JP5771937B2 - 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置 - Google Patents

樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置 Download PDF

Info

Publication number
JP5771937B2
JP5771937B2 JP2010230445A JP2010230445A JP5771937B2 JP 5771937 B2 JP5771937 B2 JP 5771937B2 JP 2010230445 A JP2010230445 A JP 2010230445A JP 2010230445 A JP2010230445 A JP 2010230445A JP 5771937 B2 JP5771937 B2 JP 5771937B2
Authority
JP
Japan
Prior art keywords
metal plate
resin
resin package
light emitting
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010230445A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012084724A (ja
JP2012084724A5 (enExample
Inventor
三木　倫英
倫英 三木
玉置　寛人
寛人 玉置
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2010230445A priority Critical patent/JP5771937B2/ja
Publication of JP2012084724A publication Critical patent/JP2012084724A/ja
Publication of JP2012084724A5 publication Critical patent/JP2012084724A5/ja
Application granted granted Critical
Publication of JP5771937B2 publication Critical patent/JP5771937B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2010230445A 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置 Active JP5771937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010230445A JP5771937B2 (ja) 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010230445A JP5771937B2 (ja) 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2012084724A JP2012084724A (ja) 2012-04-26
JP2012084724A5 JP2012084724A5 (enExample) 2013-11-28
JP5771937B2 true JP5771937B2 (ja) 2015-09-02

Family

ID=46243294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010230445A Active JP5771937B2 (ja) 2010-10-13 2010-10-13 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置

Country Status (1)

Country Link
JP (1) JP5771937B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251422A (ja) * 2012-06-01 2013-12-12 Apic Yamada Corp Ｌｅｄチップ実装用基板、ｌｅｄパッケージ、金型、並びに、ｌｅｄチップ実装用基板及びｌｅｄパッケージの製造方法
JP6147976B2 (ja) * 2012-09-26 2017-06-14 ローム株式会社 発光装置、および、発光ユニットの製造方法
JP6484396B2 (ja) * 2013-06-28 2019-03-13 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
JP2015126091A (ja) * 2013-12-26 2015-07-06 大日本印刷株式会社 樹脂付リードフレームの製造方法、半導体装置の製造方法、射出成形金型装置および樹脂付リードフレーム
JP6398563B2 (ja) * 2014-05-29 2018-10-03 日亜化学工業株式会社 発光装置
DE102014116370A1 (de) * 2014-11-10 2016-05-12 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Trägers und Verfahren zum Herstellen eines optoelektronischen Bauelements
JP6443429B2 (ja) * 2016-11-30 2018-12-26 日亜化学工業株式会社 パッケージ及びパッケージの製造方法、発光装置及び発光装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001674A (ja) * 2001-06-26 2003-01-08 Nec Kansai Ltd 樹脂モールド装置
JP2005317814A (ja) * 2004-04-30 2005-11-10 Renesas Technology Corp 半導体装置及びその製造方法
JP2008244143A (ja) * 2007-03-27 2008-10-09 Toshiba Corp 半導体発光装置の製造方法

Also Published As

Publication number Publication date
JP2012084724A (ja) 2012-04-26

Similar Documents

Publication Publication Date Title
JP5771937B2 (ja) 樹脂パッケージ及びその製造方法、樹脂パッケージを用いた発光装置
US8080436B2 (en) Light emitting device and method of manufacturing the light emitting device
CN100423306C (zh) 发光二极管封装的制造方法
JP4910220B1 (ja) Ｌｅｄモジュール装置及びその製造方法
US8994062B2 (en) LED module
CN100438111C (zh) 发光二极管封装结构的制作方法
JP4914998B1 (ja) Ｌｅｄモジュール装置及びその製造方法
US20090166664A1 (en) High power light emitting diode package and manufacturing method thereof
JP5940799B2 (ja) 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法
JP2011176017A (ja) 発光装置およびその製造方法
JP2010232644A (ja) 光半導体装置の製造方法
JP2016072524A (ja) 発光装置およびその製造方法
JP4904604B1 (ja) Ｌｅｄモジュール装置及びその製造方法
JP2014187081A (ja) 発光装置
CN102598324A (zh) 发光元件搭载用基板及其制造方法
KR20090072941A (ko) 고출력 ｌｅｄ 패키지 및 그 제조방법
JP6021416B2 (ja) 光半導体装置用リフレクタ付リードフレームおよびそれを用いた光半導体装置並びにその製造方法
JP5493549B2 (ja) 発光装置及びその製造方法
JP2012182357A (ja) Ｌｅｄ発光素子用リードフレーム基板、ｌｅｄ発光素子装置、およびｌｅｄ発光素子用リードフレーム
JP2006100753A (ja) 半導体モジュールおよびその製造方法
CN201017901Y (zh) 发光二极管的封装结构
JP5359662B2 (ja) 発光装置及びその製造方法
JP2013135077A (ja) 半導体パッケージ用基板、半導体パッケージ、およびそれらの製造方法
US10777719B2 (en) Base member, and method of manufacturing light emitting device using same
CN103682059B (zh) 发光二极管封装的前制程方法及其结构

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130904

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131010

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140423

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140704

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150312

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150602

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150615

R150 Certificate of patent or registration of utility model

Ref document number: 5771937

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250