JP5901170B2 - 集積回路および集積回路のコンタクト部とプリント基板の相応するコンタクト部との間の抵抗を求める方法 - Google Patents

集積回路および集積回路のコンタクト部とプリント基板の相応するコンタクト部との間の抵抗を求める方法 Download PDF

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JP5901170B2
JP5901170B2 JP2011163940A JP2011163940A JP5901170B2 JP 5901170 B2 JP5901170 B2 JP 5901170B2 JP 2011163940 A JP2011163940 A JP 2011163940A JP 2011163940 A JP2011163940 A JP 2011163940A JP 5901170 B2 JP5901170 B2 JP 5901170B2
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Japan
Prior art keywords
contact portion
integrated circuit
section
resistance
contact
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JP2011163940A
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English (en)
Japanese (ja)
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JP2012028786A5 (https=
JP2012028786A (ja
Inventor
オクス エリック
オクス エリック
ヘーファー ホルガー
ヘーファー ホルガー
ラウシャー ルッツ
ラウシャー ルッツ
シェルケス エッカート
シェルケス エッカート
グラープマイアー フローリアン
グラープマイアー フローリアン
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of JP2012028786A5 publication Critical patent/JP2012028786A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2011163940A 2010-07-27 2011-07-27 集積回路および集積回路のコンタクト部とプリント基板の相応するコンタクト部との間の抵抗を求める方法 Active JP5901170B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010038453.4 2010-07-27
DE102010038453A DE102010038453A1 (de) 2010-07-27 2010-07-27 Lötstellenkontrolle

Publications (3)

Publication Number Publication Date
JP2012028786A JP2012028786A (ja) 2012-02-09
JP2012028786A5 JP2012028786A5 (https=) 2013-03-28
JP5901170B2 true JP5901170B2 (ja) 2016-04-06

Family

ID=45471069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011163940A Active JP5901170B2 (ja) 2010-07-27 2011-07-27 集積回路および集積回路のコンタクト部とプリント基板の相応するコンタクト部との間の抵抗を求める方法

Country Status (3)

Country Link
US (1) US8810252B2 (https=)
JP (1) JP5901170B2 (https=)
DE (1) DE102010038453A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9635794B2 (en) 2012-02-20 2017-04-25 Trw Automotive U.S. Llc Method and apparatus for attachment of integrated circuits
US8957694B2 (en) * 2012-05-22 2015-02-17 Broadcom Corporation Wafer level package resistance monitor scheme
US9883582B2 (en) * 2015-11-20 2018-01-30 Hamilton Sundstrand Corporation Circuit boards and circuit board assemblies
DE102020125716A1 (de) 2020-10-01 2022-04-07 Endress+Hauser SE+Co. KG Elektronikeinheit und Verfahren zur Prüfung mindestens eines Zustands einer Elektronikeinheit
WO2023209856A1 (ja) * 2022-04-27 2023-11-02 日立Astemo株式会社 車載制御装置
DE102024209901A1 (de) * 2024-10-10 2026-04-16 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungsschaltereinheit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01154546A (ja) * 1987-12-10 1989-06-16 Fujitsu Ltd 端子開放検出回路半導体装置
JP2977959B2 (ja) * 1991-07-12 1999-11-15 シチズン時計株式会社 半導体装置およびその測定方法
JP2825085B2 (ja) * 1996-08-29 1998-11-18 日本電気株式会社 半導体装置の実装構造、実装用基板および実装状態の検査方法
JP2004363146A (ja) * 2003-06-02 2004-12-24 Matsushita Electric Ind Co Ltd 回路基板に対する電子部品の接合品質評価用の検査チップとそれを用いた評価ツール及び評価方法
JP2005347469A (ja) * 2004-06-02 2005-12-15 Denso Corp 電子部品およびその半田付け検査システム
US20080218495A1 (en) * 2007-03-08 2008-09-11 Wintek Corporation Circuit capable of selectively operating in either an inspecting mode or a driving mode for a display
US8522051B2 (en) * 2007-05-07 2013-08-27 Infineon Technologies Ag Protection for circuit boards
JP5034781B2 (ja) * 2007-08-27 2012-09-26 富士通株式会社 半田バンプの高感度抵抗測定装置及び監視方法
JP2009065037A (ja) * 2007-09-07 2009-03-26 Yokogawa Electric Corp 半導体集積回路とその検査装置
JP5343555B2 (ja) * 2008-12-22 2013-11-13 富士通株式会社 半導体装置、及び、はんだ接合部破壊の検出方法

Also Published As

Publication number Publication date
DE102010038453A1 (de) 2012-02-02
US8810252B2 (en) 2014-08-19
US20120025863A1 (en) 2012-02-02
JP2012028786A (ja) 2012-02-09

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