JP5808551B2 - セラミックス焼結成形用樹脂組成物 - Google Patents

セラミックス焼結成形用樹脂組成物 Download PDF

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Publication number
JP5808551B2
JP5808551B2 JP2011050540A JP2011050540A JP5808551B2 JP 5808551 B2 JP5808551 B2 JP 5808551B2 JP 2011050540 A JP2011050540 A JP 2011050540A JP 2011050540 A JP2011050540 A JP 2011050540A JP 5808551 B2 JP5808551 B2 JP 5808551B2
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poly
methacrylate
resin composition
molding
mass
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Japanese (ja)
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JP2012188297A (ja
JP2012188297A5 (https=
Inventor
信貴 藤本
信貴 藤本
知紀 川北
知紀 川北
亮 宮原
亮 宮原
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Sumitomo Seika Chemicals Co Ltd
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Sumitomo Seika Chemicals Co Ltd
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Publication of JP2012188297A5 publication Critical patent/JP2012188297A5/ja
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  • Compositions Of Oxide Ceramics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011050540A 2011-03-08 2011-03-08 セラミックス焼結成形用樹脂組成物 Expired - Fee Related JP5808551B2 (ja)

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JP2011050540A JP5808551B2 (ja) 2011-03-08 2011-03-08 セラミックス焼結成形用樹脂組成物

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JP2011050540A JP5808551B2 (ja) 2011-03-08 2011-03-08 セラミックス焼結成形用樹脂組成物

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JP2012188297A JP2012188297A (ja) 2012-10-04
JP2012188297A5 JP2012188297A5 (https=) 2014-03-20
JP5808551B2 true JP5808551B2 (ja) 2015-11-10

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111732824B (zh) * 2020-07-09 2022-07-08 重庆会通科技有限公司 一种超陶瓷质感pc材料及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221753A (ja) * 1985-07-17 1987-01-30 三井化学株式会社 成形体製造用組成物
JPH06334282A (ja) * 1993-05-24 1994-12-02 Matsushita Electric Ind Co Ltd セラミック多層基板用グリーンシート
JP2901940B2 (ja) * 1997-07-14 1999-06-07 三井化学株式会社 成形体製造用組成物
JP5095954B2 (ja) * 2006-05-09 2012-12-12 住友精化株式会社 有機亜鉛触媒およびそれを用いたポリアルキレンカーボネートの製造方法
JP2011020916A (ja) * 2009-06-18 2011-02-03 Toudai Tlo Ltd 焼結セラミックス成形用組成物、焼結セラミックスの製法、及びセラミックス

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