JP5906022B2 - マクロピンハイブリッド相互接続アレイ及びその製造方法 - Google Patents

マクロピンハイブリッド相互接続アレイ及びその製造方法 Download PDF

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Publication number
JP5906022B2
JP5906022B2 JP2011088708A JP2011088708A JP5906022B2 JP 5906022 B2 JP5906022 B2 JP 5906022B2 JP 2011088708 A JP2011088708 A JP 2011088708A JP 2011088708 A JP2011088708 A JP 2011088708A JP 5906022 B2 JP5906022 B2 JP 5906022B2
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Prior art keywords
array
substrate
interconnect
macropin
solder
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Japanese (ja)
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JP2011228704A (ja
JP2011228704A5 (enExample
Inventor
チャールズ・ジェラード・ウォイチク
ジョン・エリック・トカチク
ブライアン・デビッド・ヤノフ
タン・ツァン
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General Electric Co
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General Electric Co
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Measurement Of Radiation (AREA)
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US9351436B2 (en) * 2013-03-08 2016-05-24 Cochlear Limited Stud bump bonding in implantable medical devices
DE102013214575B3 (de) * 2013-07-25 2014-09-18 Siemens Aktiengesellschaft Halbleiterelement mit Lötstopplage und Verfahren zu seiner Erzeugung sowie Strahlungsdetektor und medizintechnisches Gerät mit einem solchen Strahlungsdetektor
US20150149534A1 (en) * 2013-11-25 2015-05-28 Contadd Limited Systems and methods for creating, displaying and managing content units
US20150276945A1 (en) 2014-03-25 2015-10-01 Oy Ajat Ltd. Semiconductor bump-bonded x-ray imaging device
US11121302B2 (en) 2018-10-11 2021-09-14 SeeQC, Inc. System and method for superconducting multi-chip module

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