JP5916821B2 - 酸化ハフニウムコーティング - Google Patents
酸化ハフニウムコーティング Download PDFInfo
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- JP5916821B2 JP5916821B2 JP2014182334A JP2014182334A JP5916821B2 JP 5916821 B2 JP5916821 B2 JP 5916821B2 JP 2014182334 A JP2014182334 A JP 2014182334A JP 2014182334 A JP2014182334 A JP 2014182334A JP 5916821 B2 JP5916821 B2 JP 5916821B2
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- 238000000576 coating method Methods 0.000 title claims description 67
- 239000011248 coating agent Substances 0.000 title claims description 60
- 229910000449 hafnium oxide Inorganic materials 0.000 title description 12
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 title description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 37
- 239000010703 silicon Substances 0.000 claims description 37
- 230000003287 optical effect Effects 0.000 claims description 30
- 229910052735 hafnium Inorganic materials 0.000 claims description 22
- 238000004544 sputter deposition Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 15
- 238000002835 absorbance Methods 0.000 claims description 13
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000010453 quartz Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 6
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 14
- 230000003595 spectral effect Effects 0.000 description 12
- 239000000654 additive Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002356 single layer Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001659 ion-beam spectroscopy Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
- G02B5/0825—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only
- G02B5/0833—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only comprising inorganic materials only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/285—Interference filters comprising deposited thin solid films
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Optical Filters (AREA)
- Laminated Bodies (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
を有し、その際、好ましくは、Si含有率は1at%〜10at%である。好ましくは、内部膜応力は300MPa未満である。
2 基板
3,3',4 コーティング
5 多層膜系
21 未コーティングの石英基板
22 HfO2の膜でコーティングされた石英基板
23 補助曲線
24 補助直線
25,26 種々のスパッタリングパラメーターを使用した場合の成膜速度
27,28 補助直線
29,30 補助直線
31,32,33 補助曲線
34 y=2.5at%のケイ素含有率を有するサンプル
35〜37 純粋なHfO2からの膜
39 HfxSiyOz膜のケイ素含有率yとHfSi混合ターゲットのケイ素含有率との相関関係を示す直線
Claims (16)
- ハフニウムを含有する酸化物からのコーティング(3,3')において、ハフニウムを含有する酸化物が、1.5at%〜7at%のケイ素割合(y)を含有し、且つ前記コーティング(3,3')が、65at%〜68at%のO割合(z)及び1.5at%〜7at%のケイ素割合(y)を有する組成物HfxSiyOzを有し、
前記コーティング(3,3')の膜応力が、800MPaより低いことを特徴する、ハフニウムを含有する酸化物からのコーティング(3,3')。 - ハフニウムを含有する酸化物が、1.5at%〜3at%のケイ素割合(y)を含有することを特徴とする、請求項1記載のコーティング(3,3')。
- 基板(2)及び該基板(2)上に施与された、ハフニウムを含有する酸化物(HfxSiyOz)からのコーティング(3,3')を有する光学部材(1)において、ハフニウムを含有する酸化物(HfxSiyOz)が、1.5at%〜7at%のケイ素割合(y)及び65at%〜68at%のO割合(z)を含有し、
前記コーティング(3,3')の膜応力が、800MPaより低い
ことを特徴する、基板(2)及び該基板(2)上に施与された、ハフニウムを含有する酸化物(HfxSiyOz)からのコーティング(3,3')を有する光学部材(1)。 - 基板(2)及び該基板(2)上に施与された多層膜系(5)を有する光学部材(1')であって、その際、該多層膜系(5)が、ハフニウムを含有する酸化物(HfxSiyOz)からの少なくとも1つのコーティング(3,3')を有する光学部材(1')において、ハフニウムを含有する酸化物(HfxSiyOz)が1.5at%〜7at%のケイ素割合(y)及び65at%〜68at%のO割合(z)を含有し、
前記多層膜系(5)の膜応力が、800MPaより低いことを特徴とする、基板(2)及び該基板(2)上に施与された多層膜系(5)を有する光学部材(1')。 - 基板(2)が石英から成ることを特徴とする、請求項3又は4に記載の光学部材(1,1')。
- ハフニウムを含有する酸化物(HfxSiyOz)からのコーティング(3,3')をスパッタリングによって製造することを特徴とする、請求項1又は2に記載のコーティング(3,3')の製造方法。
- ハフニウムを含有する酸化物(HfxSiyOz)からのコーティング(3,3')をスパッタリングによって基板(2)上に施与することを特徴とする、請求項3から5までのいずれか1項記載の光学部材(1,1')の製造方法。
- コーティング(3,3')の製造を、Hf及びSiの反応性コマグネトロンスパッタリングによって行うことを特徴とする、請求項6又は7に記載の方法。
- コーティング(3,3')の製造を、HfSi及びSiの反応性コマグネトロンスパッタリングによって行うことを特徴とする、請求項6又は7に記載の方法。
- コーティング(3,3')の製造を、HfxSiyOz及びSiの反応性コマグネトロンスパッタリングによって行うことを特徴とする、請求項6又は7に記載の方法。
- コーティング(3,3')の製造を、Hf及びSiを含有する化合物ターゲットの使用下での反応性マグネトロンスパッタリングによって行うことを特徴とする、請求項6又は7に記載の方法。
- コーティング(3,3')の製造を、部分反応性マグネトロンスパッタリングによって導電性HfxSiyOzの化合物ターゲットの使用下で行うことを特徴とする、請求項6又は7に記載の方法。
- 反応性又は部分反応性のマグネトロンスパッタリングに反応性in situプラズマ処理を伴うことを特徴とする、請求項6から12までのいずれか1項記載の方法。
- Si割合を、コーティング(3,3')が最小吸光度と同時に低い膜応力及び高い屈折率を有するように調整することを特徴とする、請求項6から13までのいずれか1項記載の方法。
- 光学部材(1,1')がレーザーミラーとして使用されることを特徴とする、請求項3から5までのいずれか1項記載の光学部材(1,1')の使用。
