TWI537061B - A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program - Google Patents
A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program Download PDFInfo
- Publication number
- TWI537061B TWI537061B TW101102131A TW101102131A TWI537061B TW I537061 B TWI537061 B TW I537061B TW 101102131 A TW101102131 A TW 101102131A TW 101102131 A TW101102131 A TW 101102131A TW I537061 B TWI537061 B TW I537061B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- discharge
- liquid material
- pulse
- correction
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- H10P72/0448—
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- H10W74/012—
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- H10W74/15—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- H10W72/07168—
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- H10W72/07173—
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- H10W72/07183—
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- H10W72/072—
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- H10W72/073—
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- H10W72/07337—
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- H10W72/354—
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- H10W90/724—
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- H10W90/734—
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011008648A JP5779353B2 (ja) | 2011-01-19 | 2011-01-19 | 液体材料の塗布方法、塗布装置およびプログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201240739A TW201240739A (en) | 2012-10-16 |
| TWI537061B true TWI537061B (zh) | 2016-06-11 |
Family
ID=46515770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101102131A TWI537061B (zh) | 2011-01-19 | 2012-01-19 | A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10086573B2 (Direct) |
| EP (1) | EP2666545B1 (Direct) |
| JP (1) | JP5779353B2 (Direct) |
| KR (1) | KR101901217B1 (Direct) |
| CN (1) | CN103391820B (Direct) |
| TW (1) | TWI537061B (Direct) |
| WO (1) | WO2012099147A1 (Direct) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6078298B2 (ja) * | 2012-11-01 | 2017-02-08 | 武蔵エンジニアリング株式会社 | 位置補正機能を有する作業装置および作業方法 |
| US9057642B2 (en) * | 2012-12-03 | 2015-06-16 | Illinois Tool Works Inc. | Method and apparatus for calibrating a dispenser |
| JP6183597B2 (ja) * | 2013-08-05 | 2017-08-23 | Tdk株式会社 | 液滴塗布装置 |
| US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
| CN106102933B (zh) * | 2014-03-10 | 2021-03-12 | 武藏工业株式会社 | 涂布装置及涂布方法 |
| JP6538465B2 (ja) * | 2015-07-24 | 2019-07-03 | 武蔵エンジニアリング株式会社 | 固体粒子を含有する液体材料の吐出装置および塗布装置並びに塗布方法 |
| JP6541489B2 (ja) * | 2015-07-24 | 2019-07-10 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
| JP6778426B2 (ja) * | 2016-09-20 | 2020-11-04 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
| CN108906508B (zh) * | 2018-08-06 | 2020-11-27 | Oppo(重庆)智能科技有限公司 | 胶量控制方法及胶量控制装置 |
| KR102798490B1 (ko) | 2019-10-17 | 2025-04-22 | 주식회사 엘지에너지솔루션 | 활물질 이중층을 형성하는 전극 슬러리 코팅 장치 및 방법 |
| US10950706B2 (en) | 2019-02-25 | 2021-03-16 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
| US11101421B2 (en) | 2019-02-25 | 2021-08-24 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
| US11244816B2 (en) | 2019-02-25 | 2022-02-08 | Birmingham Technologies, Inc. | Method of manufacturing and operating nano-scale energy conversion device |
