KR102528015B1 - Light emitting device and lighting system having thereof - Google Patents

Abstract

The embodiment relates to a light emitting device and a lighting system having the same.
The phosphor according to the embodiment contains a divalent metal (M), an activator element (A), fluorine (F, Fluorine or Fluor) and oxygen (O) M ₄ D _{1 - x} O _y F: A _x A phosphor composition having a structure, wherein x satisfies 0.001 ≤ x ≤ 0.1, y satisfies 1 ≤ y ≤ 5, M is at least one of Mg, Ca, Sr, Ba, Zn, and D Is at least one of Si, Ge Sn, Ti, Zr, Hf, F is Fluorine, and A is Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm , Yb, the composition of the phosphor emits red light with a peak wavelength of 400 nm to 470 nm as an excitation wavelength, the red light has a peak wavelength of 655 nm to 670 nm, and a half width of 20 nm or less have

Description

Light emitting device and lighting system having the same {LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THEREOF}

The embodiment relates to a light emitting device and a lighting system having the same.

A light emitting device (Light Emitting Device) is a device with characteristics of converting electrical energy into light energy. For example, an LED can implement various colors by adjusting the composition ratio of compound semiconductors.

For example, nitride semiconductors are of great interest in the field of developing optical devices and high-power electronic devices due to their high thermal stability and wide bandgap energy. In particular, blue light emitting devices, green light emitting devices, ultraviolet (UV) light emitting devices, and the like using nitride semiconductors are commercialized and widely used.

An LED emitting white light is a method of using a secondary light source that emits light from a phosphor by applying a phosphor, and a method of obtaining white light by applying a YAG:Ce phosphor that emits yellow to a blue LED is common.

However, the method has disadvantages in that quantum deficits and efficiency reduction due to re-radiation efficiency occur while using secondary light, and color rendering is not easy.

Therefore, the conventional white LED backlight is a combination of a blue LED chip and a yellow phosphor, and is limited to the extent of being used for screens of mobile phones and notebook PCs because it lacks green and red components and has no choice but to express unnatural colors. Nevertheless, it is widely commercialized due to the advantages of easy operation and remarkably low price.

A particularly preferred use of a white LED element made of a blue chip and a yellow phosphor is for backlights used in mobile phones, personal digital assistants, and the like. However, due to the use of a yellow phosphor (e.g., peak emission appears between 550 nm and 610 nm), the LED's spectrum contains excessive emission in the yellow region of the spectrum, strongly reducing the color gamut of the backlight.

A color gamut is the area spanned between the color points of the red, green, and blue pixels of a display in a chromaticity diagram, eg, the CIE 1931 x,y chromaticity diagram. The historical "golden standard" of a display is the NTSC gamut, defined by a set of three color point coordinates: generally a gamut in excess of 70% of NTSC is considered acceptable for many backlighting applications; Full ranges greater than 90% of NTSC are considered acceptable for most of these optional applications.

When the full range of the LED backlight is improved by using the yellow phosphor, the yellow light is removed and thus the luminous intensity of the LED backlight is reduced. Therefore, it would be advantageous to develop a white LED capable of increasing luminous intensity without using a yellow phosphor in the package.

The CRI is an eight standard commonly referred to as the General Color Rendering Index and abbreviated Ra, although 14 standard color samples are internationally specified and as an average of these a broader CRI (R1-14) can be calculated. It is generally defined as the average value of color samples (R1-8). Specifically, the R9 value, which measures color rendering for strong red, is very important for various applications, particularly lighting or medical fields requiring a high color rendering index.

An embodiment provides a light emitting device having a phosphor that converts a wavelength into red light.

The embodiment provides a light emitting device having a red phosphor having a narrow half-width.

The embodiment provides a light emitting device having a red phosphor and a blue light emitting chip.

The embodiment provides a light emitting device having a red phosphor, a green chip, or a green phosphor and a blue light emitting chip, and a lighting system including the same.

A light emitting device according to an embodiment includes a light emitting chip emitting blue light; a wavelength conversion member including a molding member or a film disposed on the light emitting chip; a first phosphor added to the wavelength conversion member and emitting light of a first peak wavelength using the blue light emitted from the light emitting chip as an excitation wavelength; and a second phosphor added to the wavelength conversion member and emitting light at a second peak wavelength using light emitted from the light emitting chip as an excitation wavelength, wherein the first peak wavelength has a peak wavelength of 525 nm to 545 nm, The second peak wavelength has a peak wavelength of 650 nm or more, and the second phosphor is M having a divalent metal (M), an activator element (A), fluorine (F, Fluorine or Fluor), and oxygen (O). ₄ D _{1 - x} O _y F:A It includes a composition of the structure _x , wherein x satisfies 0.001 ≤ x ≤ 0.1, y satisfies 1 ≤ y ≤ 5, wherein M is Mg, Ca, Sr, At least one of Ba and Zn, wherein D is at least one of Si, Ge Sn, Ti, Zr, and Hf, and A is Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, and Tm , Yb, and the second peak wavelength has a full width at half maximum of 20 nm or less.

According to the embodiment, it is possible to provide a light emitting device having a novel phosphor and a combination thereof.

Color gamut can be improved by using the red phosphor according to the embodiment.

According to the embodiment, it is possible to provide a light emitting device having an increased color rendering index (CRI) and an improved R9.

The embodiment can improve the reliability of a phosphor, a light emitting device having the same, and a lighting system.

