JP5806300B2 - 加熱環状チャック - Google Patents

加熱環状チャック Download PDF

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Publication number
JP5806300B2
JP5806300B2 JP2013514159A JP2013514159A JP5806300B2 JP 5806300 B2 JP5806300 B2 JP 5806300B2 JP 2013514159 A JP2013514159 A JP 2013514159A JP 2013514159 A JP2013514159 A JP 2013514159A JP 5806300 B2 JP5806300 B2 JP 5806300B2
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JP
Japan
Prior art keywords
workpiece
electrostatic
clamp
selectively
clamping device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013514159A
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English (en)
Japanese (ja)
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JP2013534049A (ja
Inventor
ジェイ．アイ． ジャステセン，ペリー
ジェイ．アイ． ジャステセン，ペリー
ディー． ウィード，アラン
ディー． ウィード，アラン
デイビス リー，ウイリアム
デイビス リー，ウイリアム
アシュウィン プロヒット
アシュウィン プロヒット
ラスメル，ロバート
エム． クック，ガリー
エム． クック，ガリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of JP2013534049A publication Critical patent/JP2013534049A/ja
Application granted granted Critical
Publication of JP5806300B2 publication Critical patent/JP5806300B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013514159A 2010-06-08 2011-06-08 加熱環状チャック Active JP5806300B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35266510P 2010-06-08 2010-06-08
US61/352,665 2010-06-08
PCT/US2011/001034 WO2011155987A1 (en) 2010-06-08 2011-06-08 Heated annulus chuck

Publications (2)

Publication Number Publication Date
JP2013534049A JP2013534049A (ja) 2013-08-29
JP5806300B2 true JP5806300B2 (ja) 2015-11-10

Family

ID=44546081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013514159A Active JP5806300B2 (ja) 2010-06-08 2011-06-08 加熱環状チャック

Country Status (4)

Country Link
JP (1) JP5806300B2 (ko)
KR (1) KR101849392B1 (ko)
CN (1) CN102934219B (ko)
WO (1) WO2011155987A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150066511A (ko) * 2012-06-12 2015-06-16 액셀리스 테크놀러지스, 인크. 피가공재 캐리어
KR102356531B1 (ko) 2016-06-02 2022-01-27 액셀리스 테크놀러지스, 인크. 웨이퍼를 가열 또는 냉각하기 위한 장치 및 방법
US9911636B1 (en) 2016-09-30 2018-03-06 Axcelis Technologies, Inc. Multiple diameter in-vacuum wafer handling
US10186446B2 (en) * 2016-09-30 2019-01-22 Axcelis Technology, Inc. Adjustable circumference electrostatic clamp
JP6238094B1 (ja) 2016-11-21 2017-11-29 日新イオン機器株式会社 半導体製造装置、基板支持装置の冷却方法
JP7306894B2 (ja) * 2019-06-27 2023-07-11 株式会社アルバック 真空装置、吸着装置、吸着方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297266A (ja) * 1994-04-28 1995-11-10 Fujitsu Ltd 静電チャックとウェハ吸着方法
JPH1022371A (ja) * 1996-07-03 1998-01-23 Nippon Telegr & Teleph Corp <Ntt> 試料固定装置
US6034863A (en) * 1997-11-12 2000-03-07 Applied Materials, Inc. Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system
JP2001077184A (ja) * 1999-08-31 2001-03-23 Ulvac Japan Ltd 静電吸着装置及びこれを備えた真空処理装置
US6741446B2 (en) * 2001-03-30 2004-05-25 Lam Research Corporation Vacuum plasma processor and method of operating same
JP3992018B2 (ja) 2003-07-23 2007-10-17 松下電器産業株式会社 プラズマ処理装置
CN100383951C (zh) * 2003-07-23 2008-04-23 松下电器产业株式会社 等离子加工设备
JP2005294654A (ja) * 2004-04-02 2005-10-20 Jeol Ltd 基板ホルダ
JP2008021686A (ja) 2006-07-10 2008-01-31 Shin Etsu Chem Co Ltd 基板保持トレー
JP2008047841A (ja) * 2006-08-21 2008-02-28 Advantest Corp 保持冶具
US8422193B2 (en) * 2006-12-19 2013-04-16 Axcelis Technologies, Inc. Annulus clamping and backside gas cooled electrostatic chuck
JP4990636B2 (ja) * 2007-01-11 2012-08-01 株式会社アルバック 搬送トレーを用いた真空処理装置
JP2008244408A (ja) * 2007-03-29 2008-10-09 Canon Anelva Corp 静電吸着ホルダー及び基板処理装置
US7972444B2 (en) * 2007-11-07 2011-07-05 Mattson Technology, Inc. Workpiece support with fluid zones for temperature control

Also Published As

Publication number Publication date
CN102934219A (zh) 2013-02-13
WO2011155987A1 (en) 2011-12-15
JP2013534049A (ja) 2013-08-29
KR101849392B1 (ko) 2018-04-16
CN102934219B (zh) 2015-09-09
KR20130112022A (ko) 2013-10-11

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