JP5877291B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP5877291B2
JP5877291B2 JP2010112023A JP2010112023A JP5877291B2 JP 5877291 B2 JP5877291 B2 JP 5877291B2 JP 2010112023 A JP2010112023 A JP 2010112023A JP 2010112023 A JP2010112023 A JP 2010112023A JP 5877291 B2 JP5877291 B2 JP 5877291B2
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JP
Japan
Prior art keywords
resin
semiconductor device
semiconductor element
circuit board
thermal expansion
Prior art date
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Expired - Fee Related
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JP2010112023A
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English (en)
Japanese (ja)
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JP2011243624A5 (https=
JP2011243624A (ja
Inventor
一路 清水
一路 清水
正浩 小野
正浩 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2010112023A priority Critical patent/JP5877291B2/ja
Publication of JP2011243624A publication Critical patent/JP2011243624A/ja
Publication of JP2011243624A5 publication Critical patent/JP2011243624A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2010112023A 2010-05-14 2010-05-14 半導体装置およびその製造方法 Expired - Fee Related JP5877291B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010112023A JP5877291B2 (ja) 2010-05-14 2010-05-14 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010112023A JP5877291B2 (ja) 2010-05-14 2010-05-14 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2011243624A JP2011243624A (ja) 2011-12-01
JP2011243624A5 JP2011243624A5 (https=) 2013-05-02
JP5877291B2 true JP5877291B2 (ja) 2016-03-08

Family

ID=45410029

Family Applications (1)

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JP2010112023A Expired - Fee Related JP5877291B2 (ja) 2010-05-14 2010-05-14 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP5877291B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012165111A1 (ja) * 2011-05-31 2012-12-06 株式会社村田製作所 多層基板の製造方法および多層基板
JP6051630B2 (ja) * 2011-07-13 2016-12-27 味の素株式会社 半導体パッケージ
JP6805510B2 (ja) * 2016-03-14 2020-12-23 日本電気株式会社 半導体装置およびその製造方法
KR102015335B1 (ko) * 2016-03-15 2019-08-28 삼성전자주식회사 전자부품 패키지 및 그 제조방법
JP6897056B2 (ja) * 2016-10-20 2021-06-30 富士電機株式会社 半導体装置及び半導体装置製造方法
JP6968553B2 (ja) 2017-03-09 2021-11-17 キヤノン株式会社 電子部品及びその製造方法
JP6984155B2 (ja) * 2017-04-06 2021-12-17 株式会社デンソー 電子装置
JP2018207212A (ja) * 2017-05-31 2018-12-27 京セラ株式会社 水晶デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291434A (ja) * 1992-04-13 1993-11-05 Mitsubishi Electric Corp 樹脂封止半導体装置およびその製造方法
JP3443313B2 (ja) * 1998-03-26 2003-09-02 三菱電機株式会社 半導体装置及びその製造方法
JP2001127212A (ja) * 1999-10-26 2001-05-11 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP4328520B2 (ja) * 2002-12-06 2009-09-09 日本電気株式会社 半導体装置及びその製造方法
JP2007066960A (ja) * 2005-08-29 2007-03-15 Seiko Instruments Inc 半導体パッケージ及び回路基板並びに半導体パッケージの製造方法

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Publication number Publication date
JP2011243624A (ja) 2011-12-01

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