JP5858852B2 - Ｌｅｄモジュール - Google Patents
Ｌｅｄモジュール Download PDFInfo
- Publication number
- JP5858852B2 JP5858852B2 JP2012088287A JP2012088287A JP5858852B2 JP 5858852 B2 JP5858852 B2 JP 5858852B2 JP 2012088287 A JP2012088287 A JP 2012088287A JP 2012088287 A JP2012088287 A JP 2012088287A JP 5858852 B2 JP5858852 B2 JP 5858852B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- partial
- row
- current input
- input terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000009826 distribution Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012088287A JP5858852B2 (ja) | 2012-04-09 | 2012-04-09 | Ｌｅｄモジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012088287A JP5858852B2 (ja) | 2012-04-09 | 2012-04-09 | Ｌｅｄモジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013219167A JP2013219167A (ja) | 2013-10-24 |
| JP2013219167A5 JP2013219167A5 (enrdf_load_stackoverflow) | 2014-12-18 |
| JP5858852B2 true JP5858852B2 (ja) | 2016-02-10 |
Family
ID=49590953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012088287A Expired - Fee Related JP5858852B2 (ja) | 2012-04-09 | 2012-04-09 | Ｌｅｄモジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5858852B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6259998B2 (ja) * | 2014-01-27 | 2018-01-17 | パナソニックＩｐマネジメント株式会社 | 光源装置及びそれを用いた投写型映像表示装置 |
| JP2016063030A (ja) * | 2014-09-17 | 2016-04-25 | シチズンホールディングス株式会社 | Ｌｅｄ駆動回路 |
| CN105633245A (zh) * | 2015-01-16 | 2016-06-01 | 江苏生辉光电科技有限公司 | 一种cob封装固晶工艺 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5408414B2 (ja) * | 2009-06-10 | 2014-02-05 | 東芝ライテック株式会社 | 発光モジュール |
| HUE047273T2 (hu) * | 2009-08-14 | 2020-04-28 | Signify North America Corp | Spektrális eltolás vezérlés szabályozható AC LED világításhoz |
-
2012
- 2012-04-09 JP JP2012088287A patent/JP5858852B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013219167A (ja) | 2013-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8872198B2 (en) | Luminaire and light-emitting apparatus with light-emitting device | |
| KR100593937B1 (ko) | Ｓｉ기판을 이용한 ＬＥＤ 패키지 및 그 제조방법 | |
| JP6210830B2 (ja) | Ｌｅｄ電球 | |
| JP5329787B2 (ja) | 実装基板およびｌｅｄモジュール | |
| US20110309379A1 (en) | Light-emitting device and luminare | |
| JP2014187366A (ja) | 積層型発光ダイオードのアレイ構造 | |
| JP5858854B2 (ja) | Ｌｅｄモジュール | |
| US20110309381A1 (en) | Light-emitting device and lighting apparatus | |
| JP2012094865A (ja) | 定電圧電源供給手段を使用するマルチチップパッケージ | |
| JP2012094866A (ja) | 交流電源に直接電気的に接続されるマルチチップパッケージ | |
| US20120094407A1 (en) | Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the same | |
| JPWO2012042962A1 (ja) | 発光装置および発光装置の製造方法 | |
| EP2590214A2 (en) | Light-emitting module and luminaire | |
| JP5858852B2 (ja) | Ｌｅｄモジュール | |
| CN110875292A (zh) | 发光装置 | |
| JP5946311B2 (ja) | Ｌｅｄモジュール | |
| JP2012248573A (ja) | 発光装置 | |
| US20130175563A1 (en) | Led chip structure, packaging substrate, package structure and fabrication method thereof | |
| US10937937B2 (en) | Optical semiconductor element | |
| KR101363980B1 (ko) | 광 모듈 및 그 제조 방법 | |
| KR101192816B1 (ko) | Ｌｅｄ 패키지 및 그 제조방법 | |
| JP5835799B2 (ja) | 発光モジュール | |
| JP2012004412A (ja) | 発光装置及び照明装置 | |
| JP6486726B2 (ja) | 発光モジュール | |
| JP6667237B2 (ja) | 発光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141030 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141030 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150930 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151027 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151118 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151201 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151215 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5858852 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |