JP5833662B2 - 線形プラズマ−光学システム - Google Patents
線形プラズマ−光学システム Download PDFInfo
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- JP5833662B2 JP5833662B2 JP2013537644A JP2013537644A JP5833662B2 JP 5833662 B2 JP5833662 B2 JP 5833662B2 JP 2013537644 A JP2013537644 A JP 2013537644A JP 2013537644 A JP2013537644 A JP 2013537644A JP 5833662 B2 JP5833662 B2 JP 5833662B2
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- Prior art keywords
- plasma
- anode
- cathode
- electromagnetic
- optical system
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- 239000011362 coarse particle Substances 0.000 claims description 33
- 238000010891 electric arc Methods 0.000 claims description 5
- 230000004044 response Effects 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims 2
- 241000252233 Cyprinus carpio Species 0.000 claims 1
- 238000000034 method Methods 0.000 description 17
- 150000002500 ions Chemical class 0.000 description 11
- 230000007423 decrease Effects 0.000 description 9
- 230000005684 electric field Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000010406 cathode material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/08—Ion sources; Ion guns using arc discharge
- H01J27/14—Other arc discharge ion sources using an applied magnetic field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
- H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Combustion & Propulsion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
Description
Claims (4)
- 粗大粒子フィルタ(3,6,7)を備え、電磁気的コイルによって生成される輸送磁界に応答して真空カソードアークプラズマを、電気的アークエバポレータからプラズマ源出口(5)まで輸送するためのプラズマガイドを備える線形プラズマ−光学システムであって、粗大粒子フィルタ(3,6,7)と、カソード(1)およびアノード(2)を取り囲む複数の電磁気的コイル(9,16)と、プラズマガイドと、前記アノード(2)に電気的に接続され、内部に同軸に配置された電磁気的偏向コイル(12)を備えると共に前記カソードに向かって閉じた端部を備え、かつ前記アノード(2)の内側に同軸に配置され、かつ、前記アノード(2)に電気的に接続され前記カソード(1)に向かって閉じた端部を備えると共に電磁気的偏向コイル(12)が内部に同軸に配置された導電性のチューブセグメント(11)とを備える線形プラズマ−光学システムであって、
(a)電気的アークエバポレータ電源(15)が、前記アノード(2)を取り囲む電磁気的コイル(16)の回巻きを通して前記アノード(2)に接続され、
(b)前記チューブセグメント(11)の内側の前記電磁気的偏向コイル(12)の最初の回巻きが前記チューブセグメント(11)に電気的に接続され、
(c)前記電磁気的偏向コイル(12)の最後の回巻きが電気的アークエバポレータ電源(15)の正端子に接続される、線形プラズマ−光学システム。 - 前記チューブセグメント(11)の内側の前記電磁気的偏向コイルは、水冷パイプであることを特徴とする、請求項1に記載の線形プラズマ−光学システム。
- 前記プラズマガイドは、一端が前記プラズマガイドに電気的に接続され、他端が前記電気的アークエバポレータ電源(15)と別体となった電源(17)の正端子に接続され、前記電気的アークエバポレータ電源(15)と別体となった電源(17)の負端子が前記アノード(2)に接続された追加の電磁気的コイルのうちの1つ(18)によって取り囲まれていることを特徴とする、請求項1または2に記載の線形プラズマ−光学システム。
- 前記プラズマガイドは複数であり、互いに電気的に絶縁されていると共に前記アノード(2)から絶縁されたインレット(4)およびアウトレット(5)から構成されており、前記プラズマガイドの前記インレット(4)は、追加の電磁気的コイル(18)によって取り囲まれており、前記追加の電磁気的コイル(18)の一端が前記プラズマガイドの前記アウトレット(5)に電気的に接続され、前記追加の電磁気的コイル(18)の他端が電気的アークエバポレータ電源(15)とは別体となった電源(17)の正端子に接続されており、前記電気的アークエバポレータ電源(15)とは別体になった電源(17)の負端子が、前記アノード(2)に接続されることを特徴とする、請求項1または2に記載の線形プラズマ−光学システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
UAA201013230 | 2010-11-08 | ||
UAA201013230A UA97584C2 (ru) | 2010-11-08 | 2010-11-08 | СПОСОБ ТРАНСПОРТИРОВКИ Вакуумно-дуговой Катодной ПЛАЗМЫ С фильтрованием От макрочастиц И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ |
PCT/UA2011/000105 WO2012064311A1 (ru) | 2010-11-08 | 2011-10-31 | Способ транспортировки вакуумно- дуговой плазмы и устройство для его осуществления |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015038333A Division JP6305950B2 (ja) | 2010-11-08 | 2015-02-27 | 真空アークプラズマを輸送するための方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014503935A JP2014503935A (ja) | 2014-02-13 |
JP5833662B2 true JP5833662B2 (ja) | 2015-12-16 |
Family
ID=46051213
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013537644A Expired - Fee Related JP5833662B2 (ja) | 2010-11-08 | 2011-10-31 | 線形プラズマ−光学システム |
JP2015038333A Expired - Fee Related JP6305950B2 (ja) | 2010-11-08 | 2015-02-27 | 真空アークプラズマを輸送するための方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015038333A Expired - Fee Related JP6305950B2 (ja) | 2010-11-08 | 2015-02-27 | 真空アークプラズマを輸送するための方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9035552B2 (ja) |
