JP5779353B2 - 液体材料の塗布方法、塗布装置およびプログラム - Google Patents

液体材料の塗布方法、塗布装置およびプログラム Download PDF

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Publication number
JP5779353B2
JP5779353B2 JP2011008648A JP2011008648A JP5779353B2 JP 5779353 B2 JP5779353 B2 JP 5779353B2 JP 2011008648 A JP2011008648 A JP 2011008648A JP 2011008648 A JP2011008648 A JP 2011008648A JP 5779353 B2 JP5779353 B2 JP 5779353B2
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JP
Japan
Prior art keywords
discharge
liquid material
pulse
application
correction
Prior art date
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Active
Application number
JP2011008648A
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English (en)
Japanese (ja)
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JP2012148235A5 (Direct
JP2012148235A (ja
Inventor
生島　和正
和正 生島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2011008648A priority Critical patent/JP5779353B2/ja
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Priority to US13/978,801 priority patent/US10086573B2/en
Priority to CN201280005931.XA priority patent/CN103391820B/zh
Priority to EP12736584.9A priority patent/EP2666545B1/en
Priority to KR1020137021496A priority patent/KR101901217B1/ko
Priority to PCT/JP2012/050912 priority patent/WO2012099147A1/ja
Priority to HK14102263.0A priority patent/HK1189193B/xx
Priority to TW101102131A priority patent/TWI537061B/zh
Publication of JP2012148235A publication Critical patent/JP2012148235A/ja
Publication of JP2012148235A5 publication Critical patent/JP2012148235A5/ja
Application granted granted Critical
Publication of JP5779353B2 publication Critical patent/JP5779353B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H10P72/0448—
    • H10W74/012—
    • H10W74/15—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • H10W72/07168—
    • H10W72/07173—
    • H10W72/07183—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
JP2011008648A 2011-01-19 2011-01-19 液体材料の塗布方法、塗布装置およびプログラム Active JP5779353B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2011008648A JP5779353B2 (ja) 2011-01-19 2011-01-19 液体材料の塗布方法、塗布装置およびプログラム
CN201280005931.XA CN103391820B (zh) 2011-01-19 2012-01-18 液体材料的涂布方法及涂布装置
EP12736584.9A EP2666545B1 (en) 2011-01-19 2012-01-18 Method for applying liquid material and application device
KR1020137021496A KR101901217B1 (ko) 2011-01-19 2012-01-18 액체 재료의 도포 방법, 도포 장치 및 그 프로그램이 기억된 기억 매체
US13/978,801 US10086573B2 (en) 2011-01-19 2012-01-18 Application method of liquid material, application device and program
PCT/JP2012/050912 WO2012099147A1 (ja) 2011-01-19 2012-01-18 液体材料の塗布方法、塗布装置およびプログラム
HK14102263.0A HK1189193B (en) 2011-01-19 2012-01-18 Application method of liquid material and application device
TW101102131A TWI537061B (zh) 2011-01-19 2012-01-19 A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011008648A JP5779353B2 (ja) 2011-01-19 2011-01-19 液体材料の塗布方法、塗布装置およびプログラム

Publications (3)

Publication Number Publication Date
JP2012148235A JP2012148235A (ja) 2012-08-09
JP2012148235A5 JP2012148235A5 (Direct) 2014-03-20
JP5779353B2 true JP5779353B2 (ja) 2015-09-16

Family

ID=46515770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011008648A Active JP5779353B2 (ja) 2011-01-19 2011-01-19 液体材料の塗布方法、塗布装置およびプログラム

Country Status (7)

Country Link
US (1) US10086573B2 (Direct)
EP (1) EP2666545B1 (Direct)
JP (1) JP5779353B2 (Direct)
KR (1) KR101901217B1 (Direct)
CN (1) CN103391820B (Direct)
TW (1) TWI537061B (Direct)
WO (1) WO2012099147A1 (Direct)

Cited By (1)

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JP2016502672A (ja) * 2012-12-03 2016-01-28 イリノイ トゥール ワークス インコーポレイティド ディスペンサーを校正する方法及び装置