1 is a cross-sectional view of a light emitting device including a red phosphor according to an embodiment.
2 is a view showing another example of a light emitting device having a red phosphor according to an embodiment.
3 is a view showing another example of a light emitting device having a red phosphor according to an embodiment.
4 is a view showing another example of a light emitting device having a red phosphor according to an embodiment.
5 is a view showing a light emitting device having a film to which a red phosphor is added according to an embodiment.
6 is a view showing a light unit having a film to which a red phosphor is added according to an embodiment.
7 is a view showing another example of a light unit having a film to which a red phosphor is added according to an embodiment.
8 is a diagram showing an example of an excitation wavelength of a phosphor or a wavelength of a light emitting chip according to an embodiment.
9 is a diagram showing a wavelength spectrum of a red phosphor according to an embodiment.
10 is a diagram showing color coordinates of CIE 1976 by light emitted from a light emitting device having a red phosphor according to an embodiment.
11 is a perspective view illustrating a display device having a light emitting device according to an exemplary embodiment.
12 is a perspective view illustrating a display device having a light emitting device according to an exemplary embodiment.
13 is an exploded perspective view illustrating a lighting device having a light emitting device according to an embodiment.

In the description of the embodiment, each layer (film), region, pattern or structure is "on/over" or "under" the substrate, each layer (film), region, pad or pattern. In the case where it is described as being formed in, "on/over" and "under" include both "directly" or "indirectly" formed through another layer. do. In addition, the criteria for the top/top or bottom of each layer will be described based on the drawings.

A light emitting device according to an embodiment may include a light emitting chip emitting an excitation wavelength and a red phosphor. The light emitting chip emits blue or ultraviolet light, and the red phosphor may include a phosphor to be described later.

The red phosphor contains a divalent metal (M), an activator element (A), fluorine (F, Fluorine or Fluor) and oxygen (O), and has the general formula M ₄ D _{1 - x} O _y F: A _x It may contain a composition of the structure. Here, M is at least one of Mg, Ca, Sr, Ba, and Zn, D is at least one of Si, Ge Sn, Ti, Zr, and Hf, F is fluorine, and A is Mn, Ce, At least one of Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb may be included. The x satisfies 0.001 ≤ x ≤ 0.1, and y may satisfy 1 ≤ y ≤5. When the element D increases from 0.01 to 0.99, the element A may decrease from 0.99 to 0.01. The element (A) of _the activator may be a tetravalent transition metal ion such as Mn ⁴⁺ , or a metal ion selected from various rare earth ions or transition metal ions, if necessary, and may be appropriately selected, for example, Eu ^{2+ ,} Ce ³⁺ , ^{Pr 3+ , Nd 3+ , Sm 3+ , Eu 3+ , Gd 3+ , Tb 3+ , Dy 3+ , Ho 3+ , Er 3+ , Tm 3+ , Yb 3+ ,} etc. rare earth metal ions, divalent rare earth metal ions such ^as Sm ^{2+ , Eu 2+} , ^and Yb ^{2+ ,} divalent ^transition metal ions such as Mn ²⁺ , trivalent transition metal ions such as Cr ³⁺ and Fe ³⁺ , etc. .

The red phosphor may emit light of deep red, eg, a peak wavelength having a long wavelength among red wavelengths by using an ultraviolet or blue wavelength as an excitation wavelength. As shown in FIG. 8 , the red phosphor may emit a red peak wavelength by using a peak wavelength of 400 nm or more, for example, 400 nm to 470 nm as an excitation wavelength. As shown in FIG. 9 , the red phosphor may emit light with a peak wavelength of 650 nm or more, for example, 655 nm to 670 nm. A full width at half maximum (FWHM) of a peak wavelength of the red phosphor may be 25 nm or less, for example, 20 nm or less. The half width of the peak wavelength of the red phosphor may be, for example, in the range of 10 nm to 20 nm. When the peak wavelength of the light emitted from the red phosphor is lower than the above range, high color reproduction is insignificant and thus there is a limit to improving NTSC. In addition, when the half width of the peak wavelength of light emitted from the red phosphor is greater than the above range, improvement in the area ratio of NTSC and sRGB may be insignificant. The embodiment provides a phosphor composition having a long wavelength of red wavelength and a narrow half-width, thereby improving red color reproducibility and improving the area ratio of NTSC and sRGB as shown in FIG. 10 .

As a specific example, the composition of the red phosphor may be used as a fluorine phosphor material activated by Mn ^{4 +} _x . The composition of the red phosphor may have a structure of, for example, Mg ₄ Ge _{1 -x} O _y F:Mn ⁴⁺ _x . The x satisfies 0.001 ≤ x ≤ 0.1, and y may satisfy 1 ≤ y ≤5. The red phosphor may emit an ultraviolet or blue wavelength as an excitation wavelength, for example, a peak wavelength of 400 nm to 470 nm as shown in FIG. 8, and a peak wavelength of 650 nm or more, for example, 655 nm to 670 nm, as shown in FIG. 9. A full width at half maximum (FWHM) of a peak wavelength of the red phosphor may be 25 nm or less, for example, 20 nm or less. The half width of the peak wavelength of the red phosphor may be, for example, in the range of 10 nm to 20 nm. Since the red phosphor having the Mg ₄ Ge _{1 - x} O _y F:Mn ^{4 +} _x structure has a peak wavelength of a long wavelength among red wavelengths and a full width at half maximum of 25 nm or less, the color purity of red color can be further improved. can

An embodiment may provide a light emitting device including a light emitting chip having a peak wavelength of 400 nm to 470 nm and a red phosphor emitting a peak wavelength of 655 nm to 670 nm by the light emitting chip. Since the embodiment does not use a red light emitting chip, the bin management point is reduced, the yield can be increased, and more advantageous effects can be obtained than in the case of using a multi light emitting chip. In addition, since a red light emitting chip is not used, color temperature change can be reduced and stable optical characteristics can be provided.

Examples include a light emitting chip having a peak wavelength of 400 nm to 470 nm, a green phosphor emitting green light by light from the light emitting chip, and a red phosphor according to the embodiment emitting a peak wavelength of 655 nm to 670 nm. A light emitting element can be provided. The embodiment provides a light emitting device including a light emitting chip having a peak wavelength of 400 nm to 470 nm, a green light emitting chip emitting green light, and a red phosphor according to the embodiment emitting a peak wavelength of 655 nm to 670 nm. can The light emitting device of the embodiment may be implemented as a white light emitting device.

