KR100827871B1 - 화학 기계 폴리싱을 위한 인시츄 방식의 엔드포인트 검출및 공정 모니터링 방법 및 장치 - Google Patents

화학 기계 폴리싱을 위한 인시츄 방식의 엔드포인트 검출및 공정 모니터링 방법 및 장치 Download PDF

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Publication number
KR100827871B1
KR100827871B1 KR1020027015632A KR20027015632A KR100827871B1 KR 100827871 B1 KR100827871 B1 KR 100827871B1 KR 1020027015632 A KR1020027015632 A KR 1020027015632A KR 20027015632 A KR20027015632 A KR 20027015632A KR 100827871 B1 KR100827871 B1 KR 100827871B1
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KR
South Korea
Prior art keywords
polishing
substrate
delete delete
chemical mechanical
monitoring system
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Application number
KR1020027015632A
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English (en)
Korean (ko)
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KR20030001529A (ko
Inventor
히로지 하나와
닐스 조한슨
보구스로 에이. 스웨덱
마누쳐 비랑
프리츠 씨. 레데커
라지브 바자
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from US09/574,008 external-priority patent/US6924641B1/en
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20030001529A publication Critical patent/KR20030001529A/ko
Application granted granted Critical
Publication of KR100827871B1 publication Critical patent/KR100827871B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020027015632A 2000-05-19 2001-05-18 화학 기계 폴리싱을 위한 인시츄 방식의 엔드포인트 검출및 공정 모니터링 방법 및 장치 KR100827871B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US09/574,008 2000-05-19
US09/574,008 US6924641B1 (en) 2000-05-19 2000-05-19 Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US21722800P 2000-07-10 2000-07-10
US60/217,228 2000-07-10
US22166800P 2000-07-27 2000-07-27
US60/221,668 2000-07-27
PCT/US2001/016290 WO2001089765A1 (en) 2000-05-19 2001-05-18 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
KR20030001529A KR20030001529A (ko) 2003-01-06
KR100827871B1 true KR100827871B1 (ko) 2008-05-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027015632A KR100827871B1 (ko) 2000-05-19 2001-05-18 화학 기계 폴리싱을 위한 인시츄 방식의 엔드포인트 검출및 공정 모니터링 방법 및 장치

Country Status (7)

Country Link
EP (1) EP1294534B2 (ja)
JP (4) JP5542293B2 (ja)
KR (1) KR100827871B1 (ja)
AT (1) ATE315980T1 (ja)
DE (3) DE60132385T2 (ja)
TW (1) TW496812B (ja)
WO (1) WO2001089765A1 (ja)

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JP4319692B2 (ja) 2007-09-03 2009-08-26 株式会社東京精密 研磨終了時点の予測・検出方法とその装置並びにリアルタイム膜厚モニタ方法とその装置
JP5495493B2 (ja) * 2008-02-07 2014-05-21 株式会社東京精密 膜厚測定装置、及び膜厚測定方法
DE102008021569A1 (de) 2008-04-30 2009-11-05 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals
JP5513795B2 (ja) * 2009-07-16 2014-06-04 株式会社荏原製作所 研磨方法および装置
JP5513821B2 (ja) * 2009-09-17 2014-06-04 株式会社荏原製作所 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法
US9023667B2 (en) * 2011-04-27 2015-05-05 Applied Materials, Inc. High sensitivity eddy current monitoring system
US9308618B2 (en) 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
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TW201710029A (zh) 2015-09-01 2017-03-16 Ebara Corp 渦電流檢測器
JP6779633B2 (ja) 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
CN106985059B (zh) * 2017-04-27 2018-12-28 厦门大学 一种空心球体内外球面研抛方法及装置
CN107520740A (zh) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种化学机械抛光中光谱终点的检测方法、装置及系统
TWI689081B (zh) 2018-10-02 2020-03-21 華邦電子股份有限公司 非揮發性記憶體裝置的製造方法
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US5355083A (en) * 1988-11-16 1994-10-11 Measurex Corporation Non-contact sensor and method using inductance and laser distance measurements for measuring the thickness of a layer of material overlaying a substrate
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Also Published As

Publication number Publication date
DE60116757T2 (de) 2006-07-27
JP5980843B2 (ja) 2016-08-31
JP5778110B2 (ja) 2015-09-16
JP6041833B2 (ja) 2016-12-14
JP2014209643A (ja) 2014-11-06
DE60116757T4 (de) 2007-01-18
EP1294534A1 (en) 2003-03-26
ATE315980T1 (de) 2006-02-15
DE60132385T2 (de) 2008-05-15
DE60132385D1 (de) 2008-02-21
TW496812B (en) 2002-08-01
JP2013058762A (ja) 2013-03-28
EP1294534B1 (en) 2006-01-18
JP2003534649A (ja) 2003-11-18
WO2001089765A1 (en) 2001-11-29
KR20030001529A (ko) 2003-01-06
JP5542293B2 (ja) 2014-07-09
JP2014208401A (ja) 2014-11-06
EP1294534B2 (en) 2006-01-25
DE60116757D1 (de) 2006-04-06

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