JP5776780B2 - Rfidタグ - Google Patents
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- JP5776780B2 JP5776780B2 JP2013536394A JP2013536394A JP5776780B2 JP 5776780 B2 JP5776780 B2 JP 5776780B2 JP 2013536394 A JP2013536394 A JP 2013536394A JP 2013536394 A JP2013536394 A JP 2013536394A JP 5776780 B2 JP5776780 B2 JP 5776780B2
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- 239000002184 metal Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000003566 sealing material Substances 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 22
- 229910001220 stainless steel Inorganic materials 0.000 claims description 17
- 239000010935 stainless steel Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000005672 electromagnetic field Effects 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 claims 2
- 101100328086 Caenorhabditis elegans cla-1 gene Proteins 0.000 description 35
- 238000004891 communication Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Description
アンテナ20の設計は、アンテナ線の形状、線の太さ、線の長さ、などによって決まる共振周波数を指標とする。この共振周波数を、使用するICチップ30の動作周波数に近づけることによって、リーダライタからの電力をアンテナ20が受け取り、ICチップ30に伝えて、ICチップ30が動作する。
リーダライタはLS産電株式会社製 UI−9061(出力1W)を用いた。リーダライタの読取り部を中心として、周囲25cm四方に障害物がない状態で、RFIDタグ80の読取り評価を行った。リーダライタでRFIDタグ80を読取れる時の、リーダライタ読取り部からRFIDタグ80までの最大距離(以後、読み取り距離という)を測定した。なおこのとき使用したICチップの大きさは0.5mm×0.5mm×0.1mm程度、静電容量は0.77pF、動作周波数は0.86〜0.96GHz付近である。
10 封止材
20 アンテナ
30 ICチップ
40 ワイヤボンディングのワイヤ
50 コイル(アンテナ)
60 コンデンサ(ICチップ)
70 抵抗(ICチップ。シミュレーション時に設定するポート)
80 RFIDタグ
90 ステンレス板
100 レジスト
Claims (19)
- 単層のアンテナと、前記アンテナに重ならないようにワイヤボンディングで接続された大きさが0.6mm□以下のICチップと、このICチップおよび前記アンテナを封止する封止材とを有し、
前記アンテナが、前記ICチップの外周部に配置され、間隙を有して隣接する構成成分を含むコイルアンテナであり、前記アンテナの間隙には前記封止材が配置されており、
前記アンテナが、断面視で、きのこのように傘を有しており、
前記アンテナの導線幅に対する導線間距離が0.2mm対0.2mm〜0.05mm対0.05mmの範囲であり、
前記アンテナのインダクタンスLと前記ICチップの静電容量Cとを含めて形成される電気回路の電磁界シミュレータによる共振周波数f0が、ICチップの動作周波数またはその付近であり、
前記間隙を有して隣接するアンテナの構成部分の間に容量成分が生じ、さらに前記アンテナの間隙に配置された前記封止材の比誘電率が寄与することにより、前記間隙を有して隣接するアンテナの構成部分が静電容量を提供し、前記ICチップとこの外周部に配置されるアンテナとを有する構成全体の実質的な静電容量を、前記ICチップ単体の静電容量よりも増加させるRFIDタグ。 - 単層のアンテナと、金属の層を介して配置され、前記アンテナにワイヤボンディング接続で電気的に接続された大きさが0.6mm□以下のICチップと、このICチップおよび前記アンテナを封止する封止材とを有し、
前記アンテナが、前記ICチップの外周部に配置され、間隙を有して隣接する構成成分を含むコイルアンテナであり、前記アンテナの間隙には前記封止材が配置されており、
前記アンテナが、断面視で、きのこのように傘を有しており、
前記アンテナの導線幅に対する導線間距離が0.2mm対0.2mm〜0.05mm対0.05mmの範囲であり、
前記アンテナのインダクタンスLと前記ICチップの静電容量Cとを含めて形成される電気回路の電磁界シミュレータによる共振周波数f0が、ICチップの動作周波数またはその付近であり、
前記間隙を有して隣接するアンテナの構成部分の間に容量成分が生じ、さらに前記アンテナの間隙に配置された前記封止材の比誘電率が寄与することにより、前記間隙を有して隣接するアンテナの構成部分が静電容量を提供し、前記ICチップとこの外周部に配置されるアンテナとを有する構成全体の実質的な静電容量を、前記ICチップ単体の静電容量よりも増加させるRFIDタグ。 - 請求項1〜3の何れかにおいて、
ICチップの動作周波数が0.86〜0.96GHzであり、アンテナのインダクタンスLとICチップの静電容量Cとを含めて形成される電気回路の共振周波数f0が、0.
