JP5858854B2 - Ledモジュール - Google Patents
Ledモジュール Download PDFInfo
- Publication number
- JP5858854B2 JP5858854B2 JP2012092594A JP2012092594A JP5858854B2 JP 5858854 B2 JP5858854 B2 JP 5858854B2 JP 2012092594 A JP2012092594 A JP 2012092594A JP 2012092594 A JP2012092594 A JP 2012092594A JP 5858854 B2 JP5858854 B2 JP 5858854B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- circuit
- input terminal
- current input
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 27
- 238000010586 diagram Methods 0.000 description 19
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012092594A JP5858854B2 (ja) | 2012-04-16 | 2012-04-16 | Ledモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012092594A JP5858854B2 (ja) | 2012-04-16 | 2012-04-16 | Ledモジュール |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013222782A JP2013222782A (ja) | 2013-10-28 |
JP2013222782A5 JP2013222782A5 (enrdf_load_stackoverflow) | 2014-12-18 |
JP5858854B2 true JP5858854B2 (ja) | 2016-02-10 |
Family
ID=49593564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012092594A Expired - Fee Related JP5858854B2 (ja) | 2012-04-16 | 2012-04-16 | Ledモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5858854B2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110895302A (zh) * | 2018-09-12 | 2020-03-20 | 启端光电股份有限公司 | 发光二极管检测系统 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI505456B (zh) * | 2013-11-22 | 2015-10-21 | Brightek Optoelectronic Shenzhen Co Ltd | Led承載座模組及led發光裝置 |
KR101527430B1 (ko) * | 2014-06-17 | 2015-06-11 | (주)에너브레인 | 씨오비 타입 발광다이오드 램프 및 그 제조방법 |
JP2016063030A (ja) * | 2014-09-17 | 2016-04-25 | シチズンホールディングス株式会社 | Led駆動回路 |
DE102017110378B4 (de) | 2017-05-12 | 2023-03-02 | Ledvance Gmbh | LED-Lampe mit LED-Leuchtmittel |
DE102017115885A1 (de) | 2017-07-14 | 2019-01-17 | Ledvance Gmbh | LED-Leuchtmittel und LED-Lampe |
JP6879270B2 (ja) * | 2018-07-20 | 2021-06-02 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007001116A1 (en) * | 2005-06-28 | 2007-01-04 | Seoul Opto Device Co., Ltd. | Light emitting device for ac power operation |
CN100562199C (zh) * | 2005-11-03 | 2009-11-18 | 光纤设计公司 | 独特的整流灯串 |
JP5288161B2 (ja) * | 2008-02-14 | 2013-09-11 | 東芝ライテック株式会社 | 発光モジュール及び照明装置 |
US8461613B2 (en) * | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
JP5471330B2 (ja) * | 2009-07-14 | 2014-04-16 | 日亜化学工業株式会社 | 発光ダイオード駆動回路及び発光ダイオードの点灯制御方法 |
HUE047273T2 (hu) * | 2009-08-14 | 2020-04-28 | Signify North America Corp | Spektrális eltolás vezérlés szabályozható AC LED világításhoz |
JP2011134903A (ja) * | 2009-12-24 | 2011-07-07 | Toyoda Gosei Co Ltd | Ledパッケージ |
TWI445158B (zh) * | 2011-03-14 | 2014-07-11 | Interlight Optotech Corp | 發光裝置 |
JP2013214615A (ja) * | 2012-04-02 | 2013-10-17 | Citizen Holdings Co Ltd | Ledモジュール及びそれを用いたled光源ユニット |
-
2012
- 2012-04-16 JP JP2012092594A patent/JP5858854B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110895302A (zh) * | 2018-09-12 | 2020-03-20 | 启端光电股份有限公司 | 发光二极管检测系统 |
CN110895302B (zh) * | 2018-09-12 | 2022-10-28 | 启端光电股份有限公司 | 发光二极管检测系统 |
Also Published As
Publication number | Publication date |
---|---|
JP2013222782A (ja) | 2013-10-28 |
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