JP5863914B1 - 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法 - Google Patents

半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法 Download PDF

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Publication number
JP5863914B1
JP5863914B1 JP2014181752A JP2014181752A JP5863914B1 JP 5863914 B1 JP5863914 B1 JP 5863914B1 JP 2014181752 A JP2014181752 A JP 2014181752A JP 2014181752 A JP2014181752 A JP 2014181752A JP 5863914 B1 JP5863914 B1 JP 5863914B1
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JP
Japan
Prior art keywords
adhesive layer
semiconductor processing
wafer
tape
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014181752A
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English (en)
Japanese (ja)
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JP2016058458A (ja
Inventor
俊光 中村
俊光 中村
二朗 杉山
二朗 杉山
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2014181752A priority Critical patent/JP5863914B1/ja
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to CN201580046165.5A priority patent/CN106663617B/zh
Priority to SG11201701479TA priority patent/SG11201701479TA/en
Priority to PCT/JP2015/074338 priority patent/WO2016035687A1/ja
Priority to KR1020177005291A priority patent/KR101828226B1/ko
Priority to MYPI2017000293A priority patent/MY168988A/en
Priority to TW104129372A priority patent/TWI591701B/zh
Application granted granted Critical
Publication of JP5863914B1 publication Critical patent/JP5863914B1/ja
Publication of JP2016058458A publication Critical patent/JP2016058458A/ja
Priority to PH12017500394A priority patent/PH12017500394A1/en
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)
JP2014181752A 2014-09-05 2014-09-05 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法 Active JP5863914B1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2014181752A JP5863914B1 (ja) 2014-09-05 2014-09-05 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法
SG11201701479TA SG11201701479TA (en) 2014-09-05 2015-08-28 Adhesive tape for semiconductor processing and semiconductor device produced using the same
PCT/JP2015/074338 WO2016035687A1 (ja) 2014-09-05 2015-08-28 半導体加工用テープ及びこれを使用して製造した半導体装置
KR1020177005291A KR101828226B1 (ko) 2014-09-05 2015-08-28 반도체 가공용 테이프 및 이것을 사용하여 제조한 반도체 장치
CN201580046165.5A CN106663617B (zh) 2014-09-05 2015-08-28 半导体加工用带及使用此所制造的半导体装置
MYPI2017000293A MY168988A (en) 2014-09-05 2015-08-28 Adhesive tape for semiconductor processing and semiconductor device produced using the same
TW104129372A TWI591701B (zh) 2014-09-05 2015-09-04 Tapes for semiconductor processing and semiconductor devices manufactured using the same
PH12017500394A PH12017500394A1 (en) 2014-09-05 2017-03-02 Adhesive tape for semiconductor processing and semiconductor device produced using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014181752A JP5863914B1 (ja) 2014-09-05 2014-09-05 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP5863914B1 true JP5863914B1 (ja) 2016-02-17
JP2016058458A JP2016058458A (ja) 2016-04-21

Family

ID=55346911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014181752A Active JP5863914B1 (ja) 2014-09-05 2014-09-05 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法

Country Status (8)

Country Link
JP (1) JP5863914B1 (zh)
KR (1) KR101828226B1 (zh)
CN (1) CN106663617B (zh)
MY (1) MY168988A (zh)
PH (1) PH12017500394A1 (zh)
SG (1) SG11201701479TA (zh)
TW (1) TWI591701B (zh)
WO (1) WO2016035687A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471879B2 (ja) * 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
CN114615835A (zh) * 2022-04-26 2022-06-10 生益电子股份有限公司 一种阶梯式线路板及其制作方法、双层胶带
CN116544151B (zh) * 2023-07-05 2023-09-19 砺铸智能设备(天津)有限公司 一种用于芯片的检测、封装设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019962A (ja) * 2003-06-06 2005-01-20 Hitachi Chem Co Ltd 接着シート
JP2007335643A (ja) * 2006-06-15 2007-12-27 Nitto Denko Corp 半導体装置の製造方法
JP2009164556A (ja) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2011071492A (ja) * 2009-08-25 2011-04-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2012028598A (ja) * 2010-07-26 2012-02-09 Furukawa Electric Co Ltd:The ウエハ加工用テープ
WO2014017537A1 (ja) * 2012-07-26 2014-01-30 古河電気工業株式会社 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
CN101362926B (zh) * 2003-06-06 2012-08-15 日立化成工业株式会社 粘合片、与切割胶带一体化的粘合片以及半导体的制造方法
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
CN102373017A (zh) * 2010-08-19 2012-03-14 古河电气工业株式会社 晶片加工用胶带

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019962A (ja) * 2003-06-06 2005-01-20 Hitachi Chem Co Ltd 接着シート
JP2007335643A (ja) * 2006-06-15 2007-12-27 Nitto Denko Corp 半導体装置の製造方法
JP2009164556A (ja) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2011071492A (ja) * 2009-08-25 2011-04-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2012028598A (ja) * 2010-07-26 2012-02-09 Furukawa Electric Co Ltd:The ウエハ加工用テープ
WO2014017537A1 (ja) * 2012-07-26 2014-01-30 古河電気工業株式会社 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ

Also Published As

Publication number Publication date
SG11201701479TA (en) 2017-03-30
CN106663617B (zh) 2018-05-29
KR20170030645A (ko) 2017-03-17
KR101828226B1 (ko) 2018-02-09
PH12017500394B1 (en) 2017-07-17
MY168988A (en) 2019-01-29
TW201616560A (zh) 2016-05-01
CN106663617A (zh) 2017-05-10
PH12017500394A1 (en) 2017-07-17
JP2016058458A (ja) 2016-04-21
TWI591701B (zh) 2017-07-11
WO2016035687A1 (ja) 2016-03-10

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