JP5909862B2 - アクチュエーター、光スキャナーおよび画像形成装置 - Google Patents
アクチュエーター、光スキャナーおよび画像形成装置 Download PDFInfo
- Publication number
- JP5909862B2 JP5909862B2 JP2011084839A JP2011084839A JP5909862B2 JP 5909862 B2 JP5909862 B2 JP 5909862B2 JP 2011084839 A JP2011084839 A JP 2011084839A JP 2011084839 A JP2011084839 A JP 2011084839A JP 5909862 B2 JP5909862 B2 JP 5909862B2
- Authority
- JP
- Japan
- Prior art keywords
- movable
- shape
- movable portion
- movable plate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims description 85
- 229910052710 silicon Inorganic materials 0.000 claims description 101
- 239000010703 silicon Substances 0.000 claims description 101
- 238000001579 optical reflectometry Methods 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 100
- 239000000758 substrate Substances 0.000 description 67
- 150000004767 nitrides Chemical class 0.000 description 55
- 238000005530 etching Methods 0.000 description 46
- 238000000034 method Methods 0.000 description 45
- 238000004519 manufacturing process Methods 0.000 description 20
- 230000007547 defect Effects 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 16
- 238000001020 plasma etching Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
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- 230000005484 gravity Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000828 alnico Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
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- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00626—Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/058—Rotation out of a plane parallel to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0133—Wet etching
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011084839A JP5909862B2 (ja) | 2011-04-06 | 2011-04-06 | アクチュエーター、光スキャナーおよび画像形成装置 |
| CN2012100981253A CN102736244A (zh) | 2011-04-06 | 2012-04-05 | 致动器、光扫描仪以及图像形成装置 |
| US13/440,338 US20120257268A1 (en) | 2011-04-06 | 2012-04-05 | Actuator, optical scanner, and image forming apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011084839A JP5909862B2 (ja) | 2011-04-06 | 2011-04-06 | アクチュエーター、光スキャナーおよび画像形成装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012218098A JP2012218098A (ja) | 2012-11-12 |
| JP2012218098A5 JP2012218098A5 (enExample) | 2014-05-15 |
| JP5909862B2 true JP5909862B2 (ja) | 2016-04-27 |
Family
ID=46965931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011084839A Active JP5909862B2 (ja) | 2011-04-06 | 2011-04-06 | アクチュエーター、光スキャナーおよび画像形成装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120257268A1 (enExample) |
| JP (1) | JP5909862B2 (enExample) |
| CN (1) | CN102736244A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5842369B2 (ja) * | 2011-04-11 | 2016-01-13 | セイコーエプソン株式会社 | アクチュエーターの製造方法、光スキャナーの製造方法および画像形成装置の製造方法、アクチュエーター、光スキャナーおよび画像形成装置 |
| JP6585147B2 (ja) * | 2017-12-01 | 2019-10-02 | 浜松ホトニクス株式会社 | アクチュエータ装置 |
| EP3628964B1 (de) * | 2018-09-28 | 2024-02-14 | Hexagon Technology Center GmbH | Opto-elektro-mechanisches strahlmanipulationssystem |
| JP7263878B2 (ja) * | 2019-03-27 | 2023-04-25 | セイコーエプソン株式会社 | 光スキャナー、三次元計測装置およびロボットシステム |
| JP2021051222A (ja) * | 2019-09-25 | 2021-04-01 | 日本電産株式会社 | 光学素子および光走査装置 |
| JP2021051219A (ja) | 2019-09-25 | 2021-04-01 | 日本電産株式会社 | 光学素子および光走査装置 |
| JP7587994B2 (ja) * | 2021-01-28 | 2024-11-21 | 浜松ホトニクス株式会社 | アクチュエータデバイスの製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4317611A (en) * | 1980-05-19 | 1982-03-02 | International Business Machines Corporation | Optical ray deflection apparatus |
| DE69102590T2 (de) * | 1990-05-18 | 1994-10-06 | British Aerospace | Trägheitssensoren. |
| JP3164742B2 (ja) * | 1994-11-09 | 2001-05-08 | 株式会社東芝 | 光走査装置 |
| US20010046346A1 (en) * | 1999-08-02 | 2001-11-29 | Brent E. Burns | Micromachined structure for opto-mechanical micro-switch |
| JP4602542B2 (ja) * | 2000-12-18 | 2010-12-22 | オリンパス株式会社 | 光偏向器用のミラー揺動体 |
| JP2002321196A (ja) * | 2001-02-22 | 2002-11-05 | Canon Inc | マイクロ構造体、マイクロ力学量センサ、マイクロアクチュエータ、マイクロ光偏向器、光走査型ディスプレイ、及びそれらの製造方法 |
| US6831765B2 (en) * | 2001-02-22 | 2004-12-14 | Canon Kabushiki Kaisha | Tiltable-body apparatus, and method of fabricating the same |
| JP3919616B2 (ja) * | 2002-07-05 | 2007-05-30 | キヤノン株式会社 | マイクロ構造体及びその製造方法 |
| JP2007316443A (ja) * | 2006-05-26 | 2007-12-06 | Canon Inc | 光偏向器、及びそれを用いた光学機器 |
| JP5521359B2 (ja) * | 2008-03-13 | 2014-06-11 | セイコーエプソン株式会社 | 光偏向器及びその製造方法 |
| JP2009294458A (ja) * | 2008-06-05 | 2009-12-17 | Brother Ind Ltd | 光スキャナ |
| JP5655365B2 (ja) * | 2009-08-04 | 2015-01-21 | セイコーエプソン株式会社 | 光偏向器、光偏向器の製造方法および画像表示装置 |
| JP5842356B2 (ja) * | 2011-03-24 | 2016-01-13 | セイコーエプソン株式会社 | アクチュエーター、光スキャナーおよび画像形成装置 |
-
2011
- 2011-04-06 JP JP2011084839A patent/JP5909862B2/ja active Active
-
2012
- 2012-04-05 CN CN2012100981253A patent/CN102736244A/zh active Pending
- 2012-04-05 US US13/440,338 patent/US20120257268A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20120257268A1 (en) | 2012-10-11 |
| JP2012218098A (ja) | 2012-11-12 |
| CN102736244A (zh) | 2012-10-17 |
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