JP5771937B2 - 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置 - Google Patents

樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置 Download PDF

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Publication number
JP5771937B2
JP5771937B2 JP2010230445A JP2010230445A JP5771937B2 JP 5771937 B2 JP5771937 B2 JP 5771937B2 JP 2010230445 A JP2010230445 A JP 2010230445A JP 2010230445 A JP2010230445 A JP 2010230445A JP 5771937 B2 JP5771937 B2 JP 5771937B2
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metal plate
resin
resin package
light emitting
emitting device
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JP2010230445A
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Japanese (ja)
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JP2012084724A5 (enExample
JP2012084724A (ja
Inventor
三木　倫英
倫英 三木
玉置　寛人
寛人 玉置
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2010230445A 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置 Active JP5771937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010230445A JP5771937B2 (ja) 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置

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Application Number Priority Date Filing Date Title
JP2010230445A JP5771937B2 (ja) 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置

Publications (3)

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JP2012084724A JP2012084724A (ja) 2012-04-26
JP2012084724A5 JP2012084724A5 (enExample) 2013-11-28
JP5771937B2 true JP5771937B2 (ja) 2015-09-02

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251422A (ja) * 2012-06-01 2013-12-12 Apic Yamada Corp Ｌｅｄチップ実装用基板、ｌｅｄパッケージ、金型、並びに、ｌｅｄチップ実装用基板及びｌｅｄパッケージの製造方法
JP6147976B2 (ja) * 2012-09-26 2017-06-14 ローム株式会社 発光装置、および、発光ユニットの製造方法
JP6484396B2 (ja) * 2013-06-28 2019-03-13 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
JP2015126091A (ja) * 2013-12-26 2015-07-06 大日本印刷株式会社 樹脂付リードフレームの製造方法、半導体装置の製造方法、射出成形金型装置および樹脂付リードフレーム
JP6398563B2 (ja) 2014-05-29 2018-10-03 日亜化学工業株式会社 発光装置
DE102014116370A1 (de) * 2014-11-10 2016-05-12 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Trägers und Verfahren zum Herstellen eines optoelektronischen Bauelements
JP6443429B2 (ja) * 2016-11-30 2018-12-26 日亜化学工業株式会社 パッケージ及びパッケージの製造方法、発光装置及び発光装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001674A (ja) * 2001-06-26 2003-01-08 Nec Kansai Ltd 樹脂モールド装置
JP2005317814A (ja) * 2004-04-30 2005-11-10 Renesas Technology Corp 半導体装置及びその製造方法
JP2008244143A (ja) * 2007-03-27 2008-10-09 Toshiba Corp 半導体発光装置の製造方法

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JP2012084724A (ja) 2012-04-26

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