JP5778110B2 - 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 - Google Patents
化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 Download PDFInfo
- Publication number
- JP5778110B2 JP5778110B2 JP2012221417A JP2012221417A JP5778110B2 JP 5778110 B2 JP5778110 B2 JP 5778110B2 JP 2012221417 A JP2012221417 A JP 2012221417A JP 2012221417 A JP2012221417 A JP 2012221417A JP 5778110 B2 JP5778110 B2 JP 5778110B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- coil
- monitoring system
- magnetic core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Description
本発明のその他の特徴及び利点は、特許請求の範囲及び図面を含め、以下の記載から明らかとなろう。
Claims (6)
- 化学機械研磨装置であって、
研磨パッドの研磨面に当接して基板を保持するためのキャリアと、
基板における導体膜を監視するためのセンサと、
を備え、前記センサが、
前記基板に近接して位置決め可能の磁心と、
前記磁心の第1部分に巻回された第1コイルと、
前記第1コイルに電気的に結合されて前記第1コイルに交流を誘導すると共に前記基板に近接して交番磁界を発生させる発振器であって、前記基板が前記磁心に近接していないときに共振周波数をもたらすように選択されたほぼ一定の周波数をもつ交流を誘導し、金属層を有する前記基板が前記磁心に近接しているときにインピーダンスが上昇する、前記発振器と、
前記磁心の第2部分に巻回された第2コイルと、
前記第2コイルに電気的に結合されたキャパシタと、
前記第2コイル及び前記キャパシタに電気的に結合されて出力信号を発生する増幅器と、
を備える、化学機械研磨装置。 - 前記磁心は、2つのアーム部と、該2つのアーム部間にある接続部とを含む、請求項1の装置。
- 前記第1コイルは、前記接続部に巻回され、前記第2コイルは、前記2つのアーム部のうち少なくとも1つに巻回されている、請求項2の装置。
- 化学機械研磨方法であって、
研磨パッドの研磨面に当接してキャリアにおいて基板を保持し、
研磨面と基板との間の相対運動を発生させて基板を研磨し、
コイルと磁心が基板から離れた研磨面側に配置され、磁心の一部に巻回したコイルに交流電流を流すことにより、基板内の導電層に渦電流を誘導するために研磨面を通って延びる交流磁界を発生させ、
研磨中に、前記基板が前記磁心に近接していないときに共振周波数をもたらすように選択されたほぼ一定の周波数で交流電流を持続し、金属層を有する前記基板が前記磁心に近接しているときにインピーダンスが上昇し、
導電層の厚みの変化によって引き起こされる交流電界の変化を検出することを含む、化学機械研磨方法。 - 磁心は2つのアーム部と2つのアーム部間にある接続部とを有する、請求項4に記載の方法。
- 第1コイルが接続部に巻回され、第2コイルが2つのアーム部のうち少なくとも1つに巻回される、請求項5に記載の方法。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/574,008 US6924641B1 (en) | 2000-05-19 | 2000-05-19 | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
US09/574,008 | 2000-05-19 | ||
US21722800P | 2000-07-10 | 2000-07-10 | |
US60/217,228 | 2000-07-10 | ||
US22166800P | 2000-07-27 | 2000-07-27 | |
US60/221,668 | 2000-07-27 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001585991A Division JP5542293B2 (ja) | 2000-05-19 | 2001-05-18 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014121991A Division JP6041833B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視用研磨パッド |
JP2014121990A Division JP5980843B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視システムと光学監視システムとを有する研磨制御方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013058762A JP2013058762A (ja) | 2013-03-28 |
JP5778110B2 true JP5778110B2 (ja) | 2015-09-16 |
Family
ID=27396396
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001585991A Expired - Fee Related JP5542293B2 (ja) | 2000-05-19 | 2001-05-18 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
JP2012221417A Expired - Lifetime JP5778110B2 (ja) | 2000-05-19 | 2012-10-03 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
JP2014121991A Expired - Lifetime JP6041833B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視用研磨パッド |
JP2014121990A Expired - Lifetime JP5980843B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視システムと光学監視システムとを有する研磨制御方法及び装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001585991A Expired - Fee Related JP5542293B2 (ja) | 2000-05-19 | 2001-05-18 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014121991A Expired - Lifetime JP6041833B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視用研磨パッド |
