JP5895712B2 - 原料ガス供給装置、成膜装置、原料ガスの供給方法及び記憶媒体 - Google Patents
原料ガス供給装置、成膜装置、原料ガスの供給方法及び記憶媒体 Download PDFInfo
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- JP5895712B2 JP5895712B2 JP2012124713A JP2012124713A JP5895712B2 JP 5895712 B2 JP5895712 B2 JP 5895712B2 JP 2012124713 A JP2012124713 A JP 2012124713A JP 2012124713 A JP2012124713 A JP 2012124713A JP 5895712 B2 JP5895712 B2 JP 5895712B2
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- 238000000034 method Methods 0.000 title claims description 22
- 239000007789 gas Substances 0.000 claims description 309
- 239000002994 raw material Substances 0.000 claims description 185
- 238000010790 dilution Methods 0.000 claims description 86
- 239000012895 dilution Substances 0.000 claims description 86
- 239000012159 carrier gas Substances 0.000 claims description 79
- 238000001514 detection method Methods 0.000 claims description 26
- 230000015572 biosynthetic process Effects 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 21
- 238000000605 extraction Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 230000008023 solidification Effects 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 7
- 239000003085 diluting agent Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 claims 2
- 238000004590 computer program Methods 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 56
- 238000010438 heat treatment Methods 0.000 description 37
- 235000012431 wafers Nutrition 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 13
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 239000003708 ampul Substances 0.000 description 6
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000007865 diluting Methods 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 230000005587 bubbling Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002052 molecular layer Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012124713A JP5895712B2 (ja) | 2012-05-31 | 2012-05-31 | 原料ガス供給装置、成膜装置、原料ガスの供給方法及び記憶媒体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012124713A JP5895712B2 (ja) | 2012-05-31 | 2012-05-31 | 原料ガス供給装置、成膜装置、原料ガスの供給方法及び記憶媒体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013249511A JP2013249511A (ja) | 2013-12-12 |
| JP2013249511A5 JP2013249511A5 (enExample) | 2014-11-13 |
| JP5895712B2 true JP5895712B2 (ja) | 2016-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012124713A Expired - Fee Related JP5895712B2 (ja) | 2012-05-31 | 2012-05-31 | 原料ガス供給装置、成膜装置、原料ガスの供給方法及び記憶媒体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5895712B2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016040402A (ja) * | 2014-08-12 | 2016-03-24 | 東京エレクトロン株式会社 | 原料ガス供給装置 |
| US10100407B2 (en) | 2014-12-19 | 2018-10-16 | Lam Research Corporation | Hardware and process for film uniformity improvement |
| JP6693106B2 (ja) * | 2015-03-27 | 2020-05-13 | 東京エレクトロン株式会社 | 原料供給装置、原料供給方法及び記憶媒体 |
| KR101899201B1 (ko) * | 2015-03-27 | 2018-09-14 | 도쿄엘렉트론가부시키가이샤 | 원료 공급 장치, 원료 공급 방법 및 기억 매체 |
| JP6627474B2 (ja) * | 2015-09-30 | 2020-01-08 | 東京エレクトロン株式会社 | 原料ガス供給装置、原料ガス供給方法及び記憶媒体 |
| JP6417052B2 (ja) * | 2015-09-30 | 2018-10-31 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法及びプログラム |
| JP6565645B2 (ja) * | 2015-12-02 | 2019-08-28 | 東京エレクトロン株式会社 | 原料ガス供給装置、原料ガス供給方法及び記憶媒体 |
| GB201523156D0 (en) * | 2015-12-31 | 2016-02-17 | Pilkington Group Ltd | High strength glass containers |
| JP6698153B2 (ja) * | 2016-04-26 | 2020-05-27 | 日本エア・リキード合同会社 | 前駆体の供給システムおよび前駆体の供給方法 |
| JP6787215B2 (ja) * | 2017-03-27 | 2020-11-18 | 株式会社豊田中央研究所 | 成膜装置と半導体装置の製造方法 |
| JP7281285B2 (ja) * | 2019-01-28 | 2023-05-25 | 株式会社堀場エステック | 濃度制御装置、及び、ゼロ点調整方法、濃度制御装置用プログラム |
| JP7226222B2 (ja) * | 2019-09-24 | 2023-02-21 | 東京エレクトロン株式会社 | ガス供給装置及びガス供給方法 |
| JP7516742B2 (ja) * | 2019-11-05 | 2024-07-17 | 東京エレクトロン株式会社 | 基板を処理する装置、処理ガスを濃縮する装置、及び基板を処理する方法 |
| US11513108B2 (en) | 2020-01-14 | 2022-11-29 | Mks Instruments, Inc. | Method and apparatus for pulse gas delivery with concentration measurement |
| KR20220122917A (ko) * | 2021-02-26 | 2022-09-05 | (주)지오엘리먼트 | 넓은 가용 온도 범위를 가지는 고순도 전구체 기화 시스템 |
| KR20220122434A (ko) * | 2021-02-26 | 2022-09-02 | (주)지오엘리먼트 | 고순도 전구체를 위한 기화 시스템 |
| CN115572956B (zh) * | 2022-10-14 | 2024-09-17 | 华虹半导体(无锡)有限公司 | 调控晶圆原子层化学沉积薄膜厚度均匀性的方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61279678A (ja) * | 1985-06-05 | 1986-12-10 | Nippon Tairan Kk | 流量制御装置 |
| JPH0610144A (ja) * | 1992-06-29 | 1994-01-18 | Matsushita Electric Ind Co Ltd | 低蒸気圧材料供給装置 |
| JPH0718449A (ja) * | 1993-07-02 | 1995-01-20 | Hitachi Ltd | 高温気体定流量発生装置およびプロセス装置 |
| US5614247A (en) * | 1994-09-30 | 1997-03-25 | International Business Machines Corporation | Apparatus for chemical vapor deposition of aluminum oxide |
| US5648113A (en) * | 1994-09-30 | 1997-07-15 | International Business Machines Corporation | Aluminum oxide LPCVD system |
| JP2866374B1 (ja) * | 1998-01-27 | 1999-03-08 | 三菱マテリアルポリシリコン株式会社 | エピタキシャル成長用ガスの供給方法及びその装置 |
| JP4213331B2 (ja) * | 1999-06-22 | 2009-01-21 | 東京エレクトロン株式会社 | 有機金属気相成長方法及び有機金属気相成長装置 |
| JP3905678B2 (ja) * | 2000-02-28 | 2007-04-18 | 株式会社堀場製作所 | 薄膜堆積方法とその装置および薄膜堆積方法に用いるftirガス分析計並びに薄膜堆積方法に用いる混合ガス供給装置 |
| JP2002356779A (ja) * | 2001-05-29 | 2002-12-13 | Murata Mfg Co Ltd | 誘電体薄膜の製造装置及び誘電体薄膜の成膜方法 |
| JP2006324532A (ja) * | 2005-05-20 | 2006-11-30 | Matsushita Electric Ind Co Ltd | 薄膜堆積方法および薄膜堆積装置 |
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2012
- 2012-05-31 JP JP2012124713A patent/JP5895712B2/ja not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2013249511A (ja) | 2013-12-12 |
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