JP5792786B2 - 基板印刷装置 - Google Patents
基板印刷装置 Download PDFInfo
- Publication number
- JP5792786B2 JP5792786B2 JP2013237850A JP2013237850A JP5792786B2 JP 5792786 B2 JP5792786 B2 JP 5792786B2 JP 2013237850 A JP2013237850 A JP 2013237850A JP 2013237850 A JP2013237850 A JP 2013237850A JP 5792786 B2 JP5792786 B2 JP 5792786B2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- substrate
- printing apparatus
- unit
- substrate printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 78
- 230000003028 elevating effect Effects 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 230000008602 contraction Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 238000007634 remodeling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Screen Printers (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
110 マスク支持部
120 マスク加圧部
121 昇降部
122 シリンダー
124 マスク加圧締結部
130 ステッピングモーター
140 マスク
145 マスク認識マーク
147 メッシュ
150 マスク固定部
160 基板
165 基板認識マーク
170 カメラ
180 テーブル
Claims (9)
- パターンホールが形成されたマスクと、
前記マスクの外郭を支持するマスク支持部と、
基板の面積の変化によって前記マスクの面積を変化させるように、前記マスクの外郭を垂直方向に加圧し、前記マスクに水平方向への引張力を与えるマスク加圧部と、
を含み、
前記マスク加圧部は、昇降部により上下移動が制御され、
前記昇降部は前記マスク加圧部の高さを個別に制御するシリンダーをさらに備える基板印刷装置。 - 前記マスク支持部は、2列に形成され、前記マスク加圧部は、前記2列のマスク支持部の間を加圧する請求項1に記載の基板印刷装置。
- 前記シリンダーは、対に構成され、昇降部の両端に設置される請求項1に記載の基板印刷装置。
- 前記基板印刷装置は、基板に形成された基板認識マークと前記マスクに形成されたマスク認識マークを認識するカメラをさらに含む請求項1に記載の基板印刷装置。
- 前記基板印刷装置は、基板に形成された基板認識マークと前記マスクに形成されたマスク認識マークの位置が一致するように前記マスク加圧部の動作を制御する制御部をさらに含む請求項1に記載の基板印刷装置。
- 前記マスク加圧部は、ステッピングモーターにより動作する請求項1に記載の基板印刷装置。
- 前記マスクは、外郭部がメッシュ(mesh)で形成される請求項1に記載の基板印刷装置。
- 前記メッシュは、ポリエステル材質である請求項7に記載の基板印刷装置。
- 前記マスクは、ニッケル(Ni)材質である請求項7に記載の基板印刷装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120150780A KR101514503B1 (ko) | 2012-12-21 | 2012-12-21 | 기판 인쇄 장치 |
KR10-2012-0150780 | 2012-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014121874A JP2014121874A (ja) | 2014-07-03 |
JP5792786B2 true JP5792786B2 (ja) | 2015-10-14 |
Family
ID=51402785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013237850A Expired - Fee Related JP5792786B2 (ja) | 2012-12-21 | 2013-11-18 | 基板印刷装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5792786B2 (ja) |
KR (1) | KR101514503B1 (ja) |
TW (1) | TWI510853B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018031193A1 (en) * | 2016-08-12 | 2018-02-15 | Applied Materials, Inc. | Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware components |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10785645B2 (en) * | 2015-02-23 | 2020-09-22 | Apple Inc. | Techniques for dynamically supporting different authentication algorithms |
CN110143044B (zh) * | 2019-05-28 | 2021-02-19 | 铜陵金基科技有限公司 | 一种用于丝印机的丝印辅助机构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01141027U (ja) * | 1988-03-22 | 1989-09-27 | ||
JPH01249346A (ja) * | 1988-03-30 | 1989-10-04 | Toshiba Corp | スクリーン印刷用マスクおよびスクリーン印刷装置 |
JPH05124176A (ja) * | 1991-10-31 | 1993-05-21 | Fujitsu Ltd | メタルマスク及びそれを用いたスクリーン印刷装置 |
JP3692678B2 (ja) * | 1997-01-27 | 2005-09-07 | 株式会社デンソー | スクリーン印刷方法 |
JP2000037847A (ja) * | 1998-07-21 | 2000-02-08 | Yamaha Motor Co Ltd | スクリーン印刷装置 |
JP2001253042A (ja) * | 2000-03-10 | 2001-09-18 | Fuji Photo Film Co Ltd | クリームはんだ印刷用マスク装置及びクリームはんだ印刷方法 |
JP2004148644A (ja) * | 2002-10-30 | 2004-05-27 | Shinko Electric Ind Co Ltd | 印刷装置及び印刷方法 |
JP4670005B2 (ja) * | 2004-11-26 | 2011-04-13 | 株式会社プロセス・ラボ・ミクロン | メタルマスク、スクリーン印刷版及びはんだバンプ形成方法 |
JP4591266B2 (ja) * | 2005-08-03 | 2010-12-01 | 株式会社日立プラントテクノロジー | スクリーン印刷装置 |
JP5514624B2 (ja) * | 2010-05-10 | 2014-06-04 | 株式会社日立ハイテクインスツルメンツ | スクリーン印刷方法及びその装置 |
-
2012
- 2012-12-21 KR KR1020120150780A patent/KR101514503B1/ko active IP Right Grant
-
2013
- 2013-10-24 TW TW102138385A patent/TWI510853B/zh not_active IP Right Cessation
- 2013-11-18 JP JP2013237850A patent/JP5792786B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018031193A1 (en) * | 2016-08-12 | 2018-02-15 | Applied Materials, Inc. | Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware components |
US10599043B2 (en) | 2016-08-12 | 2020-03-24 | Applied Materials, Inc. | Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware components |
Also Published As
Publication number | Publication date |
---|---|
TW201426165A (zh) | 2014-07-01 |
KR101514503B1 (ko) | 2015-04-22 |
JP2014121874A (ja) | 2014-07-03 |
KR20140081234A (ko) | 2014-07-01 |
TWI510853B (zh) | 2015-12-01 |
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