| CN109847971A (zh) * | 2019-03-02 | 2019-06-07 | 西华大学 | 一种具有低流速和高精度的自动化涂料装置及方法 |
| US11124864B2 (en) | 2019-05-20 | 2021-09-21 | Birmingham Technologies, Inc. | Method of fabricating nano-structures with engineered nano-scale electrospray depositions |
| US11046578B2 (en) * | 2019-05-20 | 2021-06-29 | Birmingham Technologies, Inc. | Single-nozzle apparatus for engineered nano-scale electrospray depositions |
| JP7467176B2 (ja) | 2020-03-16 | 2024-04-15 | 日本発條株式会社 | 接着剤の塗布方法および塗布装置 |
| WO2021199229A1 (ja) * | 2020-03-31 | 2021-10-07 | 株式会社Fuji | 印刷制御装置および印刷制御方法 |
| US11649525B2 (en) | 2020-05-01 | 2023-05-16 | Birmingham Technologies, Inc. | Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method |
| US11417506B1 (en) | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
| US11616186B1 (en) | 2021-06-28 | 2023-03-28 | Birmingham Technologies, Inc. | Thermal-transfer apparatus including thermionic devices, and related methods |
| TW202430278A (zh) * | 2023-01-18 | 2024-08-01 | 萬潤科技股份有限公司 | 液材施作方法及液材施作設備 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3877038B2 (ja) | 1999-11-10 | 2007-02-07 | 武蔵エンジニアリング株式会社 | 液体の塗布方法および装置 |
| JP2002303275A (ja) * | 2001-04-09 | 2002-10-18 | Iwashita Engineering Inc | 定量吐出器の吐出量補正方法 |
| JP4032729B2 (ja) | 2001-12-19 | 2008-01-16 | 松下電器産業株式会社 | 流体塗布方法 |
| SE0202247D0 (sv) * | 2002-07-18 | 2002-07-18 | Mydata Automation Ab | Jetting device and method at a jetting device |
| US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
| JP4382595B2 (ja) * | 2004-07-09 | 2009-12-16 | パナソニック株式会社 | 粘性流体供給装置及びその固化防止方法 |
| EP1733803A4 (en) | 2004-04-09 | 2008-12-10 | Panasonic Corp | APPARATUS FOR APPLYING VISCOS FLUIDS |
| JP4889967B2 (ja) * | 2005-07-01 | 2012-03-07 | 芝浦メカトロニクス株式会社 | 液状物質滴下装置及び液状物質滴下方法 |
| JP4995488B2 (ja) * | 2006-05-26 | 2012-08-08 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
| JP4871093B2 (ja) | 2006-11-01 | 2012-02-08 | 武蔵エンジニアリング株式会社 | 液体材料の充填方法、装置およびプログラム |
| JP5280702B2 (ja) | 2008-02-18 | 2013-09-04 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、その装置およびそのプログラム |
| US8809075B2 (en) * | 2009-06-15 | 2014-08-19 | Musashi Engineering, Inc. | Method for applying liquid material utilizing capillary phenomenon |
-
2011
- 2011-01-19 JP JP2011008648A patent/JP5779353B2/ja active Active
-
2012
- 2012-01-18 CN CN201280005931.XA patent/CN103391820B/zh active Active
- 2012-01-18 EP EP12736584.9A patent/EP2666545B1/en active Active
- 2012-01-18 US US13/978,801 patent/US10086573B2/en active Active
- 2012-01-18 WO PCT/JP2012/050912 patent/WO2012099147A1/ja not_active Ceased
- 2012-01-18 KR KR1020137021496A patent/KR101901217B1/ko active Active
- 2012-01-19 TW TW101102131A patent/TWI537061B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20130313745A1 (en) | 2013-11-28 |
| JP5779353B2 (ja) | 2015-09-16 |
| HK1189193A1 (zh) | 2014-05-30 |
| KR101901217B1 (ko) | 2018-09-21 |
| EP2666545B1 (en) | 2019-05-15 |
| KR20140003542A (ko) | 2014-01-09 |
| WO2012099147A1 (ja) | 2012-07-26 |
| EP2666545A4 (en) | 2016-03-02 |
| TW201240739A (en) | 2012-10-16 |
| EP2666545A1 (en) | 2013-11-27 |
| JP2012148235A (ja) | 2012-08-09 |
| CN103391820B (zh) | 2016-04-13 |
| US10086573B2 (en) | 2018-10-02 |
| CN103391820A (zh) | 2013-11-13 |
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