JP5893838B2 - 放熱部品及びそれを有する半導体パッケージ、放熱部品の製造方法 - Google Patents

放熱部品及びそれを有する半導体パッケージ、放熱部品の製造方法 Download PDF

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Publication number
JP5893838B2
JP5893838B2 JP2011061604A JP2011061604A JP5893838B2 JP 5893838 B2 JP5893838 B2 JP 5893838B2 JP 2011061604 A JP2011061604 A JP 2011061604A JP 2011061604 A JP2011061604 A JP 2011061604A JP 5893838 B2 JP5893838 B2 JP 5893838B2
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Japan
Prior art keywords
layer
heat
heat dissipation
semiconductor element
component
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JP2011061604A
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Japanese (ja)
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JP2012199332A (ja
JP2012199332A5 (https=
Inventor
順之 諏訪
順之 諏訪
賢二 川村
賢二 川村
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011061604A priority Critical patent/JP5893838B2/ja
Priority to US13/419,926 priority patent/US9093417B2/en
Publication of JP2012199332A publication Critical patent/JP2012199332A/ja
Publication of JP2012199332A5 publication Critical patent/JP2012199332A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2011061604A 2011-03-18 2011-03-18 放熱部品及びそれを有する半導体パッケージ、放熱部品の製造方法 Active JP5893838B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011061604A JP5893838B2 (ja) 2011-03-18 2011-03-18 放熱部品及びそれを有する半導体パッケージ、放熱部品の製造方法
US13/419,926 US9093417B2 (en) 2011-03-18 2012-03-14 Heat radiating component and semiconductor package having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011061604A JP5893838B2 (ja) 2011-03-18 2011-03-18 放熱部品及びそれを有する半導体パッケージ、放熱部品の製造方法

Publications (3)

Publication Number Publication Date
JP2012199332A JP2012199332A (ja) 2012-10-18
JP2012199332A5 JP2012199332A5 (https=) 2014-02-06
JP5893838B2 true JP5893838B2 (ja) 2016-03-23

Family

ID=46827819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011061604A Active JP5893838B2 (ja) 2011-03-18 2011-03-18 放熱部品及びそれを有する半導体パッケージ、放熱部品の製造方法

Country Status (2)

Country Link
US (1) US9093417B2 (https=)
JP (1) JP5893838B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014077081A1 (ja) * 2012-11-15 2014-05-22 東芝ホームテクノ株式会社 ヒートパイプ、スマートフォン、タブレット端末または携帯情報端末
JP6207073B2 (ja) * 2012-12-10 2017-10-04 三菱マテリアル株式会社 アルミニウム製熱交換器、ヒートシンク付パワーモジュール用基板、及び、アルミニウム製熱交換器の製造方法
JP6454996B2 (ja) * 2014-07-01 2019-01-23 セイコーエプソン株式会社 液体吐出装置
DE102015108420A1 (de) * 2015-05-28 2016-12-01 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Trägerelements, Trägerelement und elektronisches Bauelement mit einem Trägerelement
CN111989773A (zh) * 2018-04-19 2020-11-24 日本精机株式会社 电子器件的放热结构与具有它的显示装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
JPH06302730A (ja) * 1993-04-19 1994-10-28 Shinko Electric Ind Co Ltd 放熱板と半導体装置
JPH06309946A (ja) * 1993-04-23 1994-11-04 Showa Electric Wire & Cable Co Ltd 耐熱電線
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
JPH1074872A (ja) 1996-08-29 1998-03-17 Sumitomo Metal Mining Co Ltd ヒートスプレッダー
JP3261610B2 (ja) * 1997-02-14 2002-03-04 株式会社亀山鉄工所 電気温水器に於けるヒーターユニット
JP2928236B1 (ja) * 1998-07-23 1999-08-03 米沢日本電気株式会社 発熱素子の放熱部材
JP2000313996A (ja) * 1999-04-26 2000-11-14 Sumitomo Electric Ind Ltd アルミニウム複合部材
JP2001291806A (ja) 2000-04-06 2001-10-19 Housen Kk ヒートシンク
JP2002151633A (ja) * 2000-11-08 2002-05-24 Citizen Watch Co Ltd 樹脂封止型半導体装置
JP2004104074A (ja) 2002-07-17 2004-04-02 Sumitomo Electric Ind Ltd 半導体装置用部材
US6937473B2 (en) * 2003-06-30 2005-08-30 Intel Corporation Heatsink device and method
JP4334299B2 (ja) * 2003-08-22 2009-09-30 株式会社東芝 電気接点、電気接点摩耗検出装置およびその摩耗検出方法
CN105886825B (zh) * 2008-07-17 2017-12-26 电化株式会社 铝‑金刚石类复合体及其制造方法
US8174113B2 (en) * 2008-09-17 2012-05-08 Intel Corporation Methods of fabricating robust integrated heat spreader designs and structures formed thereby

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Publication number Publication date
US20120235292A1 (en) 2012-09-20
JP2012199332A (ja) 2012-10-18
US9093417B2 (en) 2015-07-28

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