JP5542293B2 - 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 - Google Patents
化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 Download PDFInfo
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- JP5542293B2 JP5542293B2 JP2001585991A JP2001585991A JP5542293B2 JP 5542293 B2 JP5542293 B2 JP 5542293B2 JP 2001585991 A JP2001585991 A JP 2001585991A JP 2001585991 A JP2001585991 A JP 2001585991A JP 5542293 B2 JP5542293 B2 JP 5542293B2
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- polishing
- substrate
- polishing pad
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- magnetic core
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Description
Claims (14)
- 化学機械研磨装置であって、
研磨パッドを支持する頂面を有するプラテンであって、前記頂面が凹部を有する、プラテンと、
研磨パッドであって、研磨面と、該研磨面と反対側の裏面と、研磨パッドの該裏面に形成された凹部であって、前記プラテンの前記凹部の上にある凹部とを有し、研磨パッドの前記凹部は研磨パッドを全体的でなく部分的に通過し、前記研磨面を備え細孔を有するポリウレタン層を含む、研磨パッドと、
基板の導体層を研磨面に当接して保持するためのキャリアと、
前記研磨パッドの裏面側に配置された磁心であって、前記プラテンの前記凹部内に位置する部分と該研磨パッドの裏面の凹部内に延びる部分を含む磁心と、前記研磨パッドの裏面側に配置されて磁心に結合された少なくとも1つのインダクタと、交流電流をコイルに誘導して交番磁界を生成するために、前記少なくとも1つのインダクタに電気的に結合された発振器と、を含む渦電流センサであって、研磨中に交番磁界が基板の導体層内に延びるように前記磁心が配置された渦電流センサと、
前記研磨パッド及びキャリヤヘッドの少なくとも一方に接続されて前記研磨パッド及びキャリヤヘッド間に相対運動を生じさせるモータと、
を備える化学機械研磨装置。
- 前記少なくとも1つのインダクタは、前記プラテンの頂面にある前記凹部内に位置決めされている、請求項1の装置。
- 前記プラテンは回転する、請求項1の装置。
- 前記プラテンの角位置を測定する位置センサと、前記少なくとも1つのインダクタが前記基板の近くに位置決めされたときに前記渦電流センサからデータをサンプリングするコントローラとを更に備える、請求項3の装置。
- 前記細孔を有するポリウレタン層は被覆層であり、前記研磨パッドは、研磨パッドの前記基板とは反対側にある裏当て層とを含み、前記凹部は、該裏当て層の一部を除去することにより形成されている、請求項1の装置。
- 前記渦電流センサは、前記研磨パッドにある前記凹部の近くに位置決めされた2つの極を有する磁心を含み、前記少なくとも1つのインダクタは、前記磁心の第1部分に巻回されている、請求項1の装置。
- 前記渦電流センサは、磁心を含み、前記少なくとも1つのインダクタは、前記磁心の第1部分に巻回された第1インダクタと、前記磁心の第2部分に巻回された第2インダクタとを含む、請求項1の装置。
- 前記発振器は、前記基板が前記磁心に近接していないときに共振周波数をもたらすように選択された周波数をもつ交流電流を誘導する、請求項1の装置。
- 前記渦電流センサから出力信号を受ける終点検出システムを更に備え、該終点検出システムは、前記出力信号が所定のスレッショルドを超えれば研磨終点の信号を送るように構成されている、請求項1の装置。
- 研磨パッドで基板を研磨する工程中に基板にある導体層の厚さを監視する方法であって、
プラテンの頂面に研磨パッドを支持するステップであって、前記プラテンの前記頂面が凹部を有し、前記研磨パッドは研磨面と、該研磨面と反対側の裏面と、前記研磨パッドの該裏面に形成された凹部であって、前記プラテンの前記凹部の上にある凹部とを有し、前記研磨パッドの前記凹部は研磨パッドを全体的でなく部分的に通過し、前記研磨パッドは前記研磨面を備え細孔を有するポリウレタン層を含む、ステップと、
基板を、前記研磨パッドの研磨面上に位置決めするステップと、
前記研磨パッドの裏面の側に位置する磁心に交番磁界を生成するステップであって、前記磁心は前記プラテンの前記凹部に位置決めされた部分と前記研磨パッドの裏面にある前記凹部内に延びる部分を含み、研磨される前記基板の前記導体層に渦電流を誘導するために、該交番磁界は、前記磁心に結合され、かつ、前記研磨パッドの裏面の側に位置決めされたインダクタから研磨面を通過して延びるように生成された、ステップと、
前記導体層の厚さの変化により生じる前記交番磁界の変化を検出するステップと、
を含む、方法。
- インダクタから交番磁界を生成するステップは、第1周波数で発振器により第1コイルを駆動することを含む、請求項10の方法。
- 前記第1周波数は、前記基板が前記磁界の近くに存在しないときの共振周波数である、請求項11の方法。
- 前記交番磁界の変化を検出するステップは、第2コイルにより前記交流磁界を検出することを含む、請求項11の方法。
- 前記第1コイルは、磁心の第1部分に巻回されており、前記第2コイルは、前記磁心の第2部分に巻回されている、請求項13の方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/574,008 US6924641B1 (en) | 2000-05-19 | 2000-05-19 | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
US09/574,008 | 2000-05-19 | ||
US21722800P | 2000-07-10 | 2000-07-10 | |
US60/217,228 | 2000-07-10 | ||
US22166800P | 2000-07-27 | 2000-07-27 | |
US60/221,668 | 2000-07-27 | ||
PCT/US2001/016290 WO2001089765A1 (en) | 2000-05-19 | 2001-05-18 | In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012221417A Division JP5778110B2 (ja) | 2000-05-19 | 2012-10-03 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
Publications (3)
Publication Number | Publication Date |
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JP2003534649A JP2003534649A (ja) | 2003-11-18 |
JP2003534649A5 JP2003534649A5 (ja) | 2006-07-20 |
JP5542293B2 true JP5542293B2 (ja) | 2014-07-09 |
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JP2001585991A Expired - Fee Related JP5542293B2 (ja) | 2000-05-19 | 2001-05-18 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
JP2012221417A Expired - Lifetime JP5778110B2 (ja) | 2000-05-19 | 2012-10-03 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
JP2014121990A Expired - Lifetime JP5980843B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視システムと光学監視システムとを有する研磨制御方法及び装置 |
JP2014121991A Expired - Lifetime JP6041833B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視用研磨パッド |
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JP2012221417A Expired - Lifetime JP5778110B2 (ja) | 2000-05-19 | 2012-10-03 | 化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置 |
JP2014121990A Expired - Lifetime JP5980843B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視システムと光学監視システムとを有する研磨制御方法及び装置 |
JP2014121991A Expired - Lifetime JP6041833B2 (ja) | 2000-05-19 | 2014-06-13 | 渦電流監視用研磨パッド |
Country Status (7)
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EP (1) | EP1294534B2 (ja) |
JP (4) | JP5542293B2 (ja) |
KR (1) | KR100827871B1 (ja) |
AT (1) | ATE315980T1 (ja) |
DE (3) | DE60116757T4 (ja) |
TW (1) | TW496812B (ja) |
WO (1) | WO2001089765A1 (ja) |
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US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6162368A (en) * | 1998-06-13 | 2000-12-19 | Applied Materials, Inc. | Technique for chemical mechanical polishing silicon |
JP3907414B2 (ja) * | 2000-01-17 | 2007-04-18 | 株式会社荏原製作所 | ポリッシング装置 |
JP3916375B2 (ja) * | 2000-06-02 | 2007-05-16 | 株式会社荏原製作所 | ポリッシング方法および装置 |
-
2001
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- 2001-05-18 KR KR1020027015632A patent/KR100827871B1/ko active IP Right Grant
- 2001-05-18 AT AT01937595T patent/ATE315980T1/de not_active IP Right Cessation
- 2001-05-18 DE DE60116757A patent/DE60116757D1/de not_active Expired - Lifetime
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI689081B (zh) * | 2018-10-02 | 2020-03-21 | 華邦電子股份有限公司 | 非揮發性記憶體裝置的製造方法 |
US10847525B2 (en) | 2018-10-02 | 2020-11-24 | Winbond Electronics Corp. | Method for manufacturing non-volatile memory device |
Also Published As
Publication number | Publication date |
---|---|
TW496812B (en) | 2002-08-01 |
DE60132385D1 (de) | 2008-02-21 |
WO2001089765A1 (en) | 2001-11-29 |
EP1294534B2 (en) | 2006-01-25 |
JP2003534649A (ja) | 2003-11-18 |
KR20030001529A (ko) | 2003-01-06 |
JP5778110B2 (ja) | 2015-09-16 |
ATE315980T1 (de) | 2006-02-15 |
JP2014208401A (ja) | 2014-11-06 |
JP6041833B2 (ja) | 2016-12-14 |
JP2013058762A (ja) | 2013-03-28 |
EP1294534B1 (en) | 2006-01-18 |
DE60116757D1 (de) | 2006-04-06 |
KR100827871B1 (ko) | 2008-05-07 |
DE60132385T2 (de) | 2008-05-15 |
DE60116757T2 (de) | 2006-07-27 |
JP2014209643A (ja) | 2014-11-06 |
DE60116757T4 (de) | 2007-01-18 |
EP1294534A1 (en) | 2003-03-26 |
JP5980843B2 (ja) | 2016-08-31 |
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