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JP6078298B2 (ja) * 2012-11-01 2017-02-08 武蔵エンジニアリング株式会社 位置補正機能を有する作業装置および作業方法
JP6183597B2 (ja) * 2013-08-05 2017-08-23 Tdk株式会社 液滴塗布装置
US10559864B2 (en) 2014-02-13 2020-02-11 Birmingham Technologies, Inc. Nanofluid contact potential difference battery
CN106102933B (zh) * 2014-03-10 2021-03-12 武藏工业株式会社 涂布装置及涂布方法
JP6538465B2 (ja) * 2015-07-24 2019-07-03 武蔵エンジニアリング株式会社 固体粒子を含有する液体材料の吐出装置および塗布装置並びに塗布方法
JP6541489B2 (ja) * 2015-07-24 2019-07-10 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo（重庆）智能科技有限公司 胶量控制方法及胶量控制装置
KR102798490B1 (ko) 2019-10-17 2025-04-22 주식회사 엘지에너지솔루션 활물질 이중층을 형성하는 전극 슬러리 코팅 장치 및 방법
US10950706B2 (en) 2019-02-25 2021-03-16 Birmingham Technologies, Inc. Nano-scale energy conversion device
US11101421B2 (en) 2019-02-25 2021-08-24 Birmingham Technologies, Inc. Nano-scale energy conversion device
US11244816B2 (en) 2019-02-25 2022-02-08 Birmingham Technologies, Inc. Method of manufacturing and operating nano-scale energy conversion device
CN109847971A (zh) * 2019-03-02 2019-06-07 西华大学 一种具有低流速和高精度的自动化涂料装置及方法
US11124864B2 (en) 2019-05-20 2021-09-21 Birmingham Technologies, Inc. Method of fabricating nano-structures with engineered nano-scale electrospray depositions
US11046578B2 (en) * 2019-05-20 2021-06-29 Birmingham Technologies, Inc. Single-nozzle apparatus for engineered nano-scale electrospray depositions
JP7467176B2 (ja) 2020-03-16 2024-04-15 日本発條株式会社 接着剤の塗布方法および塗布装置
WO2021199229A1 (ja) * 2020-03-31 2021-10-07 株式会社Ｆｕｊｉ 印刷制御装置および印刷制御方法
US11649525B2 (en) 2020-05-01 2023-05-16 Birmingham Technologies, Inc. Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method
US11417506B1 (en) 2020-10-15 2022-08-16 Birmingham Technologies, Inc. Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods
US11616186B1 (en) 2021-06-28 2023-03-28 Birmingham Technologies, Inc. Thermal-transfer apparatus including thermionic devices, and related methods
TW202430278A (zh) * 2023-01-18 2024-08-01 萬潤科技股份有限公司 液材施作方法及液材施作設備

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JP3877038B2 (ja) 1999-11-10 2007-02-07 武蔵エンジニアリング株式会社 液体の塗布方法および装置
JP2002303275A (ja) * 2001-04-09 2002-10-18 Iwashita Engineering Inc 定量吐出器の吐出量補正方法
JP4032729B2 (ja) 2001-12-19 2008-01-16 松下電器産業株式会社 流体塗布方法
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
JP4382595B2 (ja) * 2004-07-09 2009-12-16 パナソニック株式会社 粘性流体供給装置及びその固化防止方法
EP1733803A4 (en) 2004-04-09 2008-12-10 Panasonic Corp APPARATUS FOR APPLYING VISCOS FLUIDS
JP4889967B2 (ja) * 2005-07-01 2012-03-07 芝浦メカトロニクス株式会社 液状物質滴下装置及び液状物質滴下方法
JP4995488B2 (ja) * 2006-05-26 2012-08-08 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4871093B2 (ja) 2006-11-01 2012-02-08 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP5280702B2 (ja) 2008-02-18 2013-09-04 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
US8809075B2 (en) * 2009-06-15 2014-08-19 Musashi Engineering, Inc. Method for applying liquid material utilizing capillary phenomenon

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016502672A (ja) * 2012-12-03 2016-01-28 イリノイ トゥール ワークス インコーポレイティド ディスペンサーを校正する方法及び装置

Also Published As

Publication number Publication date
US20130313745A1 (en) 2013-11-28
TWI537061B (zh) 2016-06-11
HK1189193A1 (zh) 2014-05-30
KR101901217B1 (ko) 2018-09-21
EP2666545B1 (en) 2019-05-15
KR20140003542A (ko) 2014-01-09
WO2012099147A1 (ja) 2012-07-26
EP2666545A4 (en) 2016-03-02
TW201240739A (en) 2012-10-16
EP2666545A1 (en) 2013-11-27
JP2012148235A (ja) 2012-08-09
CN103391820B (zh) 2016-04-13
US10086573B2 (en) 2018-10-02
CN103391820A (zh) 2013-11-13

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