DE60116757T4 - Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges - Google Patents
Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges Download PDFInfo
- Publication number
- DE60116757T4 DE60116757T4 DE60116757T DE60116757T DE60116757T4 DE 60116757 T4 DE60116757 T4 DE 60116757T4 DE 60116757 T DE60116757 T DE 60116757T DE 60116757 T DE60116757 T DE 60116757T DE 60116757 T4 DE60116757 T4 DE 60116757T4
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- substrate
- monitoring system
- signal
- inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US574008 | 1995-12-18 | ||
US09/574,008 US6924641B1 (en) | 2000-05-19 | 2000-05-19 | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
US21722800P | 2000-07-10 | 2000-07-10 | |
US217228P | 2000-07-10 | ||
US22166800P | 2000-07-27 | 2000-07-27 | |
US221668P | 2000-07-27 | ||
PCT/US2001/016290 WO2001089765A1 (en) | 2000-05-19 | 2001-05-18 | In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60116757T2 DE60116757T2 (de) | 2006-07-27 |
DE60116757T4 true DE60116757T4 (de) | 2007-01-18 |
Family
ID=27396396
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60116757T Expired - Lifetime DE60116757T4 (de) | 2000-05-19 | 2001-05-18 | Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges |
DE60116757A Expired - Lifetime DE60116757D1 (de) | 2000-05-19 | 2001-05-18 | Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges |
DE60132385T Expired - Lifetime DE60132385T2 (de) | 2000-05-19 | 2001-05-18 | Polierkissen |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60116757A Expired - Lifetime DE60116757D1 (de) | 2000-05-19 | 2001-05-18 | Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges |
DE60132385T Expired - Lifetime DE60132385T2 (de) | 2000-05-19 | 2001-05-18 | Polierkissen |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1294534B2 (ja) |
JP (4) | JP5542293B2 (ja) |
KR (1) | KR100827871B1 (ja) |
AT (1) | ATE315980T1 (ja) |
DE (3) | DE60116757T4 (ja) |
TW (1) | TW496812B (ja) |
WO (1) | WO2001089765A1 (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US7374477B2 (en) * | 2002-02-06 | 2008-05-20 | Applied Materials, Inc. | Polishing pads useful for endpoint detection in chemical mechanical polishing |
US6608495B2 (en) | 2001-03-19 | 2003-08-19 | Applied Materials, Inc. | Eddy-optic sensor for object inspection |
US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
US6811466B1 (en) | 2001-12-28 | 2004-11-02 | Applied Materials, Inc. | System and method for in-line metal profile measurement |
TWI273947B (en) * | 2002-02-06 | 2007-02-21 | Applied Materials Inc | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
DE10310262A1 (de) | 2002-03-28 | 2003-10-23 | Esec Trading Sa | Einrichtung für die Montage von Halbleiterchips |
EP1349199A1 (de) * | 2002-03-28 | 2003-10-01 | Esec Trading S.A. | Einrichtung für die Montage von Halbleiterchips |
US7205166B2 (en) * | 2002-06-28 | 2007-04-17 | Lam Research Corporation | Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties |
US7112961B2 (en) * | 2002-12-13 | 2006-09-26 | Applied Materials, Inc. | Method and apparatus for dynamically measuring the thickness of an object |
US6788050B2 (en) * | 2002-12-23 | 2004-09-07 | Lam Research Corp. | System, method and apparatus for thin-film substrate signal separation using eddy current |
KR100902893B1 (ko) * | 2003-01-13 | 2009-06-16 | 엘지전자 주식회사 | 광디스크 표면의 기계적 내구성 검사 장치 및 방법 |
US7008296B2 (en) * | 2003-06-18 | 2006-03-07 | Applied Materials, Inc. | Data processing for monitoring chemical mechanical polishing |
JP2005051076A (ja) * | 2003-07-29 | 2005-02-24 | Trecenti Technologies Inc | 半導体装置の製造方法 |
US7112960B2 (en) | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
KR100947230B1 (ko) | 2003-09-16 | 2010-03-11 | 엘지전자 주식회사 | 광디스크 표면의 기계적 내구성 검사 장치 및 방법 |
EP1758711B1 (en) * | 2004-06-21 | 2013-08-07 | Ebara Corporation | Polishing apparatus and polishing method |
JP2006128563A (ja) * | 2004-11-01 | 2006-05-18 | Toyo Tire & Rubber Co Ltd | 半導体ウエハ研磨用研磨パッドおよび半導体デバイスの製造方法 |
JP2009026850A (ja) * | 2007-07-18 | 2009-02-05 | Elpida Memory Inc | Cmp装置及びcmpによるウェハー研磨方法 |
JP2009033038A (ja) * | 2007-07-30 | 2009-02-12 | Elpida Memory Inc | Cmp装置及びcmpによるウェハー研磨方法 |
JP4319692B2 (ja) | 2007-09-03 | 2009-08-26 | 株式会社東京精密 | 研磨終了時点の予測・検出方法とその装置並びにリアルタイム膜厚モニタ方法とその装置 |
JP5495493B2 (ja) * | 2008-02-07 | 2014-05-21 | 株式会社東京精密 | 膜厚測定装置、及び膜厚測定方法 |
DE102008021569A1 (de) * | 2008-04-30 | 2009-11-05 | Advanced Micro Devices, Inc., Sunnyvale | System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals |
JP5513795B2 (ja) * | 2009-07-16 | 2014-06-04 | 株式会社荏原製作所 | 研磨方法および装置 |
JP5513821B2 (ja) * | 2009-09-17 | 2014-06-04 | 株式会社荏原製作所 | 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法 |
US9023667B2 (en) * | 2011-04-27 | 2015-05-05 | Applied Materials, Inc. | High sensitivity eddy current monitoring system |
US9308618B2 (en) | 2012-04-26 | 2016-04-12 | Applied Materials, Inc. | Linear prediction for filtering of data during in-situ monitoring of polishing |
US9067295B2 (en) * | 2012-07-25 | 2015-06-30 | Applied Materials, Inc. | Monitoring retaining ring thickness and pressure control |
US9205527B2 (en) * | 2012-11-08 | 2015-12-08 | Applied Materials, Inc. | In-situ monitoring system with monitoring of elongated region |
US9636797B2 (en) * | 2014-02-12 | 2017-05-02 | Applied Materials, Inc. | Adjusting eddy current measurements |
JP6423600B2 (ja) * | 2014-03-12 | 2018-11-14 | 株式会社荏原製作所 | 膜厚測定装置、及び、研磨装置 |
TW201710029A (zh) | 2015-09-01 | 2017-03-16 | Ebara Corp | 渦電流檢測器 |
JP6779633B2 (ja) | 2016-02-23 | 2020-11-04 | 株式会社荏原製作所 | 研磨装置 |
CN106985059B (zh) * | 2017-04-27 | 2018-12-28 | 厦门大学 | 一种空心球体内外球面研抛方法及装置 |
CN107520740A (zh) * | 2017-09-18 | 2017-12-29 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种化学机械抛光中光谱终点的检测方法、装置及系统 |
TWI689081B (zh) * | 2018-10-02 | 2020-03-21 | 華邦電子股份有限公司 | 非揮發性記憶體裝置的製造方法 |
CN113543932A (zh) * | 2019-02-28 | 2021-10-22 | 应用材料公司 | 通过调整背层中的润湿来控制化学机械抛光垫刚度 |
US20240139905A1 (en) * | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Carrier head acoustic monitoring with sensor in platen |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4005359A (en) * | 1975-11-07 | 1977-01-25 | Smoot William N | Resonant frequency measuring device for gauging coating thickness |
JPS5842902A (ja) * | 1981-09-08 | 1983-03-12 | Toyo Seikan Kaisha Ltd | プレスの打抜き不良検出装置 |
US4829251A (en) * | 1983-08-31 | 1989-05-09 | Helmut Fischer | Electromagnetic probe for measuring the thickness of thin coatings on magnetic substrates |
JPS63212804A (ja) * | 1987-02-28 | 1988-09-05 | Sumitomo Metal Ind Ltd | 膜厚測定方法 |
US5355083A (en) * | 1988-11-16 | 1994-10-11 | Measurex Corporation | Non-contact sensor and method using inductance and laser distance measurements for measuring the thickness of a layer of material overlaying a substrate |
DE4002083A1 (de) * | 1990-01-25 | 1991-08-01 | Hoechst Ag | Flaechen- oder schlauchfoermige folie auf basis von cellulosehydrat |
JP3431115B2 (ja) * | 1995-03-28 | 2003-07-28 | アプライド マテリアルズ インコーポレイテッド | ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法 |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5559428A (en) * | 1995-04-10 | 1996-09-24 | International Business Machines Corporation | In-situ monitoring of the change in thickness of films |
US5660672A (en) * | 1995-04-10 | 1997-08-26 | International Business Machines Corporation | In-situ monitoring of conductive films on semiconductor wafers |
US5644221A (en) * | 1996-03-19 | 1997-07-01 | International Business Machines Corporation | Endpoint detection for chemical mechanical polishing using frequency or amplitude mode |
JP3303963B2 (ja) * | 1997-01-20 | 2002-07-22 | 株式会社東京精密 | ウェーハの厚み加工量測定装置 |
JP2973404B2 (ja) * | 1997-07-11 | 1999-11-08 | 株式会社東京精密 | ウェーハ研磨装置 |
JP3001051B2 (ja) * | 1997-08-22 | 2000-01-17 | 日本電気株式会社 | 半導体ウェハ研磨終点検出装置 |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6162368A (en) * | 1998-06-13 | 2000-12-19 | Applied Materials, Inc. | Technique for chemical mechanical polishing silicon |
JP3907414B2 (ja) * | 2000-01-17 | 2007-04-18 | 株式会社荏原製作所 | ポリッシング装置 |
JP3916375B2 (ja) * | 2000-06-02 | 2007-05-16 | 株式会社荏原製作所 | ポリッシング方法および装置 |
-
2001
- 2001-05-18 DE DE60116757T patent/DE60116757T4/de not_active Expired - Lifetime
- 2001-05-18 AT AT01937595T patent/ATE315980T1/de not_active IP Right Cessation
- 2001-05-18 DE DE60116757A patent/DE60116757D1/de not_active Expired - Lifetime
- 2001-05-18 KR KR1020027015632A patent/KR100827871B1/ko active IP Right Grant
- 2001-05-18 WO PCT/US2001/016290 patent/WO2001089765A1/en active IP Right Grant
- 2001-05-18 DE DE60132385T patent/DE60132385T2/de not_active Expired - Lifetime
- 2001-05-18 JP JP2001585991A patent/JP5542293B2/ja not_active Expired - Fee Related
- 2001-05-18 EP EP01937595A patent/EP1294534B2/en not_active Expired - Lifetime
- 2001-08-06 TW TW090112035A patent/TW496812B/zh not_active IP Right Cessation
-
2012
- 2012-10-03 JP JP2012221417A patent/JP5778110B2/ja not_active Expired - Lifetime
-
2014
- 2014-06-13 JP JP2014121991A patent/JP6041833B2/ja not_active Expired - Lifetime
- 2014-06-13 JP JP2014121990A patent/JP5980843B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2014209643A (ja) | 2014-11-06 |
DE60132385T2 (de) | 2008-05-15 |
JP6041833B2 (ja) | 2016-12-14 |
EP1294534B2 (en) | 2006-01-25 |
KR100827871B1 (ko) | 2008-05-07 |
JP2013058762A (ja) | 2013-03-28 |
JP2003534649A (ja) | 2003-11-18 |
DE60116757T2 (de) | 2006-07-27 |
TW496812B (en) | 2002-08-01 |
EP1294534B1 (en) | 2006-01-18 |
EP1294534A1 (en) | 2003-03-26 |
JP5980843B2 (ja) | 2016-08-31 |
JP5542293B2 (ja) | 2014-07-09 |
KR20030001529A (ko) | 2003-01-06 |
JP2014208401A (ja) | 2014-11-06 |
JP5778110B2 (ja) | 2015-09-16 |
DE60132385D1 (de) | 2008-02-21 |
DE60116757D1 (de) | 2006-04-06 |
ATE315980T1 (de) | 2006-02-15 |
WO2001089765A1 (en) | 2001-11-29 |
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