EP (1) | EP2639330B1 (ja) |
JP (2) | JP5833662B2 (ja) |
KR (1) | KR101575145B1 (ja) |
CN (1) | CN103298969B (ja) |
UA (1) | UA97584C2 (ja) |
WO (1) | WO2012064311A1 (ja) |
Families Citing this family (30)
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US9545360B2 (en) | 2009-05-13 | 2017-01-17 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
DK2251454T3 (da) | 2009-05-13 | 2014-10-13 | Sio2 Medical Products Inc | Coating og inspektion af beholder |
US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
CN103930595A (zh) | 2011-11-11 | 2014-07-16 | Sio2医药产品公司 | 用于药物包装的钝化、pH保护性或润滑性涂层、涂布方法以及设备 |
US9664626B2 (en) | 2012-11-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Coating inspection method |
EP2920567B1 (en) | 2012-11-16 | 2020-08-19 | SiO2 Medical Products, Inc. | Method and apparatus for detecting rapid barrier coating integrity characteristics |
US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
WO2014085348A2 (en) | 2012-11-30 | 2014-06-05 | Sio2 Medical Products, Inc. | Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like |
CN103227090B (zh) * | 2013-02-04 | 2016-04-06 | 深圳市劲拓自动化设备股份有限公司 | 一种线性等离子体源 |
US9662450B2 (en) | 2013-03-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus |
US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
KR102211788B1 (ko) | 2013-03-11 | 2021-02-04 | 에스아이오2 메디컬 프로덕츠, 인크. | 코팅된 패키징 |
US9863042B2 (en) | 2013-03-15 | 2018-01-09 | Sio2 Medical Products, Inc. | PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases |
EP3122917B1 (en) | 2014-03-28 | 2020-05-06 | SiO2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
CN104775096B (zh) * | 2015-04-16 | 2017-05-10 | 安徽纯源镀膜科技有限公司 | 纯离子真空镀膜设备中用于延长绝缘材料维护周期的装置 |
KR20180048694A (ko) | 2015-08-18 | 2018-05-10 | 에스아이오2 메디컬 프로덕츠, 인크. | 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기 |
CN106702328B (zh) * | 2017-02-17 | 2019-08-30 | 大连交通大学 | 磁偏转电子束蒸发源 |
CN109267018B (zh) * | 2017-07-18 | 2021-12-17 | 平高集团有限公司 | 一种快速等离子体镀膜方法及装置 |
US11926890B2 (en) * | 2019-03-15 | 2024-03-12 | Nanofilm Technologies International Limited | Cathode arc source |
US11672074B2 (en) * | 2019-07-11 | 2023-06-06 | Lockheed Martin Corporation | Shielding structures in plasma environment |
CN111074215B (zh) * | 2019-12-27 | 2021-07-02 | 季华实验室 | 一种新型阴极电弧的颗粒过滤器 |
EP3849282A1 (en) * | 2020-01-09 | 2021-07-14 | terraplasma emission control GmbH | Plasma discharge system and method of using the same |
CN111916326A (zh) * | 2020-06-09 | 2020-11-10 | 哈尔滨工业大学 | 一种具有防护功能的离子源的导磁套筒结构 |
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-
2010
- 2010-11-08 UA UAA201013230A patent/UA97584C2/ru unknown
-
2011
- 2011-10-31 WO PCT/UA2011/000105 patent/WO2012064311A1/ru active Application Filing
- 2011-10-31 JP JP2013537644A patent/JP5833662B2/ja not_active Expired - Fee Related
- 2011-10-31 US US13/877,708 patent/US9035552B2/en not_active Expired - Fee Related
- 2011-10-31 CN CN201180053875.2A patent/CN103298969B/zh active Active
- 2011-10-31 KR KR1020137014734A patent/KR101575145B1/ko not_active IP Right Cessation
- 2011-10-31 EP EP11839748.8A patent/EP2639330B1/en not_active Not-in-force
-
2015
- 2015-02-27 JP JP2015038333A patent/JP6305950B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2014503935A (ja) | 2014-02-13 |
US20130214684A1 (en) | 2013-08-22 |
KR101575145B1 (ko) | 2015-12-07 |
JP2015159113A (ja) | 2015-09-03 |
WO2012064311A1 (ru) | 2012-05-18 |
CN103298969B (zh) | 2015-09-16 |
UA97584C2 (ru) | 2012-02-27 |
EP2639330A4 (en) | 2015-07-08 |
US9035552B2 (en) | 2015-05-19 |
JP6305950B2 (ja) | 2018-04-04 |
EP2639330A1 (en) | 2013-09-18 |
KR20130132469A (ko) | 2013-12-04 |
EP2639330B1 (en) | 2017-09-20 |
CN103298969A (zh) | 2013-09-11 |
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