Hereinafter, a light emitting device having a red phosphor according to an embodiment will be described. 1 is a cross-sectional view showing a light emitting device having a phosphor according to an embodiment.

Referring to FIG. 1 , a light emitting device 10 includes a body 11, a plurality of lead frames 21 and 23, a light emitting chip 25, and a molding member 41 having phosphors 31 and 33. .

The body 11 may be formed of a material having a reflectance higher than transmittance, for example, a reflectance of 70% or more with respect to a wavelength emitted by the light emitting chip 25 . When the reflectance of the body 11 is 70% or more, it may be defined as a non-transmissive material. The body 11 may be formed of a resin material such as a resin-based insulating material, for example, polyphthalamide (PPA). A metal oxide may be added to the body 11 in a resin material such as epoxy or silicon, and the metal oxide may include at least one of TiO ₂ , SiO ₂ , and Al ₂ O ₃ .

The body 11 includes a silicone-based, epoxy-based, or plastic material, and may be formed of a thermosetting resin or a material with high heat resistance and high light resistance. In addition, an acid anhydride, an antioxidant, a release agent, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added to the body 11. The body 11 may be molded by at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylic resin, and urethane resin. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., an acid composed of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, etc. DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator and ethylene glycol, titanium oxide pigment, and glass fibers as cocatalysts were added to an epoxy resin, and partially cured by heating. A solid epoxy resin composition subjected to a curing reaction and converted into a B stage can be used, but is not limited thereto.

A light blocking material or a diffusion agent may be mixed in the body 11 to reduce transmitted light. In addition, in order for the body 11 to have a predetermined function, at least one selected from the group consisting of a diffusion agent, a pigment, a fluorescent material, a reflective material, a light blocking material, a light stabilizer, and a lubricant is properly mixed with a thermosetting resin. You can do it.

As another example, the body 11 may be formed of a light-transmissive resin material or a resin material having a phosphor according to an embodiment that converts the wavelength of incident light. When the body 11 is formed of a light-transmitting material, 70% or more of the light emitted from the light-emitting chip 25 may be transmitted.

The body 11 is recessed to a predetermined depth from the upper surface of the body 11 and includes a cavity 15 with an open top. The cavity 15 may be formed in a shape such as a concave cup structure, an open structure, or a recess structure, but is not limited thereto. The cavity 15 has a width that gradually widens as it goes up, so light extraction efficiency can be improved.

A plurality of lead frames, for example, first and second lead frames 21 and 23 may be coupled to the body 11 . The first and second lead frames 21 and 23 may be disposed on the bottom of the cavity 15, and outer portions of the first and second lead frames 21 and 23 pass through the body 11. It may be exposed on at least one side of the body 11. Lower portions of the first lead frame 21 and the second lead frame 23 may be exposed to the lower portion of the body 11 and may be mounted on a circuit board to receive power.

As another example of the first and second lead frames 21 and 23, at least one or both of the first and second lead frames 21 and 23 are formed in a concave cup-shaped structure or a bent structure. It may have, or may include a recessed groove or hole for coupling with the body 11, but is not limited thereto. The light emitting chip 25 may be disposed in the concave cup shape, but is not limited thereto.

The first lead frame 21 and the second lead frame 23 are made of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum It may include at least one of nium (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P), and may be formed as a single layer or multiple layers.

A light emitting chip 25 is disposed on the first lead frame 21 , and the light emitting chip 25 may be adhered to the first lead frame 21 by a bonding member. The light emitting chip 25 may be connected to at least one connecting member 27 of the first and second lead frames 21 and 23, but is not limited thereto. The connection member 27 includes a wire made of a conductive material, for example, a metal material.

The light emitting chip 25 emits light with a peak wavelength in the range of 400 nm to 600 nm in the wavelength range of visible light. The light emitting chip 25 may emit ultraviolet light or blue peak wavelength. The light emitting chip 25 may emit light with a blue peak wavelength, for example, a peak wavelength ranging from 400 nm to 470 nm as shown in FIG. 8 .

The light emitting chip 25 may include at least one of a group II-VI compound and a group III-V compound. The light emitting chip 25 may be formed of, for example, a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof.

A molding member 41 is disposed in the cavity 15, and the molding member 41 includes the phosphors 31 and 33 according to the embodiment. The molding member 41 having the phosphors 31 and 33 may be defined as a wavelength conversion member. The phosphors 31 and 33 include phosphors having different materials that emit light with different peak wavelengths. The phosphors 31 and 33 include, for example, a first phosphor 31 and a second phosphor 33 emitting light of different peak wavelengths. The first phosphor 31 may include one type or two or more types of phosphors. For example, a green phosphor that emits green light at a first peak wavelength, for example, by using the peak wavelength emitted from the light emitting chip 25 as an excitation wavelength. can include The green phosphor may emit light with a peak wavelength of 525 nm to 545 nm.

The first phosphor 31 may be, for example, (Y,Gd,Lu,Tb) ₃ (Al,Ga) ₅ O ₁₂ :Ce, (Mg,Ca,Sr,Ba) ₂ SiO ₄ :Eu, (Ca,Sr) ) ₃ SiO ₅ :Eu, (La,Ca) ₃ Si ₆ N11 :Ce, α-SiAlON:Eu, β-SiAlON:Eu, Ba ₃ Si ₆ O ₁₂ N ₂ :Eu, Ca ₃ (Sc,Mg) ₂ Si ₃ O ₁₂ :Ce, CaSc ₂ O ₄ :Eu, BaAl ₈ O ₁₃ :Eu, (Ca,Sr,Ba)Al ₂ O ₄ :Eu, (Sr,Ca,Ba)(Al,Ga,In) ₂ S ₄ :Eu, (Ca,Sr) ₈ (Mg,Zn)(SiO ₄ ) ₄ C _l2 :Eu/Mn, (Ca,Sr,Ba) ₃ MgSi ₂ O ₈ :Eu/Mn, (Ca,Sr, Ba) ₂ (Mg,Zn)Si ₂ O ₇ :Eu, Zn ₂ SiO ₄ :Mn, (Y,Gd)BO ₃ :Tb, ZnS:Cu,Cl/Al, ZnS:Ag,Cl/Al, (Sr ,Ca) ₂ Si ₅ N ₈ :Eu, (Li,Na,K) ₃ ZrF ₇ :Mn, (Li,Na,K) ₂ (Ti,Zr)F ₆ :Mn, (Ca,Sr,Ba)( Ti,Zr)F ₆ :Mn, Ba _{0 . 65} Zr _0.35 F _{2. 7} :Mn, (Sr,Ca)S:Eu, (Y,Gd) _{BO 3} :Eu, (Y,Gd)(V,P)O ₄ :Eu, Y ₂ O ₃ :Eu, (Sr,Ca,Ba,Mg) ₅ (PO ₄ ) ₃ Cl:Eu, (Ca,Sr,Ba)MgAl ₁₀ O ₁₇ :Eu, (Ca,Sr,Ba)Si ₂ O ₂ N ₂ : One type or two or more types may be selected from among Eu, 3.5MgO·0.5MgF ₂ ·GeO ₂ :Mn, and the like.

The first phosphor 31 may be, for example, ^La ₃ Si ₆ N ₁₁ :Ce ³⁺ , BaSiN ₂ :Eu ²⁺ , ^or Sr _{1 . 5} ^Al ₃ Si ₉ N ₁₆ :Eu ²⁺ , Ca _1.5 A1 ₃ Si ₉ N ₁₆ :Eu ²⁺ , CaSiA1 _{2 O 3} ^N ₂ :Eu ²⁺ , SrSiA1 ₂ O ₃ N ₂ :Eu ²⁺ , CaSi ² _{O 2} N ₂ ^: Eu ²⁺ , SrSi ₂ O ₂ N _{2 :} Eu ²⁺ , BaSi ₂ O ₂ N ₂ :Eu ²⁺ , Sr ₂ Si ₅ N ₈ :Ce ³⁺ , ^Ca ₁ ^. ₅ Al ₃ Si ₉ N ₁₆ :Ce ³⁺ may include at least ^one .

The first phosphor 31 may include a quantum dot, and the quantum dot may include a II-VI compound or a III-V compound semiconductor, and may emit green light. The quantum dots may be, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In,Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS ₂ , CuInSe ₂ and the like, and combinations thereof.

The second phosphor 33 may emit light of a long wavelength within a second peak wavelength, for example, a red peak wavelength according to the embodiment, by using the light emitted from the light emitting chip 25 as an excitation wavelength. The second phosphor 33 includes a red phosphor according to the embodiment. The red phosphor contains a divalent metal (M), an activator element (A), fluorine (F, Fluorine or Fluor) and oxygen (O), and has the general formula M ₄ D _{1 - x} O _y F: A _x structure may include a composition of Here, M is at least one of Mg, Ca, Sr, Ba, and Zn, D is at least one of Si, Ge Sn, Ti, Zr, and Hf, F is fluorine, and A is Mn, Ce, At least one of Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb may be included. ^Here , M is Mg, D is Ge, and A may include tetravalent manganese Mn ⁴⁺ . The mole percentage of A may be 10% or less, and the sum of the mole percentages of D and A may be 100%. The x satisfies 0.001 ≤ x ≤ 0.1, and y may satisfy 1 ≤ y ≤5. When the element D increases from 0.01 to 0.99, the element A may decrease from 0.99 to 0.01.

The second phosphor 33 may emit light of a long wavelength among deep red, for example, red wavelengths by using the ultraviolet or blue wavelength emitted from the light emitting chip 25 as an excitation wavelength. As shown in FIG. 9 , the second peak wavelength emitted from the second phosphor 33 may emit light of 650 nm or more, for example, a peak wavelength of 655 nm to 670 nm or a peak wavelength of 660 nm to 665 nm. The half width of the peak wavelength of the second phosphor 33 may be 25 nm or less, for example, 20 nm or less. The half width of the peak wavelength of the second phosphor 33 may be, for example, in the range of 10 nm to 20 nm. As a specific example, the composition of the red phosphor may be used as a fluorine phosphor material activated by Mn ^{4 +} _x . The composition of the red phosphor may have a structure of, for example, Mg ₄ Ge _{1 - x} O _y F:Mn ^{4 +} _x . When the peak wavelength of the light emitted from the red phosphor is lower than the above range, high color reproduction is insignificant and thus there is a limit to improving NTSC. In addition, when the half width of the light emitted from the red phosphor is greater than the above range, improvement in the area ratio of NTSC and sRGB may be insignificant. The embodiment provides a phosphor composition having a long red peak wavelength and a narrow half width, thereby improving color reproducibility and, as shown in FIG. It can be improved by more than 1%.

Here, a light emitting device using color conversion such as a white light emitting device implements white light by using a blue light emitting chip and a yellow phosphor as a comparative example. For example, when a blue light emitting device is used as a reference light source and blue light emitted from the blue light emitting device is projected onto YAG (Yttrium Aluminum Garnet) phosphor, which is a yellow phosphor, the yellow phosphor is excited by the incident light to emit light. Silver emits light in a wavelength range from 500 nm to 780 nm, and white light can be emitted by the color mixture of these lights. However, in this example, since the wavelength interval between blue and yellow is wide, a flashing effect may occur due to color separation. In addition, it is not easy to adjust the same color coordinates, color temperature, and color rendering index, and color conversion may occur depending on the ambient temperature. In particular, when manufacturing a backlight unit using this light emitting device, the maximum color gamut compared to NTSC is about 65%. On the other hand, as a method of implementing white with a multi-chip using red, green, and blue light emitting devices, the color gamut may exceed 100% compared to NTSC. However, in the case of implementing white with multi-chips, the operating voltage is uneven for each chip, and the output of the chip changes depending on the ambient temperature, which may cause a phenomenon in which color coordinates change, and a driving circuit must be added. In addition, when a red light emitting chip is used, a color coordinate change caused by the red chip according to current and temperature may be a problem, and thus the entire color coordinate of the backlight unit may be changed.

