JP5775797B2 - 研磨装置および方法 - Google Patents

研磨装置および方法 Download PDF

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Publication number
JP5775797B2
JP5775797B2 JP2011245482A JP2011245482A JP5775797B2 JP 5775797 B2 JP5775797 B2 JP 5775797B2 JP 2011245482 A JP2011245482 A JP 2011245482A JP 2011245482 A JP2011245482 A JP 2011245482A JP 5775797 B2 JP5775797 B2 JP 5775797B2
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JP
Japan
Prior art keywords
polishing
gas
polishing pad
pad
gas injection
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Active
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JP2011245482A
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English (en)
Japanese (ja)
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JP2013099828A5 (enExample
JP2013099828A (ja
Inventor
本島　靖之
靖之 本島
丸山　徹
徹 丸山
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Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2011245482A priority Critical patent/JP5775797B2/ja
Priority to TW101121073A priority patent/TWI548483B/zh
Priority to TW105108955A priority patent/TWI565559B/zh
Priority to TW104130916A priority patent/TWI613037B/zh
Priority to US13/548,361 priority patent/US9579768B2/en
Priority to KR1020120077695A priority patent/KR101624379B1/ko
Publication of JP2013099828A publication Critical patent/JP2013099828A/ja
Publication of JP2013099828A5 publication Critical patent/JP2013099828A5/ja
Priority to US14/696,908 priority patent/US9969046B2/en
Application granted granted Critical
Publication of JP5775797B2 publication Critical patent/JP5775797B2/ja
Priority to KR1020150131667A priority patent/KR101796355B1/ko
Priority to US15/946,843 priority patent/US10259098B2/en
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2011245482A 2011-07-19 2011-11-09 研磨装置および方法 Active JP5775797B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2011245482A JP5775797B2 (ja) 2011-11-09 2011-11-09 研磨装置および方法
TW101121073A TWI548483B (zh) 2011-07-19 2012-06-13 研磨裝置及方法
TW105108955A TWI565559B (zh) 2011-07-19 2012-06-13 研磨裝置及方法
TW104130916A TWI613037B (zh) 2011-07-19 2012-06-13 硏磨方法
US13/548,361 US9579768B2 (en) 2011-07-19 2012-07-13 Method and apparatus for polishing a substrate
KR1020120077695A KR101624379B1 (ko) 2011-07-19 2012-07-17 연마 장치 및 방법
US14/696,908 US9969046B2 (en) 2011-07-19 2015-04-27 Method and apparatus for polishing a substrate
KR1020150131667A KR101796355B1 (ko) 2011-07-19 2015-09-17 연마 방법
US15/946,843 US10259098B2 (en) 2011-07-19 2018-04-06 Method and apparatus for polishing a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011245482A JP5775797B2 (ja) 2011-11-09 2011-11-09 研磨装置および方法

Publications (3)

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JP2013099828A JP2013099828A (ja) 2013-05-23
JP2013099828A5 JP2013099828A5 (enExample) 2014-07-24
JP5775797B2 true JP5775797B2 (ja) 2015-09-09

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JP2011245482A Active JP5775797B2 (ja) 2011-07-19 2011-11-09 研磨装置および方法

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JP (1) JP5775797B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6313196B2 (ja) 2014-11-20 2018-04-18 株式会社荏原製作所 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法
KR101700869B1 (ko) * 2015-03-12 2017-01-31 주식회사 케이씨텍 화학 기계적 연마 장치 및 이에 사용되는 온도조절패드
JP6717691B2 (ja) * 2016-07-06 2020-07-01 株式会社荏原製作所 基板処理装置
KR102232984B1 (ko) * 2017-03-02 2021-03-29 주식회사 케이씨텍 화학 기계적 연마장치
JP6882017B2 (ja) * 2017-03-06 2021-06-02 株式会社荏原製作所 研磨方法、研磨装置、および基板処理システム
JP6923342B2 (ja) 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7162465B2 (ja) * 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7083722B2 (ja) 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
TWI838459B (zh) * 2019-02-20 2024-04-11 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
CN109759957A (zh) * 2019-02-21 2019-05-17 中国工程物理研究院激光聚变研究中心 环抛中抛光液的循环供液装置及供液方法
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
CN112405331A (zh) * 2019-08-22 2021-02-26 长鑫存储技术有限公司 晶圆研磨装置
JP7663468B2 (ja) * 2021-04-28 2025-04-16 株式会社荏原製作所 研磨装置、および研磨方法
JP2025099046A (ja) 2023-12-21 2025-07-03 株式会社荏原製作所 非接触パッド洗浄装置
JP2025145681A (ja) * 2024-03-22 2025-10-03 株式会社荏原製作所 研磨方法および研磨装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5354384A (en) * 1993-04-30 1994-10-11 Hughes Aircraft Company Method for cleaning surface by heating and a stream of snow
US6338669B1 (en) * 1997-12-26 2002-01-15 Ebara Corporation Polishing device
TW434113B (en) * 1999-03-16 2001-05-16 Applied Materials Inc Polishing apparatus
US6283840B1 (en) * 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
JP2002118084A (ja) * 2000-10-11 2002-04-19 Ebara Corp 基板研磨方法
JP2002178260A (ja) * 2000-12-15 2002-06-25 Nec Kansai Ltd ポリッシング装置
JP2003133277A (ja) * 2001-10-30 2003-05-09 Ebara Corp 研磨装置の研磨面洗浄装置
JP2003142436A (ja) * 2001-10-31 2003-05-16 Internatl Business Mach Corp <Ibm> 研磨用スラリー供給装置及びその供給方法
JP2004066376A (ja) * 2002-08-05 2004-03-04 Nippei Toyama Corp 半導体ウエーハ研削盤のクーラント噴射装置およびその方法
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
JP2007168039A (ja) * 2005-12-22 2007-07-05 Ebara Corp 研磨テーブルの研磨面洗浄機構、及び研磨装置
JP4940959B2 (ja) * 2007-01-16 2012-05-30 ブラザー工業株式会社 ノズル
JP4902433B2 (ja) * 2007-06-13 2012-03-21 株式会社荏原製作所 研磨装置の研磨面加熱、冷却装置

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