JP5916157B2 - チップ電子部品の製造方法 - Google Patents
チップ電子部品の製造方法 Download PDFInfo
- Publication number
- JP5916157B2 JP5916157B2 JP2014066399A JP2014066399A JP5916157B2 JP 5916157 B2 JP5916157 B2 JP 5916157B2 JP 2014066399 A JP2014066399 A JP 2014066399A JP 2014066399 A JP2014066399 A JP 2014066399A JP 5916157 B2 JP5916157 B2 JP 5916157B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- electronic component
- manufacturing
- seed layer
- chip electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 239000004020 conductor Substances 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 35
- 238000009713 electroplating Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- LMPMFQXUJXPWSL-UHFFFAOYSA-N 3-(3-sulfopropyldisulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSSCCCS(O)(=O)=O LMPMFQXUJXPWSL-UHFFFAOYSA-N 0.000 claims description 3
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- WRBSVISDQAINGQ-UHFFFAOYSA-N 3-(dimethylcarbamothioylsulfanyl)propane-1-sulfonic acid Chemical compound CN(C)C(=S)SCCCS(O)(=O)=O WRBSVISDQAINGQ-UHFFFAOYSA-N 0.000 claims description 2
- 150000007522 mineralic acids Chemical class 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 10
- 239000010409 thin film Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000696 magnetic material Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- -1 inorganic acid salts Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002999 depolarising effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0000178 | 2014-01-02 | ||
| KR1020140000178A KR101565673B1 (ko) | 2014-01-02 | 2014-01-02 | 칩 전자부품의 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015130471A JP2015130471A (ja) | 2015-07-16 |
| JP5916157B2 true JP5916157B2 (ja) | 2016-05-11 |
Family
ID=53648487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014066399A Expired - Fee Related JP5916157B2 (ja) | 2014-01-02 | 2014-03-27 | チップ電子部品の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5916157B2 (ko) |
| KR (1) | KR101565673B1 (ko) |
| CN (1) | CN104766715B (ko) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101751117B1 (ko) * | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
| KR101900879B1 (ko) | 2015-10-16 | 2018-09-21 | 주식회사 모다이노칩 | 파워 인덕터 |
| KR101901697B1 (ko) | 2016-03-21 | 2018-11-07 | 삼성전기 주식회사 | 코일 장치의 제작 방법 및 코일 장치 |
| KR20170112522A (ko) | 2016-03-31 | 2017-10-12 | 주식회사 모다이노칩 | 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자 |
| KR101862503B1 (ko) * | 2017-01-06 | 2018-05-29 | 삼성전기주식회사 | 인덕터 및 그의 제조방법 |
| KR101973449B1 (ko) | 2017-12-11 | 2019-04-29 | 삼성전기주식회사 | 인덕터 |
| KR102232600B1 (ko) * | 2017-12-15 | 2021-03-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
| KR101898112B1 (ko) * | 2018-01-22 | 2018-09-12 | 주식회사 모다이노칩 | 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자 |
| KR102016496B1 (ko) * | 2018-04-06 | 2019-09-02 | 삼성전기주식회사 | 코일 부품 및 이의 제조 방법 |
| KR102052819B1 (ko) * | 2018-04-10 | 2019-12-09 | 삼성전기주식회사 | 코일 부품의 제조방법 |
| KR102148832B1 (ko) * | 2018-10-12 | 2020-08-27 | 삼성전기주식회사 | 코일 부품 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| JPH0442084A (ja) * | 1990-06-06 | 1992-02-12 | Unitika Ltd | 識別標識及びその製造法 |
| JPH10241983A (ja) * | 1997-02-26 | 1998-09-11 | Toshiba Corp | 平面インダクタ素子とその製造方法 |
| JP2004342645A (ja) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 平面コイルの製造方法 |
| JP4423358B2 (ja) * | 2004-01-29 | 2010-03-03 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP2006066830A (ja) * | 2004-08-30 | 2006-03-09 | Tdk Corp | ハイアスペクト導体デバイスの製造方法 |
| JP2006310716A (ja) * | 2005-03-31 | 2006-11-09 | Tdk Corp | 平面コイル素子 |
| JP2006310705A (ja) * | 2005-05-02 | 2006-11-09 | Tdk Corp | 平面コイルの製造方法 |
| US8278220B2 (en) * | 2008-08-08 | 2012-10-02 | Fei Company | Method to direct pattern metals on a substrate |
| JP2012129269A (ja) | 2010-12-14 | 2012-07-05 | Shun Hosaka | コア付きインダクタ素子およびその製造方法 |
-
2014
- 2014-01-02 KR KR1020140000178A patent/KR101565673B1/ko active IP Right Grant
- 2014-03-27 JP JP2014066399A patent/JP5916157B2/ja not_active Expired - Fee Related
- 2014-04-11 CN CN201410144263.XA patent/CN104766715B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104766715A (zh) | 2015-07-08 |
| JP2015130471A (ja) | 2015-07-16 |
| CN104766715B (zh) | 2018-02-06 |
| KR101565673B1 (ko) | 2015-11-03 |
| KR20150080737A (ko) | 2015-07-10 |
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