JP5883203B2 - 応力固有素材及び形状記憶素材を使用したmemsデバイスの製造方法 - Google Patents
応力固有素材及び形状記憶素材を使用したmemsデバイスの製造方法 Download PDFInfo
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C23/00—Digital stores characterised by movement of mechanical parts to effect storage, e.g. using balls; Storage elements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
- F03G7/065—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like using a shape memory element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
- F04B17/003—Pumps characterised by combination with, or adaptation to, specific driving engines or motors driven by piezoelectric means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
- H10N30/2042—Cantilevers, i.e. having one fixed end
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2201/00—Metals
- F05C2201/04—Heavy metals
- F05C2201/0403—Refractory metals, e.g. V, W
- F05C2201/0412—Titanium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2203/00—Non-metallic inorganic materials
- F05C2203/08—Ceramics; Oxides
- F05C2203/0804—Non-oxide ceramics
- F05C2203/0813—Carbides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2251/00—Material properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2251/00—Material properties
- F05C2251/08—Shape memory
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Micromachines (AREA)
Description
Claims (7)
- 少なくとも一種類の形状記憶素材を堆積させて少なくとも一の薄い形状記憶素材膜を成膜し、
少なくとも一種類の応力固有素材を堆積させて少なくとも一の薄い応力固有素材膜を成膜し、
応力固有素材膜を形状記憶素材膜に並んで配置し、
応力固有素材膜は、その形成時に固有の応力勾配を付与され、
応力固有素材膜に固有の応力勾配によって初期変形状態へと戻るデバイスの製造方法。 - 請求項1に記載のデバイスの製造方法であって、
前記形状記憶膜は、相遷移温度よりも温度が高い状態のヤング率及び降伏応力が相遷移温度よりも温度が低い状態のヤング率及び降伏応力よりも大きくなる少なくとも一種類の形状記憶素材を含み、
前記相遷移温度よりも温度が低い場合には、前記形状記憶素材膜の前記応力固有素材膜に付与する応力勾配が前記応力固有素材膜に固有の応力勾配より小さく、前記応力固有素材膜に固有の応力勾配によって規定される第1の変形状態となり、
前記相遷移温度よりも温度が高い場合には、前記形状記憶素材膜の前記応力固有素材膜に付与する応力勾配が前記応力固有素材膜に固有の応力勾配よりも大きく、前記形状記憶素材膜によって規定される前記第1の変形状態と異なる第2の変形状態となり、
前記第1の変形状態と前記第2の変形状態とを繰り返すデバイスの製造方法。 - 請求項2に記載のデバイスの製造方法であって、
前記デバイスは、前記形状記憶素材膜と、前記応力固有素材膜との間に誘電体膜を挟み込むように配置され、その各一端が基板に固定されたカンチレバー型アクチュエータであり、
一端の前記形状記憶素材膜と前記応力固有素材膜とにはそれぞれ電極が接続され、
他端の前記形状記憶素材膜と前記応力固有素材膜のみが導通するように接触していること、
を特徴とするデバイスの製造方法。 - 請求項2に記載のデバイスの製造方法であって、
前記デバイスは、その周縁が基板に固定されたダイアフラム型アクチュエータであり、
周縁の対向する2点の前記形状記憶素材膜にそれぞれ電極が接続されていること、
を特徴とするデバイスの製造方法。 - 基板を準備するステップと、
基板上に犠牲層を堆積させるステップと、
相遷移温度よりも温度が高い状態のヤング率及び降伏応力が相遷移温度よりも温度が低い状態のヤング率及び降伏応力よりも大きくなる形状記憶合金膜を堆積させアニーリングするステップと、
堆積した応力固有素材膜内に応力勾配が生じるよう堆積パラメータ又は堆積パラメータ群を制御しつつ応力固有素材膜を堆積させるステップと、
基板から形状記憶合金膜及び応力固有素材膜の一部が分離して多層構造を有するデバイスが形成されるよう犠牲層を少なくとも部分的に除去するステップと、を有するデバイスを製造する方法であって、
前記形状記憶合金膜と応力固有素材膜とは、前記相遷移温度よりも温度が低い場合には、前記形状記憶合金膜の前記応力固有素材膜に付与する応力勾配が前記応力固有素材膜に固有の応力勾配よりも小さく、前記応力固有素材膜に固有の応力勾配によって規定される第1の変形状態となり、相遷移温度よりも温度が高い場合には、前記形状記憶合金膜の前記応力固有素材膜に付与する応力勾配が前記応力固有素材膜に固有の応力勾配よりも大きく、前記形状記憶合金膜によって規定される前記第1の変形状態と異なる第2の変形状態とするよう堆積、アニーリングされること、
を特徴とするデバイスを製造する方法。 - 請求項5に記載のデバイスを製造する方法であって、
空洞が形成されるよう基板素材をパターニングするステップを有し、
少なくとも一の薄い前記形状記憶合金膜及び少なくとも一の薄い応力固有素材膜を含み、
前記デバイスは、カンチレバー型またはダイアフラム型のデバイスを製造する方法。 - 請求項5または6に記載のデバイスを製造する方法であって、
仮基板の上に犠牲層を堆積させるステップと、
前記形状記憶合金膜を堆積させアニーリングするステップと、
前記基板を前記応力固有素材膜に固定するステップと、
前記犠牲層及び前記仮基板を除去するステップと、
を有するデバイスを製造する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/923,277 US7372348B2 (en) | 2004-08-20 | 2004-08-20 | Stressed material and shape memory material MEMS devices and methods for manufacturing |
US10/923,277 | 2004-08-20 |
Publications (2)
Publication Number | Publication Date |
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JP2006055991A JP2006055991A (ja) | 2006-03-02 |
JP5883203B2 true JP5883203B2 (ja) | 2016-03-09 |
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JP2005235102A Expired - Fee Related JP5883203B2 (ja) | 2004-08-20 | 2005-08-15 | 応力固有素材及び形状記憶素材を使用したmemsデバイスの製造方法 |
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Country | Link |
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US (2) | US7372348B2 (ja) |
EP (1) | EP1630416B1 (ja) |
JP (1) | JP5883203B2 (ja) |
Cited By (1)
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KR102497922B1 (ko) | 2021-05-11 | 2023-02-10 | 한국과학기술원 | 열-기계적 처리를 통한 열팽창 제어형 형상기억합금 및 그의 제조 방법 |
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US7372348B2 (en) | 2008-05-13 |
JP2006055991A (ja) | 2006-03-02 |
US7687108B2 (en) | 2010-03-30 |
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US20090320992A1 (en) | 2009-12-31 |
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