JP5846829B2 - 感光性導電ペースト - Google Patents

感光性導電ペースト Download PDF

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Publication number
JP5846829B2
JP5846829B2 JP2011216753A JP2011216753A JP5846829B2 JP 5846829 B2 JP5846829 B2 JP 5846829B2 JP 2011216753 A JP2011216753 A JP 2011216753A JP 2011216753 A JP2011216753 A JP 2011216753A JP 5846829 B2 JP5846829 B2 JP 5846829B2
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JP
Japan
Prior art keywords
group
conductive paste
acid
silver powder
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011216753A
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English (en)
Japanese (ja)
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JP2012094508A (ja
Inventor
伸行 柳田
伸行 柳田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
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Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to JP2011216753A priority Critical patent/JP5846829B2/ja
Publication of JP2012094508A publication Critical patent/JP2012094508A/ja
Application granted granted Critical
Publication of JP5846829B2 publication Critical patent/JP5846829B2/ja
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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Gas-Filled Discharge Tubes (AREA)
JP2011216753A 2010-09-30 2011-09-30 感光性導電ペースト Active JP5846829B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011216753A JP5846829B2 (ja) 2010-09-30 2011-09-30 感光性導電ペースト

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010221466 2010-09-30
JP2010221466 2010-09-30
JP2011216753A JP5846829B2 (ja) 2010-09-30 2011-09-30 感光性導電ペースト

Publications (2)

Publication Number Publication Date
JP2012094508A JP2012094508A (ja) 2012-05-17
JP5846829B2 true JP5846829B2 (ja) 2016-01-20

Family

ID=46008462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011216753A Active JP5846829B2 (ja) 2010-09-30 2011-09-30 感光性導電ペースト

Country Status (3)

Country Link
JP (1) JP5846829B2 (zh)
KR (1) KR101277020B1 (zh)
CN (1) CN102445846B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105103240A (zh) * 2013-03-29 2015-11-25 东丽株式会社 导电糊料和导电图案的制造方法
KR101511068B1 (ko) * 2013-09-23 2015-04-10 대덕지디에스 주식회사 도전성 페이스트를 이용한 방열기판 모듈
KR102208100B1 (ko) * 2014-05-13 2021-01-28 도레이 카부시키가이샤 도전 페이스트, 터치패널 및 도전 패턴의 제조방법
CN112812611B (zh) * 2020-12-30 2022-04-15 广东粤港澳大湾区黄埔材料研究院 一种导电涂层的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100228723B1 (ko) * 1995-11-29 1999-11-01 모리시타 요이찌 돌출부분을 형성하는 막 및 그것을 사용해서 플라즈마 디스플레이의 돌출 부분을 형성하는 방법, 및 그 방법에 의해 제조된 플라즈마 디스플레이
JP4530390B2 (ja) * 2001-03-08 2010-08-25 大日本印刷株式会社 光硬化型導体インキ及び電極パターンの形成方法
JP2002290052A (ja) * 2001-03-23 2002-10-04 Kyocera Corp 多層配線基板
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
JP2005258398A (ja) * 2004-02-12 2005-09-22 Jsr Corp プラズマディスプレイパネルの製造方法および転写フィルム
TW200720846A (en) 2005-07-13 2007-06-01 Taiyo Ink Mfg Co Ltd Silver paste composition, method for electrically conductive pattern formation using the same, and its electrically conductive pattern
JP4857670B2 (ja) * 2005-09-02 2012-01-18 パナソニック株式会社 無機粉末含有ペースト
US7608784B2 (en) * 2006-07-13 2009-10-27 E. I. Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
KR20080044184A (ko) * 2006-11-15 2008-05-20 다이요 잉키 세이조 가부시키가이샤 알칼리 현상형의 페이스트 조성물, 그것을 이용한 도전성패턴 및 블랙 매트릭스 패턴의 형성 방법, 및 그 도전성패턴 및 블랙 매트릭스 패턴

Also Published As

Publication number Publication date
CN102445846B (zh) 2014-03-26
CN102445846A (zh) 2012-05-09
KR20120034018A (ko) 2012-04-09
KR101277020B1 (ko) 2013-06-24
JP2012094508A (ja) 2012-05-17

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