- 光学部材(1,1')がエッジフィルターとして使用されることを特徴とする、請求項3から5までのいずれか1項記載の光学部材(1,1')の使用。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2008/009206 WO2010048975A1 (de) | 2008-10-31 | 2008-10-31 | Hafniumoxid-beschichtung |
EPPCT/EP2008/009206 | 2008-10-31 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011533551A Division JP5665751B2 (ja) | 2008-10-31 | 2009-03-24 | 酸化ハフニウム−コーティング |
Publications (2)
Publication Number | Publication Date |
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JP2015025207A JP2015025207A (ja) | 2015-02-05 |
JP5916821B2 true JP5916821B2 (ja) | 2016-05-11 |
Family
ID=40810751
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2011533551A Active JP5665751B2 (ja) | 2008-10-31 | 2009-03-24 | 酸化ハフニウム−コーティング |
JP2014182334A Active JP5916821B2 (ja) | 2008-10-31 | 2014-09-08 | 酸化ハフニウムコーティング |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011533551A Active JP5665751B2 (ja) | 2008-10-31 | 2009-03-24 | 酸化ハフニウム−コーティング |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5665751B2 (ja) |
KR (2) | KR101918768B1 (ja) |
CN (1) | CN102264940B (ja) |
WO (2) | WO2010048975A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100279124A1 (en) | 2008-10-31 | 2010-11-04 | Leybold Optics Gmbh | Hafnium or zirconium oxide Coating |
WO2010048975A1 (de) * | 2008-10-31 | 2010-05-06 | Leybold Optics Gmbh | Hafniumoxid-beschichtung |
KR102241852B1 (ko) * | 2019-12-31 | 2021-04-20 | 주식회사 이노션테크 | 친환경 하이브리드 자동차 부품용 코팅재 및 코팅 시스템 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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AU616736B2 (en) | 1988-03-03 | 1991-11-07 | Asahi Glass Company Limited | Amorphous oxide film and article having such film thereon |
JP2720919B2 (ja) * | 1989-03-07 | 1998-03-04 | 旭硝子株式会社 | ターゲット |
JP2576662B2 (ja) * | 1989-03-07 | 1997-01-29 | 旭硝子株式会社 | 熱線遮断ガラス |
JPH03187955A (ja) * | 1989-03-07 | 1991-08-15 | Asahi Glass Co Ltd | 選択透過物品及びその製造方法 |
JP2917432B2 (ja) * | 1989-08-01 | 1999-07-12 | 旭硝子株式会社 | 電導性ガラスの製造方法 |
US5268217A (en) * | 1990-09-27 | 1993-12-07 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
JPH04291981A (ja) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | 半導体レーザ装置 |
US6587264B2 (en) * | 2001-01-18 | 2003-07-01 | Thermo Corion Corporation | Selectively tuned ultraviolet optical filters and methods of use thereof |
JP3995082B2 (ja) * | 2001-07-18 | 2007-10-24 | 日鉱金属株式会社 | ゲート酸化膜形成用ハフニウムシリサイドターゲット及びその製造方法 |
DE10141102A1 (de) * | 2001-08-22 | 2003-04-03 | Schott Glas | Cadmiumfreie optische Steilkantenfilter |
US20030207549A1 (en) * | 2002-05-02 | 2003-11-06 | Jenq Jason Jyh-Shyang | Method of forming a silicate dielectric layer |
JP2005197675A (ja) * | 2003-12-11 | 2005-07-21 | Mitsubishi Materials Corp | ハフニウム含有膜形成材料及び該材料から作製されたハフニウム含有膜 |
US8454804B2 (en) * | 2005-10-28 | 2013-06-04 | Applied Materials Inc. | Protective offset sputtering |
JP4177857B2 (ja) * | 2006-04-28 | 2008-11-05 | 株式会社東芝 | 半導体装置およびその製造方法 |
WO2010048975A1 (de) * | 2008-10-31 | 2010-05-06 | Leybold Optics Gmbh | Hafniumoxid-beschichtung |
-
2008
- 2008-10-31 WO PCT/EP2008/009206 patent/WO2010048975A1/de active Application Filing
-
2009
- 2009-03-24 KR KR1020117012503A patent/KR101918768B1/ko active IP Right Grant
- 2009-03-24 CN CN200980152495.7A patent/CN102264940B/zh active Active
- 2009-03-24 WO PCT/EP2009/002138 patent/WO2010049012A1/de active Application Filing
- 2009-03-24 JP JP2011533551A patent/JP5665751B2/ja active Active
- 2009-03-24 KR KR1020167020033A patent/KR20160093080A/ko not_active Application Discontinuation
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2014
- 2014-09-08 JP JP2014182334A patent/JP5916821B2/ja active Active
Also Published As
Publication number | Publication date |
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WO2010049012A1 (de) | 2010-05-06 |
KR20160093080A (ko) | 2016-08-05 |
WO2010048975A1 (de) | 2010-05-06 |
KR101918768B1 (ko) | 2018-11-14 |
CN102264940A (zh) | 2011-11-30 |
JP2012506950A (ja) | 2012-03-22 |
JP2015025207A (ja) | 2015-02-05 |
JP5665751B2 (ja) | 2015-02-04 |
KR20110098720A (ko) | 2011-09-01 |
CN102264940B (zh) | 2015-06-10 |
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