JP5781039B2 - 機能素子の製造方法および製造装置 - Google Patents
機能素子の製造方法および製造装置 Download PDFInfo
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- JP5781039B2 JP5781039B2 JP2012187623A JP2012187623A JP5781039B2 JP 5781039 B2 JP5781039 B2 JP 5781039B2 JP 2012187623 A JP2012187623 A JP 2012187623A JP 2012187623 A JP2012187623 A JP 2012187623A JP 5781039 B2 JP5781039 B2 JP 5781039B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 24
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 55
- 239000010410 layer Substances 0.000 claims description 38
- 239000012044 organic layer Substances 0.000 claims description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 229910044991 metal oxide Inorganic materials 0.000 claims description 19
- 150000004706 metal oxides Chemical group 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 14
- 239000012298 atmosphere Substances 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000002094 self assembled monolayer Substances 0.000 claims description 11
- 239000013545 self-assembled monolayer Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 230000006837 decompression Effects 0.000 claims 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 26
- 239000007788 liquid Substances 0.000 description 20
- 238000005530 etching Methods 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 13
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 11
- 150000002739 metals Chemical class 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 238000003917 TEM image Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/671—Organic radiation-sensitive molecular electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02115—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/50—Bistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
- G11C13/0016—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02301—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment in-situ cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Semiconductor Memories (AREA)
Description
図1は、第1実施形態に係る機能素子10を表す模式図である。機能素子10は、例えば、分子メモリセルであり、第1電極である下部電極3と、第2電極である上部電極5と、有機層13と、を備える。
図9(a)〜図9(c)は、第2実施形態に係る機能素子20の製造過程を表す模式図である。本実施形態では、図9(a)に示す下部電極83(第1電極)と、上部電極85(第2電極)と、の間のギャップ81の幅を、図2(b)に示す下部電極3と上部電極5との間のギャップ11の幅よりも広く形成する。
Claims (8)
- 第1電極と、前記第1電極に対向して形成された第2電極と、の間の10ナノメートル以下のギャップを、有機分子が分散され水素ガスが添加された溶剤により満たし、前記第1電極と前記第2電極との間に前記有機分子を含む有機層を形成する機能素子の製造方法。
- 第1電極と、前記第1電極に対向して形成された第2電極と、の間のギャップを、水素ガスを添加した水を用いて洗浄する工程と、
前記ギャップを、有機分子が分散され水素ガスが添加された溶剤により満たし、前記第1電極と前記第2電極との間に前記有機分子を含む有機層を形成する工程と、
を備えた機能素子の製造方法。 - 前記ギャップを洗浄する工程と、前記有機層を形成する工程と、を水素ガスを含む還元雰囲気下で連続して行う請求項2記載の機能素子の製造方法。
- 前記第1電極と前記第2電極との間に形成された犠牲層を、水素ガスを添加したエッチング液を用いて除去する工程をさらに備えた請求項1〜3のいずれか1つに記載の機能素子の製造方法。
- 前記有機層は、前記第1電極の表面に形成された自己組織化単分子層である請求項1〜4のいずれか1つに記載の機能素子の製造方法。
- 前記有機層と前記第2電極との間に導電層を形成する工程をさらに備えた請求項5記載の機能素子の製造方法。
- 前記導電層は、前記第2電極を酸化した金属酸化層である請求項6記載の機能素子の製造方法。
- 減圧可能な内室を有するプロセスチャンバーと、
前記内室に水素を含むガスを供給するポートと、
を備え、
前記内室を水素ガスを含む還元雰囲気に置換するステップと、
前記還元雰囲気の前記内室において、第1電極と、前記第1電極に対向する第2電極が設けられたウェーハを、水素ガスを添加した水を用いて洗浄するステップと、
前記還元雰囲気の前記内室において、前記第1電極と前記第2電極との間を、有機分子が分散され水素ガスが添加された溶剤により満たし、前記第1電極と前記第2電極との間に前記有機分子を含む有機層を形成するステップと、
を含むシーケンサまたはプログラムを有する機能素子の製造装置。
Priority Applications (2)
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JP2012187623A JP5781039B2 (ja) | 2012-08-28 | 2012-08-28 | 機能素子の製造方法および製造装置 |
US13/787,703 US9065064B2 (en) | 2012-08-28 | 2013-03-06 | Manufacturing method and manufacturing apparatus of functional element |
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JP2012187623A JP5781039B2 (ja) | 2012-08-28 | 2012-08-28 | 機能素子の製造方法および製造装置 |
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JP2014045126A JP2014045126A (ja) | 2014-03-13 |
JP5781039B2 true JP5781039B2 (ja) | 2015-09-16 |
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US (1) | US9065064B2 (ja) |
JP (1) | JP5781039B2 (ja) |
Families Citing this family (1)
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EP3310134B1 (en) * | 2015-06-15 | 2019-07-24 | Sumitomo Chemical Company Limited | Method of manufacturing organic el element |
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US6550988B2 (en) | 2000-10-30 | 2003-04-22 | Dainippon Screen Mfg., Co., Ltd. | Substrate processing apparatus |
JP4142664B2 (ja) * | 2001-03-12 | 2008-09-03 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
US6995312B2 (en) | 2001-03-29 | 2006-02-07 | Hewlett-Packard Development Company, L.P. | Bistable molecular switches and associated methods |
JP2002353379A (ja) | 2001-05-28 | 2002-12-06 | Matsushita Electric Works Ltd | 半導体装置およびその製造方法 |
EP1278234B1 (en) * | 2001-07-19 | 2012-01-11 | STMicroelectronics Srl | MOS transistor and method of manufacturing |
US7662009B2 (en) * | 2001-08-10 | 2010-02-16 | Panasonic Corporation | Organic electronic device, method of producing the same, and method of operating the same |
JP2003264326A (ja) * | 2002-03-08 | 2003-09-19 | Japan Science & Technology Corp | 分子集積回路素子及びその製造方法 |
US6852586B1 (en) | 2003-10-01 | 2005-02-08 | Advanced Micro Devices, Inc. | Self assembly of conducting polymer for formation of polymer memory cell |
JP2005191214A (ja) * | 2003-12-25 | 2005-07-14 | Fuji Xerox Co Ltd | 微細電子デバイスの製造方法 |
DE602005026797D1 (de) * | 2004-04-29 | 2011-04-21 | Zettacore Inc | Erfahren dafür |
KR101151159B1 (ko) * | 2006-09-19 | 2012-06-01 | 삼성전자주식회사 | 포스페이트계 자기조립단분자막을 포함하는 유기 박막트랜지스터 및 그 제조방법 |
JP2008124360A (ja) * | 2006-11-15 | 2008-05-29 | Sony Corp | 機能性分子素子及びその製造方法、並びに機能性分子装置 |
JP5141943B2 (ja) * | 2006-12-13 | 2013-02-13 | 独立行政法人科学技術振興機構 | 分子素子 |
JP2009259855A (ja) * | 2008-04-11 | 2009-11-05 | Sony Corp | 有機半導体素子及びその製造方法 |
JP2009260035A (ja) | 2008-04-16 | 2009-11-05 | Sokudo Co Ltd | 基板処理装置 |
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JP2011018542A (ja) | 2009-07-08 | 2011-01-27 | Sumitomo Metal Mining Co Ltd | 透明導電性基材及びその製造方法 |
JP2011065527A (ja) | 2009-09-18 | 2011-03-31 | Toyota Motor Corp | 運転評価システム、車載機及び情報処理センター |
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US9065064B2 (en) | 2015-06-23 |
JP2014045126A (ja) | 2014-03-13 |
US20140065765A1 (en) | 2014-03-06 |
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