JP2014121990A Expired - Lifetime JP5980843B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視システムと光学監視システムとを有する研磨制御方法及び装置 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1294534B2 (ja) |
JP (4) | JP5542293B2 (ja) |
KR (1) | KR100827871B1 (ja) |
AT (1) | ATE315980T1 (ja) |
DE (3) | DE60116757T4 (ja) |
TW (1) | TW496812B (ja) |
WO (1) | WO2001089765A1 (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6608495B2 (en) | 2001-03-19 | 2003-08-19 | Applied Materials, Inc. | Eddy-optic sensor for object inspection |
US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
US6811466B1 (en) | 2001-12-28 | 2004-11-02 | Applied Materials, Inc. | System and method for in-line metal profile measurement |
WO2003066284A1 (en) * | 2002-02-06 | 2003-08-14 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing with an eddy current monitoring system |
US7001242B2 (en) * | 2002-02-06 | 2006-02-21 | Applied Materials, Inc. | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
DE10310262A1 (de) | 2002-03-28 | 2003-10-23 | Esec Trading Sa | Einrichtung für die Montage von Halbleiterchips |
EP1349199A1 (de) * | 2002-03-28 | 2003-10-01 | Esec Trading S.A. | Einrichtung für die Montage von Halbleiterchips |
US7205166B2 (en) * | 2002-06-28 | 2007-04-17 | Lam Research Corporation | Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties |
US7112961B2 (en) * | 2002-12-13 | 2006-09-26 | Applied Materials, Inc. | Method and apparatus for dynamically measuring the thickness of an object |
US6788050B2 (en) * | 2002-12-23 | 2004-09-07 | Lam Research Corp. | System, method and apparatus for thin-film substrate signal separation using eddy current |
KR100902893B1 (ko) * | 2003-01-13 | 2009-06-16 | 엘지전자 주식회사 | 광디스크 표면의 기계적 내구성 검사 장치 및 방법 |
US7008296B2 (en) * | 2003-06-18 | 2006-03-07 | Applied Materials, Inc. | Data processing for monitoring chemical mechanical polishing |
JP2005051076A (ja) * | 2003-07-29 | 2005-02-24 | Trecenti Technologies Inc | 半導体装置の製造方法 |
US7112960B2 (en) * | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
KR100947230B1 (ko) | 2003-09-16 | 2010-03-11 | 엘지전자 주식회사 | 광디스크 표면의 기계적 내구성 검사 장치 및 방법 |
EP1758711B1 (en) * | 2004-06-21 | 2013-08-07 | Ebara Corporation | Polishing apparatus and polishing method |
JP2006128563A (ja) * | 2004-11-01 | 2006-05-18 | Toyo Tire & Rubber Co Ltd | 半導体ウエハ研磨用研磨パッドおよび半導体デバイスの製造方法 |
JP2009026850A (ja) * | 2007-07-18 | 2009-02-05 | Elpida Memory Inc | Cmp装置及びcmpによるウェハー研磨方法 |
JP2009033038A (ja) * | 2007-07-30 | 2009-02-12 | Elpida Memory Inc | Cmp装置及びcmpによるウェハー研磨方法 |
JP4319692B2 (ja) | 2007-09-03 | 2009-08-26 | 株式会社東京精密 | 研磨終了時点の予測・検出方法とその装置並びにリアルタイム膜厚モニタ方法とその装置 |
JP5495493B2 (ja) * | 2008-02-07 | 2014-05-21 | 株式会社東京精密 | 膜厚測定装置、及び膜厚測定方法 |
DE102008021569A1 (de) * | 2008-04-30 | 2009-11-05 | Advanced Micro Devices, Inc., Sunnyvale | System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals |
JP5513795B2 (ja) * | 2009-07-16 | 2014-06-04 | 株式会社荏原製作所 | 研磨方法および装置 |
JP5513821B2 (ja) * | 2009-09-17 | 2014-06-04 | 株式会社荏原製作所 | 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法 |
US9023667B2 (en) * | 2011-04-27 | 2015-05-05 | Applied Materials, Inc. | High sensitivity eddy current monitoring system |
