JP5912663B2 - コバルトめっき銅微粉及びコバルトめっき銅微粉を用いて製造した導電ペースト並びにコバルトめっき銅微粉の製造方法 - Google Patents

コバルトめっき銅微粉及びコバルトめっき銅微粉を用いて製造した導電ペースト並びにコバルトめっき銅微粉の製造方法 Download PDF

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JP5912663B2
JP5912663B2 JP2012043508A JP2012043508A JP5912663B2 JP 5912663 B2 JP5912663 B2 JP 5912663B2 JP 2012043508 A JP2012043508 A JP 2012043508A JP 2012043508 A JP2012043508 A JP 2012043508A JP 5912663 B2 JP5912663 B2 JP 5912663B2
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fine powder
copper fine
cobalt
plating
value
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JP2013181177A (ja
JP2013181177A5 (enExample
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俊雄 黒澤
俊雄 黒澤
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2012043508A 2012-02-29 2012-02-29 コバルトめっき銅微粉及びコバルトめっき銅微粉を用いて製造した導電ペースト並びにコバルトめっき銅微粉の製造方法 Active JP5912663B2 (ja)

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JP2012043508A JP5912663B2 (ja) 2012-02-29 2012-02-29 コバルトめっき銅微粉及びコバルトめっき銅微粉を用いて製造した導電ペースト並びにコバルトめっき銅微粉の製造方法

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JP2012043508A JP5912663B2 (ja) 2012-02-29 2012-02-29 コバルトめっき銅微粉及びコバルトめっき銅微粉を用いて製造した導電ペースト並びにコバルトめっき銅微粉の製造方法

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JP2013181177A JP2013181177A (ja) 2013-09-12
JP2013181177A5 JP2013181177A5 (enExample) 2014-11-27
JP5912663B2 true JP5912663B2 (ja) 2016-04-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109908961A (zh) * 2019-03-04 2019-06-21 合肥学院 一种光催化用氧化亚铜/聚合物复合粉体的方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6241929B2 (ja) * 2013-11-29 2017-12-06 学校法人東京理科大学 異種複合金属ナノ粒子の調製方法
US11152160B1 (en) 2020-09-15 2021-10-19 United Arab Emirates University High-rate hybrid supercapacitor

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3527854B2 (ja) * 1998-09-30 2004-05-17 京セラ株式会社 導電性ペースト組成物及びそれを用いた積層セラミックコンデンサの製造方法、並びに積層セラミックコンデンサ
JP2002275511A (ja) * 2001-03-15 2002-09-25 Murata Mfg Co Ltd 金属粉末の製造方法、金属粉末、導電性ペーストならびに積層セラミック電子部品
JP2003013103A (ja) * 2001-06-26 2003-01-15 Murata Mfg Co Ltd 導電粉末の製造方法、導電粉末、導電性ペーストおよび積層セラミック電子部品
JP4182234B2 (ja) * 2002-09-20 2008-11-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用銅粉およびその製造方法
JP4261973B2 (ja) * 2003-04-28 2009-05-13 日本化学工業株式会社 導電性無電解めっき粉体の製造方法
JP4494108B2 (ja) * 2004-07-22 2010-06-30 三井金属鉱業株式会社 ニッケルコート銅粉製造方法、ニッケルコート銅粉及び導電性ペースト
JP4853152B2 (ja) * 2006-07-19 2012-01-11 住友金属鉱山株式会社 ニッケル被覆銅微粒子とその製造方法、それを用いた分散液とその製造方法、及びそれを用いたペースト
US7749300B2 (en) * 2008-06-05 2010-07-06 Xerox Corporation Photochemical synthesis of bimetallic core-shell nanoparticles
JP4685145B2 (ja) * 2008-09-10 2011-05-18 ニホンハンダ株式会社 金属製部材接合体の製造方法および金属製部材接合体
JP2010100899A (ja) * 2008-10-23 2010-05-06 Japan Science & Technology Agency 銀−ロジウム合金微粒子およびその製造方法
JP5830010B2 (ja) * 2010-03-17 2015-12-09 新日鉄住金化学株式会社 ニッケル−コバルトナノ粒子の製造方法
JP5571435B2 (ja) * 2010-03-31 2014-08-13 Ｊｘ日鉱日石金属株式会社 銀メッキ銅微粉の製造方法
JP5832731B2 (ja) * 2010-08-10 2015-12-16 株式会社東芝 半導体素子
JP2011094236A (ja) * 2010-12-07 2011-05-12 Dowa Holdings Co Ltd 低温焼成用銅粉または導電ペースト用銅粉

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109908961A (zh) * 2019-03-04 2019-06-21 合肥学院 一种光催化用氧化亚铜/聚合物复合粉体的方法

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