2〜2GHzであるか、
または、ICチップの動作周波数が13.56MHzであり、前記共振周波数f0が1
3.56〜29MHzであるか、
または、ICチップの動作周波数が2.45GHzであり、前記共振周波数f0が2〜
2.45GHzであるRFIDタグ。 - 請求項1〜4の何れかにおいて、RFIDタグの大きさが、縦13mm以下、横13mm以下及び高さ1.0mm以下、または縦4mm以下、横4mm以下及び高さ0.4mm以下、または縦2.5mm以下、横2.5mm以下及び高さ0.3mm以下、または縦1.9mm以下、横1.9mm以下及び高さ0.3mm以下であるRFIDタグ。
- 請求項1〜5の何れかにおいて、動作周波数帯が13.56MHz〜2.48GHzであるRFIDタグ。
- 請求項1〜6の何れかにおいて、動作周波数帯が0.86〜0.96GHzであるRFIDタグ。
- 請求項1〜7の何れかにおいて、封止材の比誘電率が2.6以上であるRFIDタグ。
- 請求項1〜8の何れかにおいて、エポキシと炭素とシリカを主成分とした封止材を用いることで耐熱性を向上させたRFIDタグ。
- 請求項1〜9の何れかにおいて、ステンレス板上にレジストでパターンを形成し、めっきによってレジストがない部分に金属の層又はアンテナとなる金属を形成し、レジスト剥離後にICチップを搭載して前記金属とICチップを電気的に接続し、前記金属と前記ICチップを封止材によって封止し、ステンレス板のみを剥がすことによって得る、アンテナと、このアンテナに接続されたICチップと、このICチップおよび前記アンテナを封止する封止材とを有するRFIDタグ。
- 請求項10において、金属がニッケルを主成分とする金属であるRFIDタグ。
- 請求項10または11において、めっきにより形成された金属が、RFIDタグ表層側よりも中心側の方が太いRFIDタグ。
- 請求項1〜12の何れかにおいて、金属が表面に露出しているRFIDタグ。
- 請求項13に記載のRFIDタグを共に封止することで、RFIDタグの金属が表面に露出していない半導体パッケージ。
- ステンレス板上にレジストでパターンを形成し、めっきによってレジストがない部分に金属の層又はアンテナとなる金属を形成し、レジスト剥離後にICチップを搭載して前記金属とICチップを電気的に接続し、前記金属と前記ICチップを封止材によって封止し、ステンレス板のみを剥がすことによって得る、アンテナと、このアンテナに接続されたICチップと、このICチップおよびアンテナを封止する封止材とを有する請求項1〜10の何れかに記載のRFIDタグの製造方法。
- 請求項15において、金属がニッケルを主成分とする金属であるRFIDタグの製造方法。
- 請求項15または16において、めっきにより形成された金属が、RFIDタグ表層側よりも中心側の方が太いRFIDタグの製造方法。
- 請求項15〜17の何れかにおいて、金属が封止材の表面に露出しているRFIDタグの製造方法。
- 請求項18において、金属が封止材の表面に露出したRFIDタグを共に封止することで、RFIDタグの金属が表面に露出していない半導体パッケージの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013536394A JP5776780B2 (ja) | 2011-09-30 | 2012-09-27 | Rfidタグ |
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JP4826195B2 (ja) | 2005-09-30 | 2011-11-30 | 大日本印刷株式会社 | Rfidタグ |
JP2008165678A (ja) * | 2007-01-04 | 2008-07-17 | Lintec Corp | Icチップ実装用接続体、アンテナ回路、icインレット、icタグ及び静電容量調整方法 |
JP2010152449A (ja) | 2008-12-24 | 2010-07-08 | Rhythm Watch Co Ltd | Rfidタグ |
JP5403353B2 (ja) | 2009-11-11 | 2014-01-29 | 日立化成株式会社 | Rfidタグの製造方法 |
JP5344000B2 (ja) * | 2011-05-09 | 2013-11-13 | 大日本印刷株式会社 | 接触非接触両用icモジュール及びicカード |
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US20140224887A1 (en) | 2014-08-14 |
US9171244B2 (en) | 2015-10-27 |
KR101609959B1 (ko) | 2016-04-06 |
CN104025126B (zh) | 2017-08-18 |
TW201322139A (zh) | 2013-06-01 |
KR20140068209A (ko) | 2014-06-05 |
TWI564811B (zh) | 2017-01-01 |
WO2013047680A1 (ja) | 2013-04-04 |
CN104025126A (zh) | 2014-09-03 |
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