US9308618B2 (en) | 2012-04-26 | 2016-04-12 | Applied Materials, Inc. | Linear prediction for filtering of data during in-situ monitoring of polishing |
US9067295B2 (en) * | 2012-07-25 | 2015-06-30 | Applied Materials, Inc. | Monitoring retaining ring thickness and pressure control |
US9205527B2 (en) * | 2012-11-08 | 2015-12-08 | Applied Materials, Inc. | In-situ monitoring system with monitoring of elongated region |
US9636797B2 (en) * | 2014-02-12 | 2017-05-02 | Applied Materials, Inc. | Adjusting eddy current measurements |
JP6423600B2 (ja) | 2014-03-12 | 2018-11-14 | 株式会社荏原製作所 | 膜厚測定装置、及び、研磨装置 |
TW201710029A (zh) | 2015-09-01 | 2017-03-16 | Ebara Corp | 渦電流檢測器 |
JP6779633B2 (ja) | 2016-02-23 | 2020-11-04 | 株式会社荏原製作所 | 研磨装置 |
CN106985059B (zh) * | 2017-04-27 | 2018-12-28 | 厦门大学 | 一种空心球体内外球面研抛方法及装置 |
CN107520740A (zh) * | 2017-09-18 | 2017-12-29 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种化学机械抛光中光谱终点的检测方法、装置及系统 |
TWI689081B (zh) | 2018-10-02 | 2020-03-21 | 華邦電子股份有限公司 | 非揮發性記憶體裝置的製造方法 |
JP7541988B2 (ja) * | 2019-02-28 | 2024-08-29 | アプライド マテリアルズ インコーポレイテッド | バッキング層の濡れを調整することによる化学機械研磨パッド剛性の制御 |
WO2024091314A1 (en) * | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Carrier head acoustic monitoring with sensor in platen |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4005359A (en) * | 1975-11-07 | 1977-01-25 | Smoot William N | Resonant frequency measuring device for gauging coating thickness |
JPS5842902A (ja) * | 1981-09-08 | 1983-03-12 | Toyo Seikan Kaisha Ltd | プレスの打抜き不良検出装置 |
US4829251A (en) * | 1983-08-31 | 1989-05-09 | Helmut Fischer | Electromagnetic probe for measuring the thickness of thin coatings on magnetic substrates |
JPS63212804A (ja) * | 1987-02-28 | 1988-09-05 | Sumitomo Metal Ind Ltd | 膜厚測定方法 |
US5355083A (en) * | 1988-11-16 | 1994-10-11 | Measurex Corporation | Non-contact sensor and method using inductance and laser distance measurements for measuring the thickness of a layer of material overlaying a substrate |
DE4002083A1 (de) * | 1990-01-25 | 1991-08-01 | Hoechst Ag | Flaechen- oder schlauchfoermige folie auf basis von cellulosehydrat |
EP0738561B1 (en) * | 1995-03-28 | 2002-01-23 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5559428A (en) * | 1995-04-10 | 1996-09-24 | International Business Machines Corporation | In-situ monitoring of the change in thickness of films |
US5660672A (en) * | 1995-04-10 | 1997-08-26 | International Business Machines Corporation | In-situ monitoring of conductive films on semiconductor wafers |
US5644221A (en) * | 1996-03-19 | 1997-07-01 | International Business Machines Corporation | Endpoint detection for chemical mechanical polishing using frequency or amplitude mode |
JP3303963B2 (ja) * | 1997-01-20 | 2002-07-22 | 株式会社東京精密 | ウェーハの厚み加工量測定装置 |
JP2973404B2 (ja) * | 1997-07-11 | 1999-11-08 | 株式会社東京精密 | ウェーハ研磨装置 |
JP3001051B2 (ja) * | 1997-08-22 | 2000-01-17 | 日本電気株式会社 | 半導体ウェハ研磨終点検出装置 |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6162368A (en) * | 1998-06-13 | 2000-12-19 | Applied Materials, Inc. | Technique for chemical mechanical polishing silicon |
JP3907414B2 (ja) * | 2000-01-17 | 2007-04-18 | 株式会社荏原製作所 | ポリッシング装置 |
