer, and'-' includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer are in direct contact or indirect contact. Hereinafter, for convenience of description, the uppermost layer of the light emitting structure 310 will be described as a second conductive semiconductor layer 315.

A first electrode 316 is disposed on the first conductive type semiconductor layer 313, and a second electrode 317 having a current diffusion layer is disposed on the second conductive type semiconductor layer 315.

<Lighting system>

The light emitting device 10 or the light emitting chip 300 according to the embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light-emitting elements are arrayed, and includes the display device shown in FIGS. 4 and 5, and the lighting device shown in FIG. 6, and may include a lighting lamp, a traffic light, a vehicle headlight, an electric sign, etc. have.

4 is an exploded perspective view of a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 4, a display device 1000 according to an exemplary embodiment includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), an optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light source module 1031, and a reflective member 1022. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 is made of a transparent material, for example, an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may contain one of the resins.

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device. The light source module 1031 includes at least one, and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a substrate 1033 and a light emitting device 200 according to the disclosed embodiment, and the light emitting devices 1035 may be arrayed on the substrate 1033 at predetermined intervals.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB), and the like, but is not limited thereto. When the light emitting device 200 is mounted on a side surface of the bottom cover 1011 or on a heat dissipation plate, the substrate 1033 may be removed. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

In addition, the plurality of light emitting devices 200 may be mounted on the substrate 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but the embodiment is not limited thereto. The light-emitting device 200 may directly or indirectly provide light to a light-incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects light incident on the lower surface of the light guide plate 1041 and directs it upward, thereby improving the luminance of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a receiving portion 1012 having a box shape with an open top surface, but the embodiment is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but the embodiment is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes first and second substrates made of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, and the structure of the polarizing plate is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 can be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041, and includes at least one translucent sheet. The optical sheet 1051 may include at least one of, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, the horizontal or/and vertical prism sheet condenses incident light to a display area, and the brightness enhancement sheet reuses lost light to improve luminance. In addition, a protective sheet may be disposed on the display panel 1061, but the embodiment is not limited thereto.

Here, as an optical member on the light path of the light source module 1031, the light guide plate 1041 and the optical sheet 1051 may be included, but the embodiment is not limited thereto.

5 is a diagram illustrating a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 5, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the above-described light emitting devices 200 are arrayed, an optical member 1154, and a display panel 1155.

The substrate 1120 and the light emitting device 200 may be defined as a light source module 1160. The bottom cover 1152, at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include an accommodating part 1153, but the embodiment is not limited thereto. The light source module 1160 includes a substrate 1120 and a plurality of light emitting devices 200 arranged on the substrate 1120.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses incident light, the horizontal and vertical prism sheets condense incident light into a display area, and the brightness enhancement sheet reuses lost light to improve brightness.

The optical member 1154 is disposed on the light source module 1160 and performs a surface light source, diffusion, or condensation of light emitted from the light source module 1060.

6 is an exploded perspective view of a lighting device having a light emitting device according to an embodiment.

Referring to FIG. 6, the lighting device according to the embodiment includes a cover 2100, a light source module 2200, a radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. I can. In addition, the lighting device according to the embodiment may further include one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device according to the embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape with a hollow and an open portion. The cover 2100 may be optically coupled to the light source module 2200 and may be coupled to the radiator 2400. The cover 2100 may have a coupling portion coupled to the radiator 2400.

The inner surface of the cover 2100 may be coated with a milky white paint having a diffusion material. Using such a milky white material, light from the light source module 2200 may be scattered and diffused to be emitted to the outside.

The material of the cover 2100 may be glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent or opaque so that the light source module 2200 can be seen from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the radiator 2400. Accordingly, heat from the light source module 2200 is conducted to the radiator 2400. The light source module 2200 may include a light emitting element 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the radiator 2400 and has guide grooves 2310 into which a plurality of lighting elements 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the board and connector 2250 of the lighting device 2210.

The surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects light reflected on the inner surface of the cover 2100 and returned toward the light source module 2200 toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting device according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Accordingly, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating part 2710 of the inner case 2700. Accordingly, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides it to the light source module 2200. The power supply unit 2600 is accommodated in the storage groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply part 2600 may include a protrusion 2610, a guide part 2630, a base 2650, and an extension part 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A number of components may be disposed on one surface of the base 2650. The plurality of components may include, for example, a direct current converter, a driving chip that controls driving of the light source module 2200, an electrostatic discharge (ESD) protection element for protecting the light source module 2200, and the like. It is not limited to.

The extension part 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension part 2670 may be provided equal to or smaller than the width of the connection part 2750 of the inner case 2700. The extension part 2670 may be electrically connected to the socket 2800 through an electric wire.

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding portion is a portion in which the molding liquid is solidified, and allows the power supply unit 2600 to be fixed inside the inner case 2700.

Features, structures, effects, and the like described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the embodiments.

Although the embodiments have been described above, these are only examples and are not intended to limit the embodiments, and those of ordinary skill in the field to which the embodiments belong to, without departing from the essential characteristics of the present embodiment, various not illustrated above. It will be seen that branch transformation and application are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set in the appended claims.

10: light-emitting element 11: body
15: cavity 21: first lead frame
23: second lead frame 300: light emitting chip
40: first molding member 41: second molding member

Claims (8)

The upper and lower parts of the body have an open cavity;
First and second lead frames disposed on the bottom of the cavity and coupled to the body;
A light emitting chip disposed in the cavity of the body and disposed on the first lead frame;
A first connection member connecting the light emitting chip and the first lead frame;
A second connection member connecting the light emitting chip and the second lead frame;
An adhesive material disposed on a side surface of the light emitting chip to support the light emitting chip on the body;
A first molding member disposed in the cavity and including a phosphor on the light emitting chip; And
And a second molding member disposed in the cavity, disposed between the light emitting chip and the first molding member, and covering the light emitting chip and the adhesive material,
The phosphor is added in a range of 8 wt% to 25 wt% with respect to the total wt% of the first molding member, and is not added to the second molding member,
The first molding member is disposed in the cavity and disposed above the light emitting chip and the first and second connection members, and directly contacts the inner surface of the body exposed by the cavity,
The upper surface of the first molding member is disposed on the same plane as the upper surface of the body,
The second molding member has a height higher than the height of the light emitting chip and the first and second connection members, and is disposed surrounding the light emitting chip and the first and second connection members,
The light emitting chip is disposed on the first lead frame and includes a transparent substrate facing the first lead frame, a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer on the transparent substrate,
The adhesive material is disposed on the first lead frame and spaced apart from the second lead frame, and is disposed in contact with a side surface of the transparent substrate and a side surface of the first conductive semiconductor layer,
The width of the adhesive material in the horizontal direction decreases from the bottom of the light emitting chip toward the top,
The refractive index of the adhesive material is less than or equal to the refractive index of the transparent substrate, and is greater than or equal to the refractive index of the first molding member,
The second molding member directly contacts the inner surface of the body, the upper surface of the light emitting chip, the adhesive material, the upper surface of the first lead frame, and the upper surface of the second lead frame, and the transparent substrate And spaced apart from a side surface of the first conductive semiconductor layer,
The reflectance of the body is more than 70%,
The refractive index of the second molding member is greater than or equal to the refractive index of the first molding member,
The refractive index of the adhesive material is 1.4 to 1.8, the refractive index of the first molding member is 1.4 to 1.8, the refractive index of the transparent substrate is 1.75 to 1.8,
A light emitting device having a light transmittance of 80% or more of the adhesive material. delete delete delete delete delete delete delete

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