JP5805851B2 - リソグラフィシステムにおいて基板を処理する方法 - Google Patents

リソグラフィシステムにおいて基板を処理する方法 Download PDF

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Publication number
JP5805851B2
JP5805851B2 JP2014506911A JP2014506911A JP5805851B2 JP 5805851 B2 JP5805851 B2 JP 5805851B2 JP 2014506911 A JP2014506911 A JP 2014506911A JP 2014506911 A JP2014506911 A JP 2014506911A JP 5805851 B2 JP5805851 B2 JP 5805851B2
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Prior art keywords
substrate
unit
robot
load lock
clamped
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Expired - Fee Related
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JP2014506911A
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Japanese (ja)
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JP2014513429A (ja
JP2014513429A5 (enExample
Inventor
クイパー、ビンセント・シルベスター
スロット、アーウィン
ファン・ケルビンック、マルセル・ニコラース・ヤコブス
デ・ボア、ギード
デ・ヨン、ヘンドリク・ヤン
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マッパー・リソグラフィー・アイピー・ビー.ブイ.
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Publication of JP2014513429A5 publication Critical patent/JP2014513429A5/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075Handling workpieces outside exposure position, e.g. SMIF box
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2014506911A 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法 Expired - Fee Related JP5805851B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2012/057955 WO2012146788A1 (en) 2011-04-28 2012-05-01 Method of processing a substrate in a lithography system

Publications (3)

Publication Number Publication Date
JP2014513429A JP2014513429A (ja) 2014-05-29
JP2014513429A5 JP2014513429A5 (enExample) 2015-03-12
JP5805851B2 true JP5805851B2 (ja) 2015-11-10

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JP2014506911A Expired - Fee Related JP5805851B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法
JP2014506912A Active JP5787331B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置

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JP2014506912A Active JP5787331B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置

Country Status (7)

Country Link
US (4) US9176397B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5805851B2 (enExample)
KR (4) KR101607618B1 (enExample)
CN (3) CN106896650A (enExample)
TW (2) TWI514089B (enExample)
WO (2) WO2012146788A1 (enExample)

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Publication number Publication date
USRE48903E1 (en) 2022-01-25
KR20140025495A (ko) 2014-03-04
JP5787331B2 (ja) 2015-09-30
US8936994B2 (en) 2015-01-20
JP2014513429A (ja) 2014-05-29
WO2012146789A1 (en) 2012-11-01
CN106919006A (zh) 2017-07-04
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
CN103649837A (zh) 2014-03-19
TW201250402A (en) 2012-12-16
US20160004173A1 (en) 2016-01-07
KR101892460B1 (ko) 2018-08-28
US20130044305A1 (en) 2013-02-21
WO2012146788A1 (en) 2012-11-01
US9176397B2 (en) 2015-11-03
JP2014514769A (ja) 2014-06-19
CN106919006B (zh) 2020-03-13
KR20140041501A (ko) 2014-04-04
US20130034421A1 (en) 2013-02-07
KR20180031082A (ko) 2018-03-27
US9575418B2 (en) 2017-02-21
EP2702452B1 (en) 2016-08-03
TWI514089B (zh) 2015-12-21
CN106896650A (zh) 2017-06-27
CN103649837B (zh) 2017-04-12
TWI486723B (zh) 2015-06-01
EP2702452A1 (en) 2014-03-05
KR101614475B1 (ko) 2016-04-21
KR20160047590A (ko) 2016-05-02

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