In the light emitting device 10 according to the embodiment, the blue light from the light emitting chip 25, the green light from the first phosphor 31, and the red light from the second phosphor 33 can be mixed with each other. , the mixed light may be emitted as white light. That is, a white light emitting element can be provided.

Looking at the content ratio of the phosphors 31 and 33 in the molding member 41 according to the embodiment, the content of the second phosphor 33 may be added more than the content of the first phosphor 31 . For example, the first phosphor 31 may be in the range of 5% to 40%, and the second phosphor 33 may be in the range of 60% to 95%. When the content of the first phosphor 31 is less than the above range, the red color has a higher relative luminous intensity than the green color, and when it is higher than the above range, the green color may have a higher relative luminous intensity than the red color. When the content of the second phosphor 33 is less than the above range, green has a higher relative luminous intensity than red, and when it is higher than the above range, red may have a higher relative luminous intensity than green. When the content ratio of the first and second phosphors 31 and 33 is out of the above range, improvement in color purity of green or red in NTSC, sRGB, BT2020, etc. is insignificant, and high color reproduction may be difficult.

The total weight of the phosphors in the molding member 41 may be 70wt% or more, for example, in the range of 70wt% to 150wt%. When the total weight of the phosphors 31 and 33 is less than the above range, the blue color distribution may be increased, and when the total weight is greater than the above range, the blue color distribution may be reduced.

In the light emitting device 10 of the embodiment, in the u', v' chromaticity diagram of CIE 1976 shown in FIG. 10, red (Px) is u' = 0.51 to 0.53 and v' = 0.48 to 0.51, and green is u' = 0.08 to It can be seen that 0.11 and v' = 0.52 to 0.54, and blue is in the range of u' = 0.17 to 0.20 and v' = 0.08 to 0.12. The color coordinates of the red light are, for example, in a region surrounded by four vertices (0.5100, 0.4800), (0.5100, 0.5100), (0.5300, 0.4900), (0.5300, 0.5055), and the green phosphor is, for example, four vertices ( 0.0900, 0.5200), (0.0850, 0.5250), (0.1100, 0,5250), (0.1050, 0.5400). The red phosphor according to the embodiment may shift u' by 0.05 or more (M1) compared to NTSC in the u', v' chromaticity diagram of CIE 1976. As the red color by the red phosphor according to the embodiment has a narrow half-value width and is distributed in a long wavelength, the color purity of red color can be broadened further. Accordingly, it is possible to have a color gamut, particularly a more realistic red gamut in NTSC, sRGB, and the like. Looking at the area ratio in CIE 1976 detected when the light emitting device according to the embodiment is applied to the LCD module, the red light moves and is 120% or more compared to the NTSC color gamut and 130% or more compared to the sRGB color gamut. it can be done

The light emitting device 10 according to the embodiment may improve the red color rendering index (R9) by not using a yellow phosphor, and may produce lighting having a high color rendering index by providing a red spectrum having a narrow half width.

When the light emitting chip 25 is a UV light emitting chip, the light emitting device 10 may further include a blue phosphor, but is not limited thereto.

The first and second phosphors 31 and 33 may be particles emitting unique colors, or different phosphor particles emitting 2 or 3 colors may be provided in a mixed form into one particle. The particles may be 40 μm or less, for example, in the range of 1 to 30 μm. If the size of the particles is smaller than the above range, distribution control may be difficult, and if the particle size is larger than the above range, brightness control may be difficult.

The light emitting device according to the embodiment is a white light emitting device, and depending on the color temperature, warm white of 2500K-4000K, cool white of 6500K-7000K, neutral white of 3000-4000K, pure white It can be implemented as a (pure white) device.

2 is a view showing another example of a light emitting device having a phosphor according to an embodiment. In describing FIG. 2 , the description of FIG. 1 will be referred to for the same parts as in FIG. 1 .

Referring to FIG. 2 , the light emitting device may include a plurality of molding members 42 and 43 in the cavity 15 of the body 11 . The phosphors 31 and 33 may be disposed on any one of the plurality of molding members 42 and 43 . The plurality of molding members 42 and 43 include first and second molding members 42 and 43 , and the phosphors 31 and 33 may be disposed on the second molding member 43 . Looking at the thickness ratio of the first and second molding members 42 and 43, it may be in the range of 2:1 to 1:3, and when the thickness ratio of the second molding member 43 is smaller than the above range, transmission The ability to dissipate heat may be lowered, and if it is greater than the above range, there is a problem that the thickness of the light emitting element 10 may become thick.

The phosphors 31 and 33 may be spaced apart from the light emitting chip 25 . The second molding member 43 may have a distance of 0.2 mm or more from the light emitting chip 25, and when the distance is smaller than 0.2 mm, degradation of the phosphor may occur. A phosphor, for example, any kind of phosphor may not be added to the first molding member 42 that comes into contact with the light emitting chip 25 . First and second phosphors 31 and 33 may be added to the second molding member 43 disposed on the first molding member 42 . Accordingly, damage caused by heat generated from the light emitting chip 25 to the first and second phosphors 31 and 33 can be reduced. Since the second molding member 43 includes the first and second phosphors 31 and 33, it may be defined as a wavelength conversion member.

The first molding member 42 and the second molding member 43 may include the same resin material, for example, silicone or epoxy. The characteristics of the first and second phosphors 31 and 33 will be referred to the description of the embodiment.

3 is a view showing another example of a light emitting device having a phosphor according to an embodiment. In the description of FIG. 3 , the same parts as the configuration disclosed above will be referred to the description disclosed above.

