JP5856274B2 - 半導体装置、半導体装置の製造方法、及びリードフレーム - Google Patents
半導体装置、半導体装置の製造方法、及びリードフレーム Download PDFInfo
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- JP5856274B2 JP5856274B2 JP2014225883A JP2014225883A JP5856274B2 JP 5856274 B2 JP5856274 B2 JP 5856274B2 JP 2014225883 A JP2014225883 A JP 2014225883A JP 2014225883 A JP2014225883 A JP 2014225883A JP 5856274 B2 JP5856274 B2 JP 5856274B2
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Description
第2多層配線層と、前記第2多層配線層に形成された第2インダクタとを有する第2半導体チップと、
を備え、
前記第1半導体チップと前記第2半導体チップは、前記第1多層配線層と前記第2多層配線層が互いに対向する向きに互いに重ねられており、
平面視において前記第1インダクタと前記第2インダクタが重なっており、
前記第1半導体チップ及び前記第2半導体チップは、それぞれ互いに対向していない非対向領域を有しており、
前記第1多層配線層は、前記非対向領域に第1外部接続端子を有しており、
前記第2多層配線層は、前記非対向領域に第2外部接続端子を有している半導体装置が提供される。
第2多層配線層、前記第2多層配線層に形成された第2インダクタ、及び前記第2多層配線層に形成された第2外部接続端子を有する第2半導体チップを、前記第1半導体チップ上に、前記第1多層配線層と前記第2多層配線層が互いに対向する向きに互いに重ねる工程と、
を備え、
前記第1半導体チップと前記第2半導体チップとを互いに重ねる工程において、
前記第1半導体チップ及び前記第2半導体チップそれぞれに、互いに対向していない領域を設け、かつ前記第1外部接続端子及び前記第2外部接続端子を当該領域に位置させる半導体装置の製造方法が提供される。
前記ダイパッドの一辺の近くから外側に向かって延伸している第1リードと、
前記ダイパッドの前記一辺とは異なる辺の近くから外側に向かって延伸している第2リードと、
を備え、
前記第1リードの先端から前記ダイパッドまでの距離は、前記第2リードの先端から前記ダイパッドまでの距離とは異なるリードフレームが提供される。
(付記1)
第1多層配線層、前記第1多層配線層に形成された第1インダクタ、及び前記第1多層配線層に形成された第1外部接続端子を有する第1半導体チップの裏面を、第1リードフレーム又は第1配線基板に固定する工程と、
第2多層配線層、前記第2多層配線層に形成された第2インダクタ、及び前記第2多層配線層に形成された第2外部接続端子を有する第2半導体チップを、前記第1半導体チップ上に対して位置決めしてから固定し、前記第1インダクタと前記第2インダクタを平面視において互いに重ねる工程と、
前記第1リードフレーム又は第1配線基板に対して第2リードフレームの位置決めを行い、その後前記第2半導体チップに前記第2リードフレームを固定する工程と、
を備える半導体装置の製造方法。
102 辺
110 第1多層配線層
120 配線
130 第1インダクタ
140 第1外部接続端子
160 第1ポリイミド層
162 開口
164 開口
170 第1保護絶縁膜
200 第2半導体チップ
202 辺
210 第2多層配線層
220 配線
230 第2インダクタ
240 第2外部接続端子
250 保護層
260 第2ポリイミド層
262 開口
264 開口
270 第2保護絶縁膜
300 第1リードフレーム
302 ダイパッド
304 吊りリード
305 吊りリード
306 リード
308 リード
310 第1ボンディングワイヤ
312 第2ボンディングワイヤ
320 第2リードフレーム
322 ダイパッド
340 封止樹脂
400 送信回路
402 変調処理部
404 送信側ドライバ回路
420 受信側回路
422 受信回路
424 受信側ドライバ回路
500 接着層
Claims (19)
- (a)第1主面、前記第1主面とは反対側の第1裏面、前記第1主面上に形成された第1インダクタ、及び前記第1主面に形成された第1外部接続端子を有する第1半導体チップを、第1リードフレームのダイパッドの表面と前記第1裏面とが対向するように、前記ダイパッド上に搭載する工程と、
(b)第2主面、前記第2主面とは反対側の第2裏面、前記第2主面上に形成された第2インダクタ、及び前記第2主面に形成された第2外部接続端子を有する第2半導体チップを、前記第1半導体チップの前記第1主面と前記第2主面とが対向するように、前記第1半導体チップ上に絶縁シートを挟んで搭載し、且つ平面視において前記第1インダクタと前記第2インダクタとを重ね合わせる工程と、
を備え、
前記(b)工程において、
前記第1半導体チップ及び前記第2半導体チップのそれぞれに、互いに対向していない領域を設け、かつ前記第1外部接続端子及び前記第2外部接続端子を当該領域に位置させ、
前記第1リードフレームは、第1リード及び第2リードを備えており、
(c)前記(b)工程の後に、
前記第1リードは、第1ワイヤを介して前記第1外部接続端子に接続しており、
前記第2リードは、第2ワイヤを介して前記第2外部接続端子に接続しており、
前記第1半導体チップ及び前記第2半導体チップが積層されている方向において、前記第1リード及び前記第2リードは、いずれも、前記第1半導体チップ側に位置する第1面と、前記第2半導体チップ側に位置する第2面とを有しており、
前記第1ワイヤは前記第1リードの前記第2面に接続しており、
前記第2ワイヤは前記第2リードの前記第1面に接続する工程と、を備え、
前記ダイパッドの上面に垂直な方向から見て、前記ダイパッドの上面は、
前記第1リードと対向する第1辺と、
前記第2リードと対向する第2辺と、
を有し、
前記第2リードと前記第2辺との間の距離は、前記第1リードと前記第1辺との間の距離より大きい半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
(d)前記(c)工程後に、前記ダイパッド、前記第1リードの一部、前記第2リードの一部、前記第1半導体チップ、前記第2半導体チップ、前記第1ワイヤ、および前記第2ワイヤを、封止樹脂によって封止する工程を備える半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記絶縁シートは、DAF(Die Attach Film)である半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記第1半導体チップは、送信回路及び受信回路の一方を備え、
前記第2半導体チップは、送信回路及び受信回路の他方を備える半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記第1インダクタ及び前記第2インダクタは、誘導結合を用いて電気信号を送受信する半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記ダイパッドの上面は、
前記第1辺と前記第2辺との間に位置する第3辺と、
前記第1辺と前記第2辺との間に位置し、前記第3辺と対向する第4辺と、
を有し、
前記第1リードフレームは、
一端、及び前記一端とは反対側の他端を有する第1吊りリードと、
一端、及び前記一端とは反対側の他端を有する第2吊りリードと、
を備え、
前記第2リードは、前記ダイパッドの前記第2辺に対向する一端、及び前記一端とは反対側の他端を有し、
前記第1吊りリードの前記一端は、前記ダイパッドの前記第2辺と前記第3辺との間の角に接続し、
前記第2吊りリードの前記一端は、前記ダイパッドの前記第2辺と前記第4辺との間の角に接続し、
前記第1吊りリードの前記他端は、前記ダイパッドの前記第2辺に垂直な方向において、前記第2リードの前記一端から、前記第2リードの前記他端とは逆側にずれており、
前記第2吊りリードの前記他端は、前記ダイパッドの前記第2辺に垂直な方向において、前記第2リードの前記一端から、前記第2リードの前記他端とは逆側にずれている半導体装置の製造方法。 - (a)第1リード、第2リード、及びチップ搭載部を有するリードフレームと、
矩形の第1主面、及び前記第1主面に形成された第1端子を有し、第1多層配線層及び前記第1多層配線層に形成された第1インダクタを有する第1半導体チップと、
矩形の第2主面、及び前記第2主面に形成された第2端子を有し、第2多層配線層及び前記第2多層配線層に形成された第2インダクタを有する第2半導体チップと、
を準備する工程と、
(b)前記第1半導体チップを、前記第1主面と逆側の面が前記チップ搭載部と対向する向きに前記チップ搭載部上に形成する工程と、
(c)前記第2半導体チップを、前記第2主面が前記第1主面と対向する向きに前記第1半導体チップ上に搭載し、かつ前記第1インダクタと前記第2インダクタとを平面視で重ねる工程と、
(d)前記第1端子と前記第1リードとを電気的に接続する第1ワイヤを形成する工程と、
(e)前記第2端子と前記第2リードとを電気的に接続する第2ワイヤを形成する工程と、
を備え、
前記第1半導体チップ及び前記第2半導体チップが積層されている方向において、前記第1リード及び前記第2リードは、いずれも、前記第1半導体チップ側に位置する第1面と、前記第2半導体チップ側に位置する第2面とを有しており、
前記(d)工程において、前記第1ワイヤは前記第1リードの前記第2面に接続しており、
前記(e)工程において、前記第2ワイヤは前記第2リードの前記第1面に接続しており、
前記(e)工程は、前記(d)工程に先だって実施され、
前記チップ搭載部の上面に垂直な方向から見て、前記チップ搭載部の上面は、
前記第1リードと対向する第1辺と、
前記第2リードと対向する第2辺と、
を有し、
前記第2リードと前記第2辺との間の距離は、前記第1リードと前記第1辺との間の距離より大きい半導体装置の製造方法。 - 請求項7に記載の半導体装置の製造方法において、
