JP5915956B2 - 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法 - Google Patents

半田バンプ形成用樹脂組成物、及び半田バンプ形成方法 Download PDF

Info

Publication number
JP5915956B2
JP5915956B2 JP2014102808A JP2014102808A JP5915956B2 JP 5915956 B2 JP5915956 B2 JP 5915956B2 JP 2014102808 A JP2014102808 A JP 2014102808A JP 2014102808 A JP2014102808 A JP 2014102808A JP 5915956 B2 JP5915956 B2 JP 5915956B2
Authority
JP
Japan
Prior art keywords
solder
resin
resin composition
rosin
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014102808A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015042419A5 (https=
JP2015042419A (ja
Inventor
靖弘 高瀬
靖弘 高瀬
和輝 花田
和輝 花田
北村　和憲
和憲 北村
Original Assignee
山栄化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山栄化学株式会社 filed Critical 山栄化学株式会社
Priority to JP2014102808A priority Critical patent/JP5915956B2/ja
Priority to DE102014010775.2A priority patent/DE102014010775B4/de
Priority to TW103124886A priority patent/TWI542622B/zh
Priority to KR1020140092404A priority patent/KR101709633B1/ko
Priority to US14/340,850 priority patent/US9415469B2/en
Priority to CN201410359511.2A priority patent/CN104345555B/zh
Publication of JP2015042419A publication Critical patent/JP2015042419A/ja
Publication of JP2015042419A5 publication Critical patent/JP2015042419A5/ja
Application granted granted Critical
Publication of JP5915956B2 publication Critical patent/JP5915956B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2014102808A 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法 Active JP5915956B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014102808A JP5915956B2 (ja) 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法
DE102014010775.2A DE102014010775B4 (de) 2013-07-25 2014-07-21 Harzzusammensetzung zur Lötpunktbildung, Lötpunkt-Bildungsverfahren und Bauelement mit Lötpunkten
TW103124886A TWI542622B (zh) 2013-07-25 2014-07-21 銲料凸塊形成用樹脂組成物、銲料凸塊形成方法及具備銲料凸塊的構件
KR1020140092404A KR101709633B1 (ko) 2013-07-25 2014-07-22 땜납 범프 형성용 수지 조성물, 땜납 범프 형성 방법, 및 땜납 범프를 구비한 부재
US14/340,850 US9415469B2 (en) 2013-07-25 2014-07-25 Resin composition for solder bump formation, solder bump formation method, and member having solder bumps
CN201410359511.2A CN104345555B (zh) 2013-07-25 2014-07-25 焊料凸点形成用树脂组合物、焊料凸点形成方法和具备焊料凸点的构件

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013154949 2013-07-25
JP2013154949 2013-07-25
JP2014102808A JP5915956B2 (ja) 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法

Publications (3)

Publication Number Publication Date
JP2015042419A JP2015042419A (ja) 2015-03-05
JP2015042419A5 JP2015042419A5 (https=) 2015-04-16
JP5915956B2 true JP5915956B2 (ja) 2016-05-11

Family

ID=52389525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014102808A Active JP5915956B2 (ja) 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法

Country Status (6)

Country Link
US (1) US9415469B2 (https=)
JP (1) JP5915956B2 (https=)
KR (1) KR101709633B1 (https=)
CN (1) CN104345555B (https=)
DE (1) DE102014010775B4 (https=)
TW (1) TWI542622B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102140523B1 (ko) * 2018-11-07 2020-08-04 주식회사 켐트로닉스 솔더 페이스트 조성물 및 솔더 범프 제조 방법
JP7529977B2 (ja) * 2019-05-27 2024-08-07 千住金属工業株式会社 マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト
WO2020241687A1 (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト
TWI836084B (zh) * 2019-05-27 2024-03-21 日商千住金屬工業股份有限公司 含有馬來酸改性松香酯或馬來酸改性松香醯胺之助焊劑用組成物，及含其之助焊劑，以及焊料糊料
JP7529976B2 (ja) * 2019-05-27 2024-08-07 千住金属工業株式会社 マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト
EP4494803A1 (de) * 2023-07-20 2025-01-22 Heraeus Electronics GmbH & Co. KG Flussmittel und dieses umfassende lotpaste