Referring to FIG. 3 , the light emitting device may include a plurality of molding members 44 , 45 , and 46 in the cavity 15 of the body 11 . Different types of phosphors 31 and 33 may be added to at least two of the plurality of molding members 45 and 46 .

The cavity 15 may include a first molding member 44, a second molding member 45 on the first molding member 44, and a third molding member 46 on the second molding member 45. can The first molding member 44 is in contact with the light emitting chip 25, and any kind of phosphor may not be added therein. The first phosphor 31 may be added to the second molding member 45 and the second phosphor 33 may be added to the third molding member 46 . The second and third molding members 45 and 46 may be defined as wavelength conversion members.

Looking at the thickness ratio of the first to third molding members 44, 45, and 46, it may be in the range of 2:1:1 to 3:1:1. The thickness of the second molding member 45 may be thicker or thinner than the thickness of the first molding member 44 and may be the same as or different from the thickness of the third molding member 46 . If the thickness ratio of the first molding member 43 is smaller than the above range, the ability to dissipate the transferred heat may deteriorate, causing a problem that a lot of heat may be transferred to the phosphor. There is a problem that the thickness of (10) can be thick.

The first to third molding members 44, 45, and 46 may be formed of the same light-transmitting resin material or a resin material having a different refractive index, but are not limited thereto. The characteristics of the first and second phosphors 31 and 33 will be referred to the description of the embodiment.

As another example, when a plurality of molding members 44 , 45 , and 46 are disposed in the cavity 15 , a phosphor having a low peak wavelength among the first and second phosphors 31 and 33 , for example, the first phosphor 31 ) may be added to the molding member positioned lower than the molding member to which the second phosphor 33 is added. Alternatively, among the first and second phosphors 31 and 33, a phosphor having a high peak wavelength, for example, the second phosphor 33 is added to a molding member positioned lower than the molding member to which the first phosphor 31 is added. It can be. In addition, each of the third phosphors 31 and 33 may be adjacent to the upper surface or distributed on the lower surface of each of the molding members 45 and 46, but is not limited thereto.

4 is a view showing another example of a light emitting device having a red phosphor according to an embodiment. In describing FIG. 4 , the same configuration as the above embodiment will refer to the description disclosed above.

Referring to FIG. 4 , the light emitting device includes a body 11 , a plurality of lead frames 21 and 23 , light emitting chips 25 and 26 , and a molding member 41 having a red phosphor 33 . The molding member 41 may be defined as a wavelength conversion member.

The light emitting chips 25 and 26 may include a light emitting chip 25 emitting blue light and a light emitting chip 26 emitting green light. The blue light emitting chip 25 and the green light emitting chip 26 may be connected in parallel or in series, but are not limited thereto. The blue light emitting chip 25 and the green light emitting chip 26 may be disposed on the same lead frame or on different lead frames, but are not limited thereto. The red phosphor 33 is a phosphor according to an embodiment, and the description disclosed above will be referred to. The light emitting device according to the embodiment includes a blue light emitting chip 25, a green light emitting chip 26, and a red phosphor 33, and may be implemented as a white light emitting device. The light emitting device according to the embodiment has a high color gamut compared to a configuration using a yellow phosphor or a phosphor emitting a low peak wavelength among red wavelengths, and a color gamut equivalent to that of the case of using a red/green/blue chip. In particular, a deeper and more vivid red color can be provided.

5 is a view showing another example of a light emitting device having a phosphor according to an embodiment. In describing FIG. 5 , the same configuration as the above embodiment will refer to the description disclosed above.

Referring to FIG. 5 , the light emitting device may include a molding member 49 in a cavity 15 of a body 11 and a film 30 having phosphors 31 and 33 on the body 11. . The film 30 may be defined as a wavelength conversion member.

Any kind of phosphor may not be added to the molding member 49 . Accordingly, the heat generated from the light emitting chip 25 can reduce the effect on the phosphors 31 and 33 .

The film 30 is a transparent film and includes a resin material such as silicone or epoxy. The content of the phosphors 31 and 33 in the film 30 will be referred to the description of the embodiment disclosed above. The film 30 may include a glass material on which phosphors 31 and 33 are coated on the upper and/or lower surfaces. The film 30 may have an area larger than the area of the top surface of the molding member 49, and thus, wavelength conversion efficiency by the phosphors 31 and 33 therein may be improved. The film 30 may be fixed in contact with the exit surface of the molding member 49 . The width of the film 30 may be narrower than the sum of the widths of the lead frames 21 and 23 at the side cross section and may be narrower than the width of the body 11 . When the width of the film 30 is exposed to the outside of the body 11, there is a problem in that light loss may occur. The film 30 may be attached to the upper surface of the body 11 with an adhesive.

The phosphors 31 and 33 may include first and second phosphors 31 and 33 emitting different peak wavelengths. For the first and second phosphors 31 and 33, the description disclosed in the embodiment will be referred to. Since the first and second phosphors 31 and 33 are spaced apart from the light emitting chip 25 , the wavelength of light emitted through the emission surface of the molding member 49 may be converted.

6 is a view showing a light unit having a phosphor according to an embodiment.

Referring to FIG. 6 , in the light unit, one or a plurality of light emitting chips 25 and 25A are disposed on a circuit board 50, and a reflective member 55 is disposed around the light emitting chips 25 and 25A. , A film 30A having phosphors 31 and 33 may be disposed on the light emitting chips 25 and 25A. The width of the film 30A may be wider than the area 60 between the reflective members 55 in the side cross section and may be narrower than the width of the reflective members 55 . When the width of the film 30A is larger than the width of the reflective member 55, it may be exposed to the outside and thus light loss may occur.

The circuit board 50 may have a circuit pattern and be electrically connected to the light emitting chips 25 and 25A. When the plurality of light emitting chips 25 and 25A are disposed on the circuit board 50, the plurality of light emitting chips 25 and 25A may be connected in series or in parallel.

