MY168988A - Adhesive tape for semiconductor processing and semiconductor device produced using the same - Google Patents

Adhesive tape for semiconductor processing and semiconductor device produced using the same

Info

Publication number
MY168988A
MY168988A MYPI2017000293A MYPI2017000293A MY168988A MY 168988 A MY168988 A MY 168988A MY PI2017000293 A MYPI2017000293 A MY PI2017000293A MY PI2017000293 A MYPI2017000293 A MY PI2017000293A MY 168988 A MY168988 A MY 168988A
Authority
MY
Malaysia
Prior art keywords
adhesive layer
adhesive tape
semiconductor processing
same
semiconductor
Prior art date
Application number
MYPI2017000293A
Other languages
English (en)
Inventor
Toshimitsu Nakamura
Jirou Sugiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY168988A publication Critical patent/MY168988A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)
MYPI2017000293A 2014-09-05 2015-08-28 Adhesive tape for semiconductor processing and semiconductor device produced using the same MY168988A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014181752A JP5863914B1 (ja) 2014-09-05 2014-09-05 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法

Publications (1)

Publication Number Publication Date
MY168988A true MY168988A (en) 2019-01-29

Family

ID=55346911

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000293A MY168988A (en) 2014-09-05 2015-08-28 Adhesive tape for semiconductor processing and semiconductor device produced using the same

Country Status (8)

Country Link
JP (1) JP5863914B1 (zh)
KR (1) KR101828226B1 (zh)
CN (1) CN106663617B (zh)
MY (1) MY168988A (zh)
PH (1) PH12017500394A1 (zh)
SG (1) SG11201701479TA (zh)
TW (1) TWI591701B (zh)
WO (1) WO2016035687A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471879B2 (ja) * 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
CN114615835A (zh) * 2022-04-26 2022-06-10 生益电子股份有限公司 一种阶梯式线路板及其制作方法、双层胶带
CN116544151B (zh) * 2023-07-05 2023-09-19 砺铸智能设备(天津)有限公司 一种用于芯片的检测、封装设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP4770126B2 (ja) * 2003-06-06 2011-09-14 日立化成工業株式会社 接着シート
CN101362926B (zh) * 2003-06-06 2012-08-15 日立化成工业株式会社 粘合片、与切割胶带一体化的粘合片以及半导体的制造方法
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP4979063B2 (ja) * 2006-06-15 2012-07-18 日東電工株式会社 半導体装置の製造方法
JP2009164556A (ja) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP4785095B2 (ja) * 2009-08-25 2011-10-05 古河電気工業株式会社 ウエハ加工用テープ
JP5323779B2 (ja) * 2010-07-26 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ
CN102373017A (zh) * 2010-08-19 2012-03-14 古河电气工业株式会社 晶片加工用胶带
WO2014017537A1 (ja) * 2012-07-26 2014-01-30 古河電気工業株式会社 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ

Also Published As

Publication number Publication date
SG11201701479TA (en) 2017-03-30
CN106663617B (zh) 2018-05-29
KR20170030645A (ko) 2017-03-17
KR101828226B1 (ko) 2018-02-09
PH12017500394B1 (en) 2017-07-17
TW201616560A (zh) 2016-05-01
CN106663617A (zh) 2017-05-10
PH12017500394A1 (en) 2017-07-17
JP2016058458A (ja) 2016-04-21
TWI591701B (zh) 2017-07-11
JP5863914B1 (ja) 2016-02-17
WO2016035687A1 (ja) 2016-03-10

Similar Documents

Publication Publication Date Title
MX2016011203A (es) Metodo para cortar una capa de vidrio laminada, ultradelgada.
MX2019006539A (es) Sistemas y metodos para la extraccion de productos naturales.
WO2015112015A8 (en) Downstream processing of an alkaline phosphatase
EA033209B1 (ru) Стеклопанель со световой сигнализацией, автомобиль, содержащий такую стеклопанель, и ее получение
MY191606A (en) Sheet for semiconductor processing
MX2017006997A (es) Proceso para manipular el nivel de contenido de glicano de una glicoproteina.
EP3488436A4 (en) EMISSION CONTROL CIRCUIT, DISPLAY DEVICE THEREFOR AND CONTROL METHOD THEREFOR
MY184081A (en) Food processing apparatus and food manufacturing method using the same
MX2015004477A (es) Proceso de laminacion que emplea la aplicacion de adhesivo similar a una rejilla.
GB2540702A (en) Nucleic acid processing of a nucleic acid fragment with a triazole linkage
WO2017076949A3 (de) Laminierungsmaschine und ein verfahren zum laminieren zumindest eines materials
WO2018178334A3 (fr) Purification des phycobiliproteines
SG11201808444VA (en) Method and device for bonding two substrates
UY36696A (es) Un método y un aparato para formar una fracción de lignina, una composición de lignina y su uso
SG11201607716PA (en) Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product
MX2017001231A (es) Aparato y metodo para generar una senal mejorada usando relleno de ruido independiente.
MX2019003145A (es) Cinta multicapa.
WO2017122098A9 (en) Immunopotentiator enhanced superantigen mediated cancer immunotherapy
WO2016094834A3 (en) A method for treating a complement mediated disorder caused by an infectious agent in a patient
SG11201901752RA (en) Method for improving aftertaste of alcoholic beverages using allulose
WO2018101663A3 (ko) 생체 조직 투명화용 조성물 및 이를 이용한 생체 조직 투명화 방법
AU2017247004A1 (en) Method of treating atherosclerosis
MY168988A (en) Adhesive tape for semiconductor processing and semiconductor device produced using the same
MX2018008041A (es) Acristalamiento laminado para vehiculo con pantalla de amoled.
MX2016013670A (es) Sistema de sujecion.