JP5858852B2 - Ledモジュール - Google Patents
Ledモジュール Download PDFInfo
- Publication number
- JP5858852B2 JP5858852B2 JP2012088287A JP2012088287A JP5858852B2 JP 5858852 B2 JP5858852 B2 JP 5858852B2 JP 2012088287 A JP2012088287 A JP 2012088287A JP 2012088287 A JP2012088287 A JP 2012088287A JP 5858852 B2 JP5858852 B2 JP 5858852B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- partial
- row
- current input
- input terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012088287A JP5858852B2 (ja) | 2012-04-09 | 2012-04-09 | Ledモジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012088287A JP5858852B2 (ja) | 2012-04-09 | 2012-04-09 | Ledモジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013219167A JP2013219167A (ja) | 2013-10-24 |
| JP2013219167A5 JP2013219167A5 (enExample) | 2014-12-18 |
| JP5858852B2 true JP5858852B2 (ja) | 2016-02-10 |
Family
ID=49590953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012088287A Expired - Fee Related JP5858852B2 (ja) | 2012-04-09 | 2012-04-09 | Ledモジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5858852B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6259998B2 (ja) * | 2014-01-27 | 2018-01-17 | パナソニックIpマネジメント株式会社 | 光源装置及びそれを用いた投写型映像表示装置 |
| JP2016063030A (ja) * | 2014-09-17 | 2016-04-25 | シチズンホールディングス株式会社 | Led駆動回路 |
| CN105633245A (zh) * | 2015-01-16 | 2016-06-01 | 江苏生辉光电科技有限公司 | 一种cob封装固晶工艺 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5408414B2 (ja) * | 2009-06-10 | 2014-02-05 | 東芝ライテック株式会社 | 発光モジュール |
| WO2011020016A1 (en) * | 2009-08-14 | 2011-02-17 | Once Innovations, Inc. | Spectral shift control for dimmable ac led lighting |
-
2012
- 2012-04-09 JP JP2012088287A patent/JP5858852B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013219167A (ja) | 2013-10-24 |
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