The circuit board 50 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the circuit board 50 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like, but is not limited thereto. A reflective material is disposed on the upper surface of the circuit board 50 to reflect light.

The reflective member 55 may include a reflective material, for example, a silicone-based, epoxy-based, or plastic material, and may be formed of a thermosetting resin or a material with high heat resistance and high light resistance. In addition, an acid anhydride, an antioxidant, a release agent, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added to the reflective member 55 . The reflective member 55 may be disposed around the outer circumference of the light emitting chips 25 and 25A to reflect the light emitted from the light emitting chips 25 and 25A.

The region 60 between the circuit board 50 and the film 30A is a transparent region and may be formed of a material that transmits light. The light-transmitting material may include air or a resin material such as silicone or epoxy. The film 30A may be disposed on the transparent region 60 . The film 30A may come into contact with the resin material when the transparent region 60 is filled with the resin material.

The film 30A is a transparent film and includes a resin material such as silicone or epoxy. The film 30A may include a glass material on which the phosphors 31 and 33 are applied above and/or below. The film 30A may further extend on the reflective member 55 to improve wavelength conversion efficiency by the phosphors 31 and 33 therein.

The light emitting chips 25 and 25A may emit at least one of ultraviolet light and blue light. The phosphors 31 and 33 include first and second phosphors 31 and 33, and the first and second phosphors 31 and 33 may include the phosphor disclosed in the embodiment, see the description disclosed above. I'm going to do it.

7 is a view showing a light unit having a red phosphor according to an embodiment.

Referring to FIG. 7 , in the light unit, one or a plurality of light emitting chips 25 and 26 are disposed on a circuit board 50, and a reflective member 55 is disposed around the light emitting chips 25 and 26. , A film 30A having a red phosphor 33 may be disposed on the light emitting chips 25 and 26 .

The light emitting chips 25 and 26 may include a light emitting chip 25 emitting blue light and a light emitting chip 26 emitting green light. The phosphor 33 emits red light using the blue light emitted from the light emitting chip 25 as an excitation wavelength, and may include a red phosphor according to an embodiment. The light unit may include light emitting chips 25 and 26 emitting different colors and a red phosphor 33 to provide white light. The light unit according to the embodiment has a high color gamut compared to a configuration using a yellow phosphor or a phosphor emitting a low peak wavelength among red wavelengths, and a color gamut equivalent to the case of using a red/green/blue chip. In particular, a deeper and more vivid red color can be provided.

An optical lens that converts a beam angle of light may be disposed on the molding member or the film according to the embodiment. The optical lens may change a path of the light emitted through the molding member or the film and radiate the light with a desired beam angle distribution.

<Lighting system>

A light emitting element or light unit according to an embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light emitting elements are arrayed, includes the display device shown in FIGS. 11 and 12 and the lighting device shown in FIG. there is.

11 is an exploded perspective view of a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 11 , a display device 1000 according to an embodiment includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), an optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light source module 1031, and a reflective member 1022. It may include the bottom cover 1011, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light to form a surface light source. The light guide plate 1041 is made of a transparent material, for example, an acrylic resin such as PMMA (polymethyl metaacrylate), PET (polyethylene terephthlate), PC (poly carbonate), COC (cycloolefin copolymer), and PEN (polyethylene naphthalate) It may contain one of the resins.

The light source module 1031 provides light to at least one side of the light guide plate 1041 and ultimately serves as a light source of a display device. The light source module 1031 includes at least one, and may directly or indirectly provide light from one side of the light guide plate 1041 . The light source module 1031 includes a substrate 1033 and the light emitting devices 1035 according to the above-described embodiment, and the light emitting devices 1035 may be arrayed on the circuit board 1033 at predetermined intervals. .

The circuit board 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like, but is not limited thereto. When the light emitting device 1035 is mounted on a side surface of the bottom cover 1011 or a heat dissipation plate, the circuit board 1033 may be removed. Here, a portion of the heat dissipation plate may contact the upper surface of the bottom cover 1011 .

In addition, the plurality of light emitting elements 1035 may be mounted on the circuit board 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting element 1035 may directly or indirectly provide light to the light input part, which is one side surface of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed below the light guide plate 1041 . The reflective member 1022 may improve the luminance of the light unit 1050 by reflecting the light incident on the lower surface of the light guide plate 1041 and directing it upward. The reflective member 1022 may be formed of, for example, PET, PC, PVC resin, etc., but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041 , the light source module 1031 , and the reflective member 1022 . To this end, the bottom cover 1011 may be provided with an accommodating part 1012 having a box shape with an open upper surface, but is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes first and second substrates made of a transparent material facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, and the structure for attaching the polarizing plate is not limited. The display panel 1061 displays information by light passing through the optical sheet 1051 . The display device 1000 may be applied to various portable terminals, laptop computer monitors, laptop computer monitors, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include, for example, at least one of a diffusion sheet, a horizontal and vertical prism sheet, and a luminance enhancing sheet. The diffusion sheet diffuses the incident light, the horizontal or/and vertical prism sheet condenses the incident light into a display area, and the luminance enhancing sheet reuses lost light to improve luminance. In addition, a protective sheet may be disposed on the display panel 1061, but is not limited thereto.

Here, the light guide plate 1041 and the optical sheet 1051 may be included as optical members on the light path of the light source module 1031, but are not limited thereto.

12 is a diagram illustrating a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 12 , the display device 1100 includes a bottom cover 1152, a circuit board 1120 on which the light emitting elements 1124 described above are arrayed, an optical member 1154, and a display panel 1155. .

The circuit board 1120 and the light emitting device 1124 may be defined as a light source module 1160 . The bottom cover 1152 , at least one light source module 1160 , and the optical member 1154 may be defined as a light unit 1150 . The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto. The light source module 1160 includes a circuit board 1120 and a plurality of light emitting elements 1062 arranged on the circuit board 1120 .