JP3916375B2 (ja) * | 2000-06-02 | 2007-05-16 | 株式会社荏原製作所 | ポリッシング方法および装置 |
-
2001
- 2001-05-18 EP EP01937595A patent/EP1294534B2/en not_active Expired - Lifetime
- 2001-05-18 DE DE60116757T patent/DE60116757T4/de not_active Expired - Lifetime
- 2001-05-18 KR KR1020027015632A patent/KR100827871B1/ko active IP Right Grant
- 2001-05-18 DE DE60132385T patent/DE60132385T2/de not_active Expired - Lifetime
- 2001-05-18 JP JP2001585991A patent/JP5542293B2/ja not_active Expired - Fee Related
- 2001-05-18 DE DE60116757A patent/DE60116757D1/de not_active Expired - Lifetime
- 2001-05-18 AT AT01937595T patent/ATE315980T1/de not_active IP Right Cessation
- 2001-05-18 WO PCT/US2001/016290 patent/WO2001089765A1/en active IP Right Grant
- 2001-08-06 TW TW090112035A patent/TW496812B/zh not_active IP Right Cessation
-
2012
- 2012-10-03 JP JP2012221417A patent/JP5778110B2/ja not_active Expired - Lifetime
-
2014
- 2014-06-13 JP JP2014121991A patent/JP6041833B2/ja not_active Expired - Lifetime
- 2014-06-13 JP JP2014121990A patent/JP5980843B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2001089765A1 (en) | 2001-11-29 |
JP5542293B2 (ja) | 2014-07-09 |
DE60132385T2 (de) | 2008-05-15 |
JP2003534649A (ja) | 2003-11-18 |
EP1294534B2 (en) | 2006-01-25 |
EP1294534B1 (en) | 2006-01-18 |
EP1294534A1 (en) | 2003-03-26 |
DE60132385D1 (de) | 2008-02-21 |
JP2014209643A (ja) | 2014-11-06 |
JP2013058762A (ja) | 2013-03-28 |
ATE315980T1 (de) | 2006-02-15 |
DE60116757T2 (de) | 2006-07-27 |
DE60116757T4 (de) | 2007-01-18 |
TW496812B (en) | 2002-08-01 |
KR100827871B1 (ko) | 2008-05-07 |
JP6041833B2 (ja) | 2016-12-14 |
JP5980843B2 (ja) | 2016-08-31 |
JP2014208401A (ja) | 2014-11-06 |
KR20030001529A (ko) | 2003-01-06 |
DE60116757D1 (de) | 2006-04-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5980843B2 (ja) | 渦電流監視システムと光学監視システムとを有する研磨制御方法及び装置 | |
US6869332B2 (en) | Chemical mechanical polishing of a metal layer with polishing rate monitoring | |
US7008297B2 (en) | Combined eddy current sensing and optical monitoring for chemical mechanical polishing | |
JP4163516B2 (ja) | 光学および渦電流モニタリングによる統合終点検出システム | |
US6975107B2 (en) | Eddy current sensing of metal removal for chemical mechanical polishing | |
JP2013518440A (ja) | 高感度実時間形状制御渦電流モニタシステム | |
US6991516B1 (en) | Chemical mechanical polishing with multi-stage monitoring of metal clearing | |
EP1618991B1 (en) | Polishing pad |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131211 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140114 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140317 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140320 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140513 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140516 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140613 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150507 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150518 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150616 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150708 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5778110 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |