JP5851719B2 - マスクを用いてワークに導電性ボールを搭載する方法 - Google Patents

マスクを用いてワークに導電性ボールを搭載する方法 Download PDF

Info

Publication number
JP5851719B2
JP5851719B2 JP2011112586A JP2011112586A JP5851719B2 JP 5851719 B2 JP5851719 B2 JP 5851719B2 JP 2011112586 A JP2011112586 A JP 2011112586A JP 2011112586 A JP2011112586 A JP 2011112586A JP 5851719 B2 JP5851719 B2 JP 5851719B2
Authority
JP
Japan
Prior art keywords
mask
workpiece
work
ball
correction jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011112586A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012243951A (ja
Inventor
隆夫 藤津
隆夫 藤津
忠 谷貝
忠 谷貝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
Original Assignee
Athlete FA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Athlete FA Corp filed Critical Athlete FA Corp
Priority to JP2011112586A priority Critical patent/JP5851719B2/ja
Priority to CN201210159452.5A priority patent/CN102789992B/zh
Publication of JP2012243951A publication Critical patent/JP2012243951A/ja
Application granted granted Critical
Publication of JP5851719B2 publication Critical patent/JP5851719B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2011112586A 2011-05-19 2011-05-19 マスクを用いてワークに導電性ボールを搭載する方法 Expired - Fee Related JP5851719B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011112586A JP5851719B2 (ja) 2011-05-19 2011-05-19 マスクを用いてワークに導電性ボールを搭載する方法
CN201210159452.5A CN102789992B (zh) 2011-05-19 2012-05-21 使用掩模将导电性球搭载到工件上的方法及球搭载装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011112586A JP5851719B2 (ja) 2011-05-19 2011-05-19 マスクを用いてワークに導電性ボールを搭載する方法

Publications (2)

Publication Number Publication Date
JP2012243951A JP2012243951A (ja) 2012-12-10
JP5851719B2 true JP5851719B2 (ja) 2016-02-03

Family

ID=47155364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011112586A Expired - Fee Related JP5851719B2 (ja) 2011-05-19 2011-05-19 マスクを用いてワークに導電性ボールを搭載する方法

Country Status (2)

Country Link
JP (1) JP5851719B2 (zh)
CN (1) CN102789992B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109309011B (zh) * 2017-07-28 2022-04-08 爱立发株式会社 柱状构件搭载装置以及柱状构件搭载方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345816A (ja) * 1998-05-29 1999-12-14 Furukawa Electric Co Ltd:The はんだバンプ形成方法および装置
JP3573104B2 (ja) * 2001-05-25 2004-10-06 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
TWI273666B (en) * 2004-06-30 2007-02-11 Athlete Fa Corp Method and device for mounting conductive ball
TWI408756B (zh) * 2006-07-12 2013-09-11 Athlete Fa Corp Ball filling device and method
JP2010114124A (ja) * 2008-11-04 2010-05-20 Athlete Fa Kk ボール搭載装置

Also Published As

Publication number Publication date
CN102789992B (zh) 2016-09-28
CN102789992A (zh) 2012-11-21
JP2012243951A (ja) 2012-12-10

Similar Documents

Publication Publication Date Title
JP6518709B2 (ja) 実装装置
JP7108739B2 (ja) 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
JP6781677B2 (ja) 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
KR101217505B1 (ko) 다이 본딩 장비 및 이를 이용한 반도체 칩의 본딩 방법
TW201521142A (zh) 定位半導體晶片及接合頭之系統與方法、熱接合系統與方法
JP6717630B2 (ja) 電子部品の実装装置
JP6142276B2 (ja) 電子部品実装装置および電子部品の製造方法
JP5851719B2 (ja) マスクを用いてワークに導電性ボールを搭載する方法
US11515181B2 (en) Device for attaching conductive ball to substrate with plurality of separately controlled plates
JP6412376B2 (ja) チップと基板との接合方法、チップと基板との仮接合装置、チップ実装システム
JP4780858B2 (ja) 半導体装置の製造方法
JP7298887B2 (ja) ボール搭載装置及びボール搭載方法
JP7285162B2 (ja) ダイボンディング装置および半導体装置の製造方法
JP3645795B2 (ja) 半導体装置の製造方法および半導体製造装置
JP3573104B2 (ja) 導電性ボールの搭載装置および搭載方法
KR102284943B1 (ko) 본딩 장치 및 본딩 방법
JPH08139096A (ja) 電子部品及び電子部品の実装方法並びに電子部品の実装装置
JP6942829B2 (ja) 電子部品の実装装置
JP2010153849A (ja) ボールマウント方法及び同ボールマウント方法を利用したボールマウントシステム
JP2010212302A (ja) マスクを用いた処理装置および方法
TW202336873A (zh) 半導體製造裝置、塗佈裝置及半導體裝置之製造方法
JP2017183616A (ja) ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法
JP2000232113A (ja) ダイボンダ
JP4952683B2 (ja) 基板搬出装置
TW202203332A (zh) 物品的製造裝置,物品的製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140416

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141208

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150522

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151109

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151203

R150 Certificate of patent or registration of utility model

Ref document number: 5851719

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees