JP5779406B2 - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JP5779406B2 JP5779406B2 JP2011117192A JP2011117192A JP5779406B2 JP 5779406 B2 JP5779406 B2 JP 5779406B2 JP 2011117192 A JP2011117192 A JP 2011117192A JP 2011117192 A JP2011117192 A JP 2011117192A JP 5779406 B2 JP5779406 B2 JP 5779406B2
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- lighting device
- light emitting
- organic light
- emitting diode
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000002184 metal Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000010410 layer Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011796 hollow space material Substances 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 9
- 239000000615 nonconductor Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000012744 reinforcing agent Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000002346 layers by function Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Description
Claims (14)
- 少なくとも1つの有機発光ダイオードが光学的透明基板において層構造として形成され、前記少なくとも1つの有機発光ダイオードおよび前記光学的透明基板が回路基板に接続され、前記有機発光ダイオードの電極の接続のための電気的なコンタクト部が前記回路基板の表面にある照明装置であって、
前記有機発光ダイオード(102)の方を向いている前記回路基板(101)の表面には、その全体の表面上に透過バリアとしての金属コーティング(104)が備えられ、前記金属コーティング(104)が、前記コンタクト部(207)の周囲に形成された電気絶縁体(205)によってだけ途切れており、
前記有機発光ダイオード(102)の方を向いている前記回路基板(101)の表面および前記金属コーティング(104)は、少なくとも前記コンタクト部(207)がソケット形状にデザインされ、かつ、前記照明装置の外側の辺縁領域(208)が隆起するように形成された立体表面を形成し、
少なくとも1つの中空空間(105)が前記立体表面で形成されている、
ことを特徴とする照明装置。 - 前記コンタクト部(207)が、前記回路基板(101)の後側に導かれたビア(209)に電気的かつ導電的に接続され、前記電気絶縁体(205)が、前記ビア(209)を囲むスリーブの形状にデザインされていることを特徴とする請求項1に記載の照明装置。
- 前記金属コーティング(104)が、Au、Ag、Cu、Al、Ni、Snまたはそれらの合金で形成され、5μm〜250μmの範囲の層厚を有していることを特徴とする請求項1または請求項2に記載の照明装置。
- 前記金属コーティング(104)が、積層形成された複数の層で形成され、特に、前記回路基板(101)の表面に形成された銅層と、その上に形成された少なくとも1つの保護層とから形成されていることを特徴とする請求項1から請求項3のいずれか1項に記載の照明装置。
- 前記回路基板(101)および前記光学的透明基板(301)が、放射状外側の辺縁領域(208)において、材料連続性を有して流体を通さないように、互いに接続されていることを特徴とする請求項1から請求項4のいずれか1項に記載の照明装置。
- 前記少なくとも1つの中空空間(105)が、前記金属コーティング(104)の表面と前記光学的透明基板(301)の間に形成され、その中に配置された誘電性物質および/または吸湿性物質(206)で部分的または全体的に充填されていることを特徴とする請求項1から請求項5のいずれか1項に記載の照明装置。
- 前記回路基板(101)が、繊維強化剤を備えたエポキシ樹脂と繊維強化剤を備えていないエポキシ樹脂とを含む材料で形成されていることを特徴とする請求項1から請求項6のいずれか1項に記載の照明装置。
- ビア(209)において、電気絶縁体(205)が、誘電性円筒を囲む誘電性の外側スリーブと、前記外側スリーブと前記誘電性円筒の間に配置された中空の円筒状部材またはフィラーとで形成され、前記中空の円筒状部材またはフィラーが前記ビア(209)の電気的導電性接続を形成していることを特徴とする請求項1から請求項7のいずれか1項に記載の照明装置。
- 有機発光ダイオード(102)の電極(302または304)とのコンタクティングのためのコンタクト表面(224)が、前記光学的透明基板(301)の方を向いているビア(209)の端面にあることを特徴とする請求項1から請求項8のいずれか1項に記載の照明装置。
- ビア(209)の端面が前記金属コーティング(104)によって直接カバーされ、前記ビア(209)が有機発光ダイオード(102)の上部電極(304)とコンタクトしていることを特徴とする請求項1から請求項9のいずれか1項に記載の照明装置。
- 電気的導電性物質が、ビア(209)および/またはコンタクト表面(224)に対してスポット形状に設けられていることを特徴とする請求項1から請求項10のいずれか1項に記載の照明装置。
- 5μm〜100μmの範囲の間隔を有するギャップが、前記有機発光ダイオード(102)、および/または、前記光学的透明基板(301)の方を向くコンタクト部(207)の表面、および/または、前記金属コーティング(104)の間にあり、当該ギャップが、隆起するように形成された辺縁領域(208)の大きさによって、および/または、材料連続性を有する接続のために前記辺縁領域(208)と前記光学的透明基板(301)の間に設けられる封入接着剤またははんだの厚みによって、決定されることを特徴とする請求項1から請求項11のいずれか1項に記載の照明装置。
- 前記有機発光ダイオード(102)が、前記照明装置の内部において少なくとも1つの薄膜封入層を備えていることを特徴とする請求項1から請求項12のいずれか1項に記載の照明装置。
- 有機発光ダイオード(102)の透明電極(302)および上部電極(304)のコンタクティングのためのコンタクト領域(305および/または306)が、前記それぞれの有機発光ダイオード(102)の活性表面領域内に配置されることを特徴とする請求項1から請求項13のいずれか1項に記載の照明装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010023550.4 | 2010-06-03 | ||
DE102010023550.4A DE102010023550B4 (de) | 2010-06-03 | 2010-06-03 | Beleuchtungselement |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011258551A JP2011258551A (ja) | 2011-12-22 |
JP2011258551A5 JP2011258551A5 (ja) | 2015-07-23 |
JP5779406B2 true JP5779406B2 (ja) | 2015-09-16 |