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3787857B2 (ja) * 1995-03-10 2006-06-21 タムラ化研株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3378139B2 (ja) * 1996-03-19 2003-02-17 株式会社デンソー はんだ付け用のフラックス
JP3390822B2 (ja) * 1996-08-29 2003-03-31 トヨタ自動車株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3490225B2 (ja) * 1996-09-03 2004-01-26 三菱レイヨン株式会社 フラックス組成物
JP3056192B1 (ja) 1999-01-18 2000-06-26 富山日本電気株式会社 電極パッド上にバンプを形成したソルダーレジスト層付実装基板の製造方法
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
JP2008062252A (ja) 2006-09-05 2008-03-21 Denso Corp はんだ付け用フラックスおよびはんだペースト組成物
WO2009047949A1 (ja) * 2007-10-09 2009-04-16 Showa Highpolymer Co., Ltd. 感光性グラフトポリマー及びそれを含む感光性樹脂組成物
JP5387844B2 (ja) * 2008-11-13 2014-01-15 荒川化学工業株式会社 鉛フリーはんだ用フラックス組成物及び鉛フリーはんだペースト
JP5224550B2 (ja) * 2010-03-24 2013-07-03 ルネサスエレクトロニクス株式会社 半導体装置
JP2012004347A (ja) * 2010-06-17 2012-01-05 Harima Chem Inc はんだバンプ形成方法
JP5246452B2 (ja) * 2010-09-24 2013-07-24 荒川化学工業株式会社 ハンダ付用ロジン系フラックスおよびソルダーペースト

Also Published As

Publication number Publication date
DE102014010775B4 (de) 2021-06-10
KR101709633B1 (ko) 2017-03-08
CN104345555B (zh) 2019-09-10
US20150027768A1 (en) 2015-01-29
DE102014010775A1 (de) 2015-02-26
KR20150013035A (ko) 2015-02-04
JP2015042419A (ja) 2015-03-05
CN104345555A (zh) 2015-02-11
US9415469B2 (en) 2016-08-16
TWI542622B (zh) 2016-07-21
TW201522451A (zh) 2015-06-16

Similar Documents

Publication Publication Date Title
JP5915956B2 (ja) 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法
CN100551207C (zh) 树脂掩膜层的除去方法和带焊锡突起的基板的制造方法
JP3556922B2 (ja) バンプ形成方法
CN110225667A (zh) 树脂掩模层用洗涤剂组合物及电路基板的制造方法
CN101784365B (zh) 钎焊用焊剂、钎焊膏组合物及钎焊方法
JP6413843B2 (ja) はんだ用フラックスおよびはんだペースト
JP2003264367A (ja) リフローはんだ付用ソルダーペースト組成物及び回路基板
KR20190120771A (ko) 수지 조성물용의 에칭액 및 에칭 방법
JP4672352B2 (ja) バンプ形成用ハンダペースト
JP2015208779A (ja) はんだ用フラックスおよびはんだペースト
JP2017195372A (ja) はんだバンプ形成方法
JP2014058147A (ja) はんだ球製造用のモールドの製造方法、及びはんだ球の製造方法
JP4142680B2 (ja) はんだバンプ形成方法
JP2004152936A (ja) 回路基板はんだ付用フラックス、ソルダーペースト及び回路基板
JP4470530B2 (ja) 感光性樹脂組成物及び金属バンプ形成方法
JP2004306092A (ja) 回路基板はんだ付用フラックス及びソルダーペースト
JP3314856B2 (ja) ソルダペースト
JP2010049262A (ja) 感光性樹脂組成物
JP4367630B2 (ja) バンプ形成方法
JP4685081B2 (ja) 電子部品製造方法
JP2004130374A (ja) 回路基板はんだ付用フラックス、ソルダーペースト及び回路基板
JP2017033989A (ja) ソルダーレジスト層の形成方法
JPH07314180A (ja) はんだ付け用フラックス
JP2004141941A (ja) 回路基板はんだ付用フラックス、ソルダーペースト及び回路基板
JP2016111094A (ja) 回路基板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141226

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150116

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150811

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150928

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151208

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160126

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160315

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160325

R150 Certificate of patent or registration of utility model

Ref document number: 5915956

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250