(f)前記第1リードの一端、前記第2リードの一端、前記第1ワイヤ、及び前記第2ワイヤを封止する封止樹脂を形成する工程を備える半導体装置の製造方法。 - 請求項8に記載の半導体装置の製造方法において、
前記(f)工程において、前記第1リードの他端及び前記第2リードの他端は、前記封止樹脂から外側に延出した延出部を形成する半導体装置の製造方法。 - 請求項7に記載の半導体装置の製造方法において、
前記(b)工程は、銀ペーストを介して前記第1半導体チップと前記チップ搭載部を相互に固定する工程を含む半導体装置の製造方法。 - 請求項10に記載の半導体装置の製造方法において、
前記(c)工程は、シート状接着剤を介して前記第1半導体チップと前記第2半導体チップを相互に固定する工程を含む半導体装置の製造方法。 - 請求項11に記載の半導体装置の製造方法において、
前記(c)工程は、前記第2半導体チップの裏面に形成されたアライメントマークを認識する工程を含む半導体装置の製造方法。 - 請求項12に記載の半導体装置の製造方法において、
前記第1リードの一端、前記第2リードの一端、前記第1ワイヤ、及び前記第2ワイヤを封止する封止樹脂を形成する工程と、
前記封止樹脂を形成する工程の前に、前記第2半導体チップの裏面に保護層を設ける工程と、
を備える半導体装置の製造方法。 - 請求項7に記載の半導体装置の製造方法において、
前記第1半導体チップは、送信回路及び受信回路の一方を備え、
前記第2半導体チップは、送信回路及び受信回路の他方を備える半導体装置の製造方法。 - 請求項14に記載の半導体装置の製造方法において、
前記第1インダクタ及び前記第2インダクタは、誘導結合を用いて電気信号を送受信する半導体装置の製造方法。 - 請求項15に記載の半導体装置の製造方法において、
前記半導体装置は、前記第1半導体チップの前記第1主面と前記第2半導体チップの前記第2主面との間に形成された絶縁層を備え、
前記第1半導体チップは、前記絶縁層と前記第1インダクタとの間に形成された第1絶縁膜を備え、
前記第2半導体チップは、前記絶縁層と前記第2インダクタとの間に形成された第2絶縁膜を備え、
前記第1絶縁膜及び前記第2絶縁膜はポリイミドを含み、
前記第1半導体チップは、シリコンを含む第3絶縁膜を前記第1絶縁膜と前記第1インダクタとの間に備え、
前記第2半導体チップは、シリコンを含む第4絶縁膜を前記第2絶縁膜と前記第2インダクタとの間に備え、
前記(c)工程は、シート状接着剤を介して前記第1半導体チップと前記第2半導体チップを相互に固定する工程を含む半導体装置の製造方法。 - 請求項7に記載の半導体装置の製造方法において、
前記半導体装置は、前記第1半導体チップ及び第2半導体チップを封止する封止樹脂をさらに備え、
前記第1リード及び前記第2リードの各々は、
前記封止樹脂内に位置する一端と、
前記封止樹脂の外に延出する他端と、
を有し、
前記半導体装置は、
前記第1リードの一端と前記第1端子との間を接続する前記第1ワイヤと、
前記第2リードの一端と前記第2端子との間を接続する前記第2ワイヤと、
をさらに備え、
前記封止樹脂は、前記チップ搭載部の上面に垂直な方向から見て、
封止樹脂第1辺と、
前記封止樹脂第1辺と対向する封止樹脂第2辺と、
前記封止樹脂第1辺と前記封止樹脂第2辺との間の封止樹脂第3辺と、
前記封止樹脂第3辺と対向する封止樹脂第4辺と、
を含み、
前記第1リードは前記封止樹脂第1辺と交差し、
前記第2リードは前記封止樹脂第2辺と交差する半導体装置の製造方法。 - 請求項17に記載の半導体装置の製造方法において、
前記半導体装置は、
一端が前記封止樹脂内に位置し他端が前記封止樹脂外に延出し、かつ、前記封止樹脂第3辺または前記封止樹脂第4辺と交差するリードを備えない半導体装置の製造方法。 - 請求項7に記載の半導体装置の製造方法において、
前記チップ搭載部の上面は、
前記第1辺と前記第2辺との間に位置する第3辺と、
前記第1辺と前記第2辺との間に位置し、前記第3辺と対向する第4辺と、
を有し、
前記リードフレームは、
一端、及び前記一端とは反対側の他端を有する第1吊りリードと、
一端、及び前記一端とは反対側の他端を有する第2吊りリードと、
を備え、
前記第2リードは、前記チップ搭載部の前記第2辺に対向する一端、及び前記一端とは反対側の他端を有し、
前記第1吊りリードの前記一端は、前記チップ搭載部の前記第2辺と前記第3辺との間の角に接続し、
前記第2吊りリードの前記一端は、前記チップ搭載部の前記第2辺と前記第4辺との間の角に接続し、
前記第1吊りリードの前記他端は、前記チップ搭載部の前記第2辺に垂直な方向において、前記第2リードの前記一端から、前記第2リードの前記他端とは逆側にずれており、
前記第2吊りリードの前記他端は、前記チップ搭載部の前記第2辺に垂直な方向において、前記第2リードの前記一端から、前記第2リードの前記他端とは逆側にずれている半導体装置の製造方法。
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