Family
ID=44973846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011117192A Expired - Fee Related JP5779406B2 (ja) | 2010-06-03 | 2011-05-25 | 照明装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9054333B2 (ja) |
JP (1) | JP5779406B2 (ja) |
DE (1) | DE102010023550B4 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011056570A1 (de) * | 2011-12-16 | 2013-06-20 | Osram Opto Semiconductors Gmbh | Lichtemittierende Bauelement-Anordnung |
EP2819485A4 (en) * | 2012-02-20 | 2016-01-06 | Kaneka Corp | ELECTROLUMINESCENT SYSTEM AND ORGANIC EL APPARATUS |
WO2021048240A1 (de) | 2019-09-10 | 2021-03-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Organisches leuchtdiodenmodul |
DE102019124349A1 (de) * | 2019-09-11 | 2021-03-11 | Rehau Ag + Co | Verfahren zur Herstellung eines elektrifizierten Kunststoffprofils sowie elektrifiziertes Kunststoffprofil |
Family Cites Families (19)
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JPS62299890A (ja) * | 1986-06-19 | 1987-12-26 | 沖電気工業株式会社 | Elデイスプレイ装置 |
JPH06325868A (ja) * | 1993-03-15 | 1994-11-25 | Fuji Electric Co Ltd | 薄膜エレクトロルミネセンスパネル |
US5703394A (en) * | 1996-06-10 | 1997-12-30 | Motorola | Integrated electro-optical package |
JP4345153B2 (ja) * | 1999-09-27 | 2009-10-14 | ソニー株式会社 | 映像表示装置の製造方法 |
KR100477101B1 (ko) | 2000-10-06 | 2005-03-17 | 삼성에스디아이 주식회사 | 유기 발광 소자 |
JP2002373779A (ja) * | 2001-06-13 | 2002-12-26 | Sony Corp | 電気的接続装置および電気的接続装置を有する電子機器 |
JP3849680B2 (ja) * | 2003-10-06 | 2006-11-22 | セイコーエプソン株式会社 | 基板接合体の製造方法、基板接合体、電気光学装置の製造方法、及び電気光学装置 |
JP2005338419A (ja) * | 2004-05-26 | 2005-12-08 | Matsushita Electric Works Ltd | 面発光装置用封止体及び面発光装置 |
CN100550467C (zh) * | 2005-02-16 | 2009-10-14 | 皇家飞利浦电子股份有限公司 | 有机电致发光二极管设备 |
KR100593937B1 (ko) * | 2005-03-30 | 2006-06-30 | 삼성전기주식회사 | Si기판을 이용한 LED 패키지 및 그 제조방법 |
CA2609531C (en) * | 2005-05-23 | 2014-09-02 | Color Kinetics Incorporated | Modular led lighting apparatus for socket engagement |
WO2007013001A2 (en) * | 2005-07-27 | 2007-02-01 | Philips Intellectual Property & Standards Gmbh | Light-emitting device with a sealing integrated driver circuit |
JP2008037848A (ja) * | 2006-08-10 | 2008-02-21 | Takasago Internatl Corp | 白金錯体及び発光素子 |
US7738257B2 (en) * | 2006-12-13 | 2010-06-15 | Intel Corporation | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
JP2009199777A (ja) * | 2008-02-19 | 2009-09-03 | Fujifilm Corp | 回路基板の製造方法及び回路基板並びに有機el発光装置 |
EP2144290A1 (en) | 2008-07-08 | 2010-01-13 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Electronic device and method of manufacturing the same |
US8102119B2 (en) * | 2008-12-17 | 2012-01-24 | General Electric Comapny | Encapsulated optoelectronic device and method for making the same |
US8350470B2 (en) * | 2008-12-17 | 2013-01-08 | General Electric Company | Encapsulation structures of organic electroluminescence devices |
ES2410805T3 (es) * | 2009-03-26 | 2013-07-03 | Nestec S.A. | Un conjunto calentador de accesorios y un método de aplicación de un accesorio |
-
2010
- 2010-06-03 DE DE102010023550.4A patent/DE102010023550B4/de active Active
-
2011
- 2011-05-25 JP JP2011117192A patent/JP5779406B2/ja not_active Expired - Fee Related
- 2011-05-25 US US13/067,343 patent/US9054333B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE102010023550A1 (de) | 2011-12-08 |
DE102010023550B4 (de) | 2015-02-26 |
US20110298359A1 (en) | 2011-12-08 |
US9054333B2 (en) | 2015-06-09 |
JP2011258551A (ja) | 2011-12-22 |
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