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, horizontal and vertical prism sheets, and a luminance enhancement sheet. The light guide plate may be made of a PC material or a poly methyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses incident light, the horizontal and vertical prism sheets condense incident light into a display area, and the luminance enhancing sheet reuses lost light to improve luminance.

The optical member 1154 is disposed on the light source module 1160 and performs a surface light source, diffusion or condensing of the light emitted from the light source module 1160 .

13 is an exploded perspective view of a lighting device having a light emitting device according to an embodiment.

Referring to FIG. 13 , the lighting device according to the embodiment may include a cover 2100, a light source module 2200, a radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. can In addition, the lighting device according to the embodiment may further include any one or more of the member 2300 and the holder 2500 . The light source module 2200 may include a light emitting device according to an embodiment.

For example, the cover 2100 may have a bulb or hemispherical shape, be hollow, and may be provided in a shape in which one portion is open. The cover 2100 may be optically coupled to the light source module 2200 and coupled to the heat dissipation body 2400 . The cover 2100 may have a coupling portion coupled to the heat dissipation body 2400 .

An inner surface of the cover 2100 may be coated with a milky white paint having a diffusion material. The light from the light source module 2200 can be scattered and diffused and emitted to the outside by using such a milky white material.

The material of the cover 2100 may be glass, plastic, polypropylene (PP), polyethylene (PE), or polycarbonate (PC). Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent or opaque so that the light source module 2200 can be seen from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the heat dissipation body 2400 . Thus, heat from the light source module 2200 is conducted to the heat sink 2400 . The light source module 2200 may include a light emitting element 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the radiator 2400 and has guide grooves 2310 into which a plurality of lighting elements 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the board and connector 2250 of the lighting device 2210 .

The surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects light that is reflected on the inner surface of the cover 2100 and returns toward the light source module 2200 toward the cover 2100 again. Accordingly, light efficiency of the lighting device according to the embodiment may be improved.

The member 2300 may be made of, for example, an insulating material. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Accordingly, electrical contact may be made between the radiator 2400 and the connection plate 2230 . The member 2300 may be made of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400 . The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 and dissipates the heat.

The holder 2500 blocks the receiving groove 2719 of the insulating part 2710 of the inner case 2700. Thus, the power supply unit 2600 accommodated in the insulation unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510 . The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal received from the outside and provides it to the light source module 2200 . The power supply unit 2600 is accommodated in the receiving groove 2719 of the inner case 2700, and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and an extension unit 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650 . The guide part 2630 may be inserted into the holder 2500 . A plurality of components may be disposed on one surface of the base 2650 . A plurality of parts may include, for example, a DC converter, a driving chip for controlling driving of the light source module 2200, an electrostatic discharge (ESD) protection element for protecting the light source module 2200, and the like. not limited to

The extension part 2670 has a shape protruding outward from the other side of the base 2650 . The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the width of the extension part 2670 may be equal to or smaller than the width of the connection part 2750 of the inner case 2700 . The extension part 2670 may be electrically connected to the socket 2800 through a wire.

The inner case 2700 may include a molding part together with the power supply part 2600 therein. The molding part is a part where the molding liquid is hardened, and allows the power supply part 2600 to be fixed inside the inner case 2700 .

In the display device or lighting system according to the embodiment, by including the red phosphor disclosed in the embodiment, the color purity of red can be shifted to deep red, and thus the color reproduction rate of the lighting or display device can be improved.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, and effects illustrated in each embodiment can be combined or modified with respect to other embodiments by those skilled in the art in the field to which the embodiments belong. Therefore, contents related to these combinations and modifications should be construed as being included in the scope of the embodiments.

Although the above has been described centering on the embodiment, this is only an example and does not limit the embodiment, and those skilled in the art in the field to which the embodiment belongs may find various things not exemplified above to the extent that they do not deviate from the essential characteristics of the embodiment. It will be appreciated that variations and applications of branches are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set forth in the appended claims.

10: light emitting element 11: body
15: cavity 21: first lead frame
23: second lead frame 25, 25A, 26: light emitting chip
41: molding member 30,30A: film
31: first phosphor 33: second phosphor

Claims (8)

a light emitting chip that emits blue light;
a wavelength conversion member including a molding member or a film disposed on the light emitting chip;
a first phosphor added to the wavelength conversion member and emitting light of a first peak wavelength using the blue light emitted from the light emitting chip as an excitation wavelength; and
a second phosphor added to the wavelength conversion member and emitting light of a second peak wavelength using light emitted from the light emitting chip as an excitation wavelength;
The first peak wavelength has a peak wavelength of 525 nm to 545 nm,
The second peak wavelength has a peak wavelength of 660 nm to 670 nm,
In the content ratio of the first phosphor and the second phosphor, the content of the first phosphor is in the range of 5% to 40% and the content of the second phosphor is in the range of 60% to 95%,
The second phosphor has a divalent metal (M), an activator element (A), fluorine (F, Fluorine or Fluor), and oxygen (O) having an M ₄ D _1-x O _y F:A _x structure wherein x satisfies 0.001 ≤ x ≤ 0.1, and y satisfies 1 ≤ y ≤ 5;
M is at least one of Mg, Ca, Sr, Ba, and Zn;
D is at least one of Si, Ge Sn, Ti, Zr, and Hf,
A includes at least one of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb;
The second peak wavelength has a half width of 20 nm or less,
The color coordinates of light emitted by the second phosphor are within a region surrounded by four vertices (0.5100, 0.4800), (0.5100, 0.5100), (0.5300, 0.4900), (0.5300, 0.5055) based on the CIE 1976 chromaticity diagram. light emitting element. delete According to claim 1,
The second phosphor has a composition formula of Mg ₄ Ge _1-x O _y F:Mn ⁴⁺ _x . According to claim 1 or 3,
The half-width of the second peak wavelength is a light emitting device having a range of 10 nm to 20 nm. According to claim 4,
The light emitting chip includes a plurality,
A light emitting device including a transparent molding member between the light emitting chip